Part: SN74LVC1G332DCK

Index Files Offer Index 12 SHARP, YAGEO, QUALCOMM, HIT, HARVATEK, AVAGO, KEMET, INTERSIL, COOPER, MOLEX, MICREL, ATI, ISD/NUVOTON, TDK, FUJITSU, AGILENT, HYNIX, ISSI, IDT, COILCRAFT, EUPEC, BOURNS, LITTELFUSE, SEIKO, TE, ELPIDA, CIRRUS, TRACO, SONY, EPCOS, MPS, SST, RECOM, LAMBDA, BB, CREE, AUO, IC, SILICON, EVERLIGHT, QFN, CJ(CHINA), EPSON, SIPEX, DIODES, IXYS, NXP/PHI, BB/TI, ASTEC, ALLEGRO, SPANSION, AOS, POWER, CONEXANT, TI , FTDI, MXIC, VICOR, TI, AD, ST, ALTERA, XILINX, NS, ATMEL, MAX, NXP, INTEL, SAMSUNG, MICROCHIP, CY, FSC, MURATA, PANASONIC, TOS, ON, AVX, IR, INFINEON, VISHAY, LINEAR, NVIDIA, FUJI, LATTICE, MICRON, BRIGHT, AMD, FREESCALE, MOT, 模块, PHI, BROADCOM, NEC, SEMIKRON, ROHM, SANYO, STMICROELECTRONICS, DALLAS, RENESAS, SHARP, YAGEO, QUALCOMM, HIT, MIT, HARVATEK, KEMET, AVAGO, COOPER, MOLEX, INTERSIL, MICREL, ATI, ISD/NUVOTON, TDK, AGILENT, ISSI, BOURNS, HYNIX, COILCRAFT, IDT, LITTELFUSE, FUJITSU, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, TRACO, CIRRUS, MPS, SONY, EPCOS, RECOM, SST, LAMBDA, EPSON, AUO, CREE, IC, BB, SILICON, EVERLIGHT, QFN, CJ(CHINA), NXP/PHI, DIODES, SIPEX, STACKPOLE TECHNOLOGY, INC., ASTEC, BB/TI, MXIC, POWER, AOS, SPANSION, TI , ALLEGRO, FTDI, IXYS, REALTEK, VICOR, TI, AD, ST, ALTERA, ATMEL, XILINX, NS, MAX, NXP, INTEL, SAMSUNG, MICROCHIP, CY, FSC, TOS, MURATA, ON, PANASONIC, IR, AVX, VISHAY, INFINEON, LINEAR, FREESCALE, NVIDIA, FUJI, MICRON, LATTICE, AMD, BRIGHT, MOT, PHI, NEC, BROADCOM, SANYO, ROHM, SEMIKRON, STMICROELECTRONICS, RENESAS, DALLAS, SHARP, YAGEO, INTERSIL, QUALCOMM, HIT, MIT, HARVATEK, KEMET, AVAGO, MOLEX, MICREL, COOPER, ATI, ISD/NUVOTON, TDK, ISSI, AGILENT, HYNIX, IDT, BOURNS, COILCRAFT, FUJITSU, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, CIRRUS, TRACO, MPS, POWER, AOS, SST, EPCOS, SONY, DIP, EPSON, SIPEX, RECOM, 模块, LAMBDA, EUPEC, AUO, IC, BB, CREE, QFN, SILICON, EVERLIGHT, SPANSION, CJ(CHINA), DIODES, NXP/PHI, STACKPOLE TECHNOLOGY, INC., MXIC, ASTEC, BB/TI, WINBOND, ALLEGRO, TI , FTDI, TI, ST, AD, ALTERA, ATMEL, XILINX, NS, MAX, NXP, INTEL, SAMSUNG, MICROCHIP, CY, FSC, TOS, MURATA, ON, PANASONIC, VISHAY, INFINEON, AVX, FUJI, IR, MICRON, LINEAR, FREESCALE, NVIDIA, LATTICE, SEMIKRON, MOT, BRIGHT, AMD, NEC, PHI, SANYO, ROHM, BROADCOM, STMICROELECTRONICS, RENESAS, SHARP, DALLAS, YAGEO, INTERSIL, HIT, QUALCOMM, MIT, AVAGO, HARVATEK, KEMET, MOLEX, COOPER, MICREL, ATI, ISD/NUVOTON, ISSI, TDK, AGILENT, HYNIX, IDT, BOURNS, COILCRAFT, FUJITSU, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, CIRRUS, TRACO, MPS, AOS, EPCOS, POWER, DIP, LAMBDA, SIPEX, RECOM, 模块, EUPEC, BB/TI, SST, AUO, CREE, IC, EVERLIGHT, QFN, SILICON, ABB, RECTRON, EPSON, CJ(CHINA), DIODES, SONY, NXP/PHI, STACKPOLE TECHNOLOGY, INC., SPANSION, ASTEC, WINBOND, ALLEGRO, TI , CONEXANT, TI, ST, AD, ALTERA, ATMEL, XILINX, NS, MAX, NXP, INTEL, SAMSUNG, MICROCHIP, FSC, CY, TOS, MURATA, ON, PANASONIC, INFINEON, VISHAY, AVX, IR, FUJI, MICRON, LINEAR, FREESCALE, NVIDIA, SEMIKRON, LATTICE, MOT, NEC, AMD, BRIGHT, PHI, SANYO, ROHM, BROADCOM, RENESAS, STMICROELECTRONICS, DALLAS, SHARP, YAGEO, INTERSIL, HIT, QUALCOMM, MIT, AVAGO, KEMET, HARVATEK, MOLEX, COOPER, MICREL, ATI, ISD/NUVOTON, TDK, FUJITSU, ISSI, AGILENT, HYNIX, IDT, BOURNS, COILCRAFT, LITTELFUSE, SEIKO, KOA KAOHSIUNG CORPORATION, ELPIDA, EPCOS, TRACO, CIRRUS, MPS, POWER, LAMBDA, DIP, RECOM, 模块, EUPEC, SST, AUO, BB/TI, CREE, IC, SILICON, EVERLIGHT, QFN, ABB, SONY, EPSON, RECTRON, SIPEX, DIODES, CJ(CHINA), SPANSION, AOS, ALLEGRO, NXP/PHI, STACKPOLE TECHNOLOGY, INC., WINBOND, CONEXANT, ASTEC, MXIC, TI, ST, AD, ALTERA, ATMEL, NS, MAX, XILINX, NXP, INTEL, MICROCHIP, CY, SAMSUNG, FSC, TOS, MURATA, ON, PANASONIC, INFINEON, VISHAY, AVX, FUJI, IR, LINEAR, FREESCALE, NVIDIA, SEMIKRON, LATTICE, MICRON, MOT, NEC, AMD, BRIGHT, PHI, BROADCOM, ROHM, SANYO, STMICROELECTRONICS, DALLAS, RENESAS, SHARP, YAGEO, INTERSIL, HIT, QUALCOMM, AVAGO, MIT, KEMET, HARVATEK, MOLEX, COOPER, MICREL, ATI, ISD/NUVOTON, TDK, ISSI, AGILENT, FUJITSU, HYNIX, IDT, BOURNS, COILCRAFT, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, TRACO, CIRRUS, EPCOS, MPS, POWER, LAMBDA, DIP, RECOM, 模块, EUPEC, SST, AUO, BB/TI, CREE, IC, SILICON, EVERLIGHT, ABB, QFN, SONY, EPSON, RECTRON, SIPEX, CJ(CHINA), AOS, ALLEGRO, NXP/PHI, SPANSION, STACKPOLE TECHNOLOGY, INC., WINBOND, CONEXANT, ASTEC, REALTEK, TI , TI, ST, AD, ALTERA, ATMEL, NS, MAX, XILINX, NXP, INTEL, MICROCHIP, CY, SAMSUNG, FSC, TOS, MURATA, ON, PANASONIC, INFINEON, VISHAY, AVX, FUJI, IR, LINEAR, FREESCALE, NVIDIA, SEMIKRON, LATTICE, MICRON, MOT, NEC, AMD, BRIGHT, PHI, BROADCOM, ROHM, SANYO, STMICROELECTRONICS, DALLAS, RENESAS, SHARP, YAGEO, INTERSIL, HIT, QUALCOMM, AVAGO, MIT, KEMET, HARVATEK, ISSI, MOLEX, COOPER, MICREL, NUVOTON, ATI, ISD/NUVOTON, TDK, AGILENT, FUJITSU, HYNIX, IDT, BOURNS, COILCRAFT, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, TRACO, CIRRUS, EPCOS, MPS, POWER, LAMBDA, DIP, RECOM, 模块, EUPEC, WINBOND, SST, AUO, BB/TI, CREE, IC, SILICON, BCD, EVERLIGHT, ABB, QFN, SONY, EPSON, RECTRON, SIPEX, CJ(CHINA), AOS, ALLEGRO, NXP/PHI, SPANSION, STACKPOLE TECHNOLOGY, INC., CONEXANT, ASTEC, TI, ST, AD, ALTERA, ATMEL, NS, MAX, XILINX, NXP, INTEL, MICROCHIP, CY, SAMSUNG, FSC, MURATA, TOS, PANASONIC, ON, INFINEON, VISHAY, AVX, FUJI, IR, FREESCALE, LINEAR, NVIDIA, SEMIKRON, LATTICE, MICRON, MOT, AMD, BRIGHT, NEC, PHI, BROADCOM, ROHM, STMICROELECTRONICS, SANYO, DALLAS, SHARP, RENESAS, YAGEO, INTERSIL, HIT, QUALCOMM, MIT, KEMET, AVAGO, HARVATEK, ISSI, MOLEX, COOPER, MICREL, NUVOTON, ATI, ISD/NUVOTON, TDK, AGILENT, FUJITSU, IDT, HYNIX, BOURNS, COILCRAFT, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, TRACO, CIRRUS, EPCOS, MPS, LAMBDA, DIP, RECOM, 模块, EUPEC, WINBOND, SST, AUO, BB/TI, CREE, IC, SILICON, BCD, EVERLIGHT, ABB, QFN, EPSON, RECTRON, POWER, SONY, CJ(CHINA), AOS, NXP/PHI, SIPEX, SPANSION, STACKPOLE TECHNOLOGY, INC., ASTEC, ALLEGRO, TI , TI, AD, ST, ALTERA, ATMEL, NS, MAX, XILINX, NXP, INTEL, SAMSUNG, MICROCHIP, CY, FSC, MURATA, TOS, ON, PANASONIC, INFINEON, VISHAY, AVX, FUJI, IR, FREESCALE, LINEAR, NVIDIA, SEMIKRON, MICRON, LATTICE, AMD, MOT, BRIGHT, NEC, PHI, BROADCOM, ROHM, DALLAS, STMICROELECTRONICS, SANYO, ALLEGRO, SHARP, RENESAS, YAGEO, INTERSIL, HIT, QUALCOMM, MIT, KEMET, AVAGO, ISSI, HARVATEK, MOLEX, MICREL, COOPER, NUVOTON, ATI, ISD/NUVOTON, TDK, AGILENT, FUJITSU, HYNIX, IDT, BOURNS, COILCRAFT, LITTELFUSE, KOA KAOHSIUNG CORPORATION, INNOLUX, SEIKO, ELPIDA, TRACO, CIRRUS, EPCOS, MPS, SST, LAMBDA, DIP, RECOM, 模块, EUPEC, WINBOND, AUO, BB/TI, SILICON, CREE, IC, BB, BCD, EVERLIGHT, ABB, POWER, QFN, EPSON, RECTRON, SPANSION, SONY, CJ(CHINA), AOS, NXP/PHI, SIPEX, STACKPOLE TECHNOLOGY, INC., TI, AD, ST, MAX, ALTERA, ATMEL, NXP, NS, XILINX, INTEL, MICROCHIP, SAMSUNG, CY, FSC, ON, MURATA, TOS, PANASONIC, INFINEON, VISHAY, IR, AVX, FREESCALE, LINEAR, NVIDIA, LATTICE, MICRON, MOT, SEMIKRON, AMD, NEC, PHI, BROADCOM, ALLEGRO, ROHM, SANYO, DALLAS, FUJI, SHARP, STMICROELECTRONICS, COILCRAFT, RENESAS, YAGEO, INTERSIL, AVAGO, QUALCOMM, HIT, MIT, KEMET, ISSI, HARVATEK, SUMIDA, MOLEX, COOPER, MICREL, TDK, NUVOTON, ATI, ISD/NUVOTON, FUJITSU, HYNIX, AGILENT, IDT, BOURNS, LITTELFUSE, KOA KAOHSIUNG CORPORATION, TRACO, SEIKO, INNOLUX, BB, ELPIDA, CIRRUS, EPCOS, MPS, SST, SILICON, DIP, EUPEC, RECOM, 模块, POWER, WINBOND, AUO, BB/TI, CREE, IC, EVERLIGHT, BCD, SPANSION, EPSON, SONY, RECTRON, AOS, CJ(CHINA), QFN, SIPEX, NXP/PHI, STACKPOLE TECHNOLOGY, INC., COSEL, MXIC, TI, AD, ST, MAX, ALTERA, ATMEL, NXP, NS, XILINX, INTEL, MICROCHIP, CY, SAMSUNG, ON, FSC, MURATA, TOS, INFINEON, PANASONIC, VISHAY, IR, AVX, FREESCALE, LINEAR, NVIDIA, LATTICE, MICRON, MOT, AMD, SEMIKRON, NEC, PHI, BROADCOM, ALLEGRO, ROHM, SANYO, DALLAS, FUJI, SHARP, STMICROELECTRONICS, COILCRAFT, RENESAS, YAGEO, INTERSIL, AVAGO, HIT, QUALCOMM, MIT, ISSI, KEMET, HARVATEK, SUMIDA, MOLEX, COOPER, MICREL, TDK, NUVOTON, ATI, ISD/NUVOTON, FUJITSU, AGILENT, IDT, BOURNS, LITTELFUSE, HYNIX, KOA KAOHSIUNG CORPORATION, TRACO, BB, SEIKO, INNOLUX, CIRRUS, EPCOS, MPS, SST, SILICON, DIP, EUPEC, RECOM, 模块, POWER, WINBOND, TE CONNECTIVITY , AUO, BB/TI, CREE, IC, EVERLIGHT, BCD, SPANSION, SONY, EPSON, RECTRON, DIODES, AOS, CJ(CHINA), QFN, SIPEX, NXP/PHI, STACKPOLE TECHNOLOGY, INC., COSEL, TI, AD, MAX, ALTERA, ST, ATMEL, NXP, NS, MICROCHIP, XILINX, TOS, CY, ON, INFINEON, FSC, INTEL, MURATA, PANASONIC, IR, VISHAY, MICRON, SAMSUNG, AVX, FREESCALE, LINEAR, LATTICE, MOT, SEMIKRON, MIT, NEC, PHI, BROADCOM, ALLEGRO, DALLAS, COILCRAFT, AMD, ROHM, RENESAS, SHARP, FUJI, NVIDIA, STMICROELECTRONICS, YAGEO, AVAGO, INTERSIL, HIT, QUALCOMM, KEMET, HARVATEK, ISSI, SUMIDA, MOLEX, COOPER, MICREL, TDK, NUVOTON, SANYO, ISD/NUVOTON, AGILENT, FUJITSU, VICOR, IDT, BOURNS, LITTELFUSE, KOA KAOHSIUNG CORPORATION, TRACO, BB, SEIKO, INNOLUX, SONY, CIRRUS, EPCOS, MPS, SILICON, DIP, SST, 模块, POWER, TE CONNECTIVITY , BB/TI, AUO, WINBOND, IC, CREE, EVERLIGHT, ATI, EUPEC, BCD, SPANSION, EPSON, DIODES, AOS, CJ(CHINA), QFN, NXP/PHI, SIPEX, STACKPOLE TECHNOLOGY, INC., MIC, JST, MXIC, TI, AD, MAX, ST, ALTERA, NS, ATMEL, NXP, MICROCHIP, XILINX, TOS, CY, ON, INFINEON, INTEL, FSC, MURATA, PANASONIC, IR, VISHAY, MICRON, SAMSUNG, FREESCALE, AVX, LINEAR, LATTICE, MOT, SEMIKRON, PHI, NEC, RENESAS, MIT, BROADCOM, ALLEGRO, DALLAS, NVIDIA, ROHM, COILCRAFT, AMD, SHARP, FUJI, STMICROELECTRONICS, YAGEO, HIT, INTERSIL, AVAGO, QUALCOMM, ISSI, KEMET, HARVATEK, SUMIDA, MOLEX, MICREL, COOPER, SANYO, TDK, NUVOTON, BB, ISD/NUVOTON, FUJITSU, AGILENT, VICOR, IDT, BOURNS, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SONY, TRACO, SEIKO, INNOLUX, CIRRUS, MPS, EPCOS, SST, SILICON, DIP, 模块, POWER, TE CONNECTIVITY , BB/TI, WINBOND, AUO, IC, CREE, EVERLIGHT, ATI, EUPEC, BCD, SPANSION, MIC, EPSON, DIODES, AOS, CJ(CHINA), QFN, SIPEX, NXP/PHI, STACKPOLE TECHNOLOGY, INC., HYNIX, MXIC, TI, AD, ST, MAX, NS, NXP, ALTERA, TOS, ATMEL, ON, MICROCHIP, INTEL, XILINX, INFINEON, VISHAY, CY, FSC, MURATA, PANASONIC, MICRON, SAMSUNG, IR, AVX, LINEAR, FREESCALE, LATTICE, MOT, AMD, PHI, SEMIKRON, NEC, NVIDIA, RENESAS, BROADCOM, ALLEGRO, ROHM, COILCRAFT, DALLAS, SHARP, AVAGO, YAGEO, HIT, INTERSIL, KEMET, HARVATEK, ISSI, MIT, SANYO, SUMIDA, MOLEX, COOPER, MICREL, QUALCOMM, NUVOTON, BB, ATI, ISD/NUVOTON, TDK, FUJI, FUJITSU, AGILENT, VICOR, BOURNS, EUPEC, LITTELFUSE, KOA KAOHSIUNG CORPORATION, MCP, TRACO, IDT, SEIKO, SONY, INNOLUX, EPCOS, MPS, CIRRUS, SST, SILICON, DIP, RECOM, 模块, POWER, TE CONNECTIVITY , BB/TI, AUO, IC, EVERLIGHT, SPANSION, WINBOND, CREE, MIC, BCD, DIODES, AOS, CJ(CHINA), QFN, NXP/PHI, AT, EPSON, STACKPOLE TECHNOLOGY, INC., MXIC, TI, AD, ST, MAX, NS, NXP, ALTERA, TOS, ATMEL, FSC, ON, MICROCHIP, INTEL, XILINX, INFINEON, VISHAY, CY, MURATA, PANASONIC, MICRON, SAMSUNG, IR, AVX, FREESCALE, LINEAR, AMD, LATTICE, MOT, PHI, SEMIKRON, NEC, NVIDIA, RENESAS, BROADCOM, ALLEGRO, ROHM, COILCRAFT, DALLAS, SHARP, AVAGO, YAGEO, FUJI, HIT, HARVATEK, ISSI, KEMET, MIT, SANYO, INTERSIL, MOLEX, SUMIDA, COOPER, MICREL, QUALCOMM, NUVOTON, BB, ATI, ISD/NUVOTON, TDK, FUJITSU, AGILENT, VICOR, BOURNS, EUPEC, LITTELFUSE, KOA KAOHSIUNG CORPORATION, MCP, SONY, TRACO, IDT, SEIKO, INNOLUX, EPCOS, MPS, CIRRUS, SST, SPANSION, DIP, SILICON, RECOM, 模块, TE CONNECTIVITY , WINBOND, BB/TI, AUO, IC, EVERLIGHT, BCD, CREE, MIC, POWER, DIODES, AOS, HYNIX, CJ(CHINA), QFN, NXP/PHI, AT, EPSON, STACKPOLE TECHNOLOGY, INC., TI, AD, ST, MAX, NS, NXP, ALTERA, ATMEL, FSC, MICROCHIP, ON, TOS, INTEL, XILINX, INFINEON, CY, VISHAY, MURATA, PANASONIC, MICRON, SAMSUNG, IR, AVX, FREESCALE, LINEAR, MOT, LATTICE, AMD, SEMIKRON, PHI, NEC, IXYS, BROADCOM, ALLEGRO, ROHM, RENESAS, COILCRAFT, AVAGO, DALLAS, SHARP, NVIDIA, YAGEO, FUJI, HIT, 模块, SANYO, HARVATEK, ISSI, KEMET, MIT, INTERSIL, MOLEX, SUMIDA, ATI, COOPER, QUALCOMM, MICREL, NUVOTON, POWER, TDK, BB, ISD/NUVOTON, VICOR, EUPEC, IDT, BOURNS, LITTELFUSE, FUJITSU, SONY, TRACO, KOA KAOHSIUNG CORPORATION, MCP, SEIKO, EPCOS, MPS, SST, SPANSION, SILICON, RECOM, MURATA PS, WINBOND, TE CONNECTIVITY , INNOLUX, BB/TI, EVERLIGHT, IC, BCD, CREE, MIC, CIRRUS, DIODES, AT, QFN, AOS, NXP/PHI, EPSON, STACKPOLE TECHNOLOGY, INC., JST, REALTEK, MXIC, TI, AD, ST, MAX, NS, NXP, ALTERA, ATMEL, FSC, MICROCHIP, ON, TOS, INTEL, XILINX, INFINEON, CY, VISHAY, MURATA, PANASONIC, MICRON, SAMSUNG, IR, AVX, FREESCALE, LINEAR, MOT, SEMIKRON, LATTICE, AMD, PHI, NEC, IXYS, BROADCOM, ALLEGRO, ROHM, RENESAS, AVAGO, COILCRAFT, DALLAS, SHARP, NVIDIA, YAGEO, FUJI, HIT, 模块, MIT, SANYO, HARVATEK, ISSI, KEMET, INTERSIL, MOLEX, SUMIDA, ATI, COOPER, QUALCOMM, MICREL, NUVOTON, POWER, TDK, BB, ISD/NUVOTON, VICOR, EUPEC, IDT, BOURNS, FUJITSU, LITTELFUSE, SONY, TRACO, KOA KAOHSIUNG CORPORATION, MCP, SEIKO, EPCOS, MPS, SST, SPANSION, SILICON, RECOM, MURATA PS, WINBOND, TE CONNECTIVITY , INNOLUX, BB/TI, EVERLIGHT, IC, BCD, CREE, MIC, CIRRUS, DIODES, AT, QFN, AOS, NXP/PHI, EPSON, STACKPOLE TECHNOLOGY, INC., JST, REALTEK, MXIC, TI, AD, ST, MAX, NS, NXP, FSC, MICROCHIP, ATMEL, ALTERA, ON, XILINX, TOS, INFINEON, CY, INTEL, VISHAY, MURATA, MICRON, PANASONIC, SAMSUNG, AVX, IR, FREESCALE, LINEAR, MOT, NEC, SEMIKRON, LATTICE, AMD, ALLEGRO, PHI, BROADCOM, HIT, ROHM, RENESAS, AVAGO, DALLAS, SHARP, YAGEO, FUJI, IXYS, SUMIDA, 模块, MIT, HARVATEK, SANYO, KEMET, MOLEX, COOPER, QUALCOMM, MICREL, NUVOTON, BB, ISD/NUVOTON, TDK, NVIDIA, VICOR, INTERSIL, EUPEC, COILCRAFT, BOURNS, FUJITSU, LITTELFUSE, SONY, TRACO, MCP, SEIKO, IDT, POWER, EPCOS, ATI, ISSI, MPS, SILICON, RECOM, SPANSION, TE CONNECTIVITY , VISHAY DALE, WINBOND, INNOLUX, BB/TI, EVERLIGHT, IC, SST, CREE, BCD, MIC, DIODES, CIRRUS, AT, QFN, AOS, EPSON, JST, AUO, HYNIX, TI , JAE, WCH, TI, AD, ST, MAX, NS, NXP, FSC, MICROCHIP, ATMEL, ALTERA, ON, XILINX, TOS, INFINEON, CY, INTEL, VISHAY, MURATA, MICRON, PANASONIC, SAMSUNG, AVX, IR, FREESCALE, MOT, LINEAR, NEC, SEMIKRON, LATTICE, AMD, ALLEGRO, PHI, BROADCOM, HIT, ROHM, RENESAS, AVAGO, DALLAS, RECOM, SHARP, YAGEO, FUJI, IXYS, SUMIDA, 模块, MIT, HARVATEK, SANYO, KEMET, MOLEX, COOPER, QUALCOMM, MICREL, NUVOTON, BB, ISD/NUVOTON, TDK, NVIDIA, TRACO, VICOR, INTERSIL, EUPEC, COILCRAFT, BOURNS, FUJITSU, LITTELFUSE, SONY, MCP, SEIKO, IDT, POWER, EPCOS, ATI, ISSI, MPS, SILICON, SPANSION, TE CONNECTIVITY , VISHAY DALE, WINBOND, INNOLUX, BB/TI, EVERLIGHT, IC, SST, CREE, BCD, MIC, DIODES, CIRRUS, AT, QFN, AOS, EPSON, JST, AUO, HYNIX, TI , JAE, WCH, TI, AD, ST, MAX, NS, NXP, MICROCHIP, FSC, ATMEL, ALTERA, ON, XILINX, TOS, CY, INTEL, INFINEON, VISHAY, MURATA, MICRON, PANASONIC, SAMSUNG, AVX, FREESCALE, IR, LINEAR, MOT, LATTICE, NEC, AMD, ALLEGRO, PHI, SEMIKRON, HIT, BROADCOM, ROHM, RENESAS, DALLAS, RECOM, AVAGO, SHARP, YAGEO, IXYS, FUJI, SUMIDA, 模块, HARVATEK, KEMET, MIT, SANYO, MOLEX, COOPER, QUALCOMM, MICREL, NUVOTON, BB, ISD/NUVOTON, TDK, NVIDIA, TRACO, VICOR, COILCRAFT, INTERSIL, BOURNS, LITTELFUSE, SONY, MCP, EUPEC, SEIKO, POWER, FUJITSU, IDT, ATI, ISSI, MPS, EPCOS, SILICON, SPANSION, TE CONNECTIVITY , VISHAY DALE, INNOLUX, BB/TI, WINBOND, IC, CREE, SST, BCD, DIODES, EVERLIGHT, AT, QFN, MIC, AOS, CIRRUS, EPSON, JST, AUO, TI , JAE, WCH, HYNIX, TI, AD, ST, MAX, NS, NXP, MICROCHIP, FSC, ATMEL, ALTERA, ON, XILINX, TOS, CY, INTEL, INFINEON, VISHAY, MURATA, MICRON, PANASONIC, SAMSUNG, AVX, FREESCALE, IR, LINEAR, MOT, LATTICE, NEC, AMD, ALLEGRO, PHI, SEMIKRON, HIT, BROADCOM, ROHM, RENESAS, DALLAS, RECOM, AVAGO, SHARP, YAGEO, IXYS, FUJI, SUMIDA, 模块, HARVATEK, KEMET, MIT, SANYO, MOLEX, COOPER, QUALCOMM, MICREL, NUVOTON, BB, ISD/NUVOTON, TDK, NVIDIA, TRACO, VICOR, COILCRAFT, INTERSIL, BOURNS, LITTELFUSE, SONY, MCP, EUPEC, SEIKO, POWER, FUJITSU, IDT, ATI, ISSI, MPS, EPCOS, SILICON, SPANSION, TE CONNECTIVITY , VISHAY DALE, INNOLUX, BB/TI, WINBOND, IC, CREE, SST, BCD, DIODES, EVERLIGHT, AT, QFN, MIC, AOS, CIRRUS, EPSON, JST, AUO, TI , JAE, WCH, HYNIX, TI, AD, ST, MAX, NS, NXP, MICROCHIP, FSC, ATMEL, ALTERA, ON, XILINX, TOS, CY, INTEL, INFINEON, VISHAY, MURATA, MICRON, PANASONIC, SAMSUNG, AVX, FREESCALE, IR, LINEAR, MOT, LATTICE, NEC, AMD, ALLEGRO, PHI, SEMIKRON, HIT, BROADCOM, ROHM, RENESAS, DALLAS, RECOM, AVAGO, SHARP, YAGEO, IXYS, FUJI, SUMIDA, 模块, HARVATEK, KEMET, MIT, SANYO, MOLEX, COOPER, QUALCOMM, MICREL, 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Google Search Product Summary TI SN74LVC1G332DCK This is an offer provided by HKin.com member. In stock! Order now! Category: Electronic Components. Product #: SN74LVC1G332DCK. Available from: Hongkong Truly Electronics Tech Co.,Ltd Condition: in excellent condition In stock! Order now! Part Numbers Previous Parts:SC630ULTRT, MC14046BFEL, AD1847JST, 0ZCA0100FF2E, 0ZCC0014FF2C, TDA19977BHV, TLP227G-1, HKQ0603S22NH-T, SMD2920P030TF, RTL8201, SMD0805P035TF, MNBC05DCX-P, HY27UF081G2A, LP3929TME-AACQ, 79RV3041-33PF, QTLP601CEB (+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: SN74LVC1G332DCK": Post Date Part Number Brand D/C Desc Qty Company Tue Apr 16 03:26:00 UTC 2013 SN74LVC1G332DCKR (from standard server 2) TI 08+ SOT-363 9458 Hongkong Truly Electronics Tech Co.,Ltd Tue Apr 16 03:26:00 UTC 2013 SN74LVC1G332DCKR (from parts server 2) TI 08+ SOT-363 9458 Hongkong Truly Electronics Tech Co.,Ltd Tue Apr 16 03:26:00 UTC 2013 SN74LVC1G332DCKR (from hkin.com 2) TI 08+ SOT-363 9458 Hongkong Truly Electronics Tech Co.,Ltd Tue Apr 16 03:26:00 UTC 2013 SN74LVC1G332DCKR (from hkin.com 2) TI 08+ SOT-363 9458 Hongkong Truly Electronics Tech Co.,Ltd Last record QTLP601CEB: Post Date Part Number Brand D/C Desc Qty Company Last record 79RV3041-33PF: Post Date Part Number Brand D/C Desc Qty Company Last record LP3929TME-AACQ: Post Date Part Number Brand D/C Desc Qty Company If you want to find more about SN74LVC1G332DCK, please visit us on HKin vid:offerengine20130517 Part Number Prefix SN74LVC1G332DCK,SN74LVC1G332DCK,Comments from user about SN74LVC1G332DCK: The large contact area and short distance reduces both the inductance and resistance of the connection. The microarchitecture includes the constituent parts of the processor and how these interconnect and interoperate to implement the ISA. Notch filters ?attenuation of certain frequencies while allowing all others to pass. The size of data objects became larger; allowing more transistors on a chip allowed word sizes to increase from 4- and 8-bit words up to today's 64-bit words. This creates a much larger current between the collector and emitter, controlled by the base-emitter current. The guess allows the hardware to prefetch instructions without waiting for the register read. Typically this will be a vacuum tube, or solid-state (transistor or operational amplifier). Synthesis is a process where a VHDL is compiled and mapped into an implementation technology such as an FPGA or an ASIC. Anything related to :SN74LVC1G332DCK, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: SN74LVC1G332DCK, search hkinventory: SN74LVC1G332DCK, His chip solved many practical problems that Kilby's had not. Integrated circuits were made possible by experimental discoveries showing that semiconductor devices could perform the functions of vacuum tubes and by mid-20th-century technology advancements in semiconductor device fabrication. The first bipolar transistors devices with substantial power handling capabilities were introduced in the 1960s. These limit the circuit topologies available; for example, most, but not all active filter topologies provide a buffered (low impedance) output. Datasheet Dir, DataSheet Archive The integrated circuit processor was produced in large numbers by highly automated processes, so unit cost was low. They use electronic conduction in the solid state as opposed to the gaseous state or thermionic emission in a high vacuum. The other regions, and their associated terminals, are known as the emitter and the collector. Techniques such as branch prediction and speculative execution are used to lessen these branch penalties. Integrated circuits are used in virtually all electronic equipment today and have revolutionized the world of electronics. Circuit breakers for large currents or high voltages are usually arranged with pilot devices to sense a fault current and to operate the trip opening mechanism. This can be seen in figure 2. For quantities that vary exponentially with temperature, such as the rate of a chemical reaction, any temperature coefficient would be valid only over a very small temperature range. any passive component and active component such as:1N4148, or 6502 It has already completely replaced the bipolar transistor in power applications, and the availability of power modules (in which several IGBT dice are connected in parallel) makes it attractive for power levels up to several megawatts, pushing further the limit where thyristors and GTOs become the only option. Low-pass filters ?attenuation of frequencies above their cut-off points. VHDL has file input and output capabilities, and can be used as a general-purpose language for text processing, but files are more commonly used by a simulation testbench for stimulus or verification data. A different approach to improving a computer's performance is to add extra processors, as in symmetric multiprocessing designs, which have been popular in servers and workstations since the early 1990s. For example driver circuit SN74LVC1G332DCK,SN74LVC1G332DCK,Comments from user about SN74LVC1G332DCK: The middle, or base, region between the junctions is typically very narrow. The gate electrode is charged to produce an electric field that controls the conductivity of a "channel" between two terminals, called the source and drain. Circuit designers will sometimes refer to this class of components as dissipative, or thermodynamically passive. Integrated circuits were made possible by experimental discoveries showing that semiconductor devices could perform the functions of vacuum tubes and by mid-20th-century technology advancements in semiconductor device fabrication. This type of circuit is usually called "mixed signal" rather than analog or digital. The amount of the voltage drop depends on the semiconductor material and the doping concentrations. A second-order all-pole filter gives an ultimate slope of about 12 dB per octave (40dB/decade), but the slope close to the corner frequency is much less, sometimes necessitating a notch be added to the filter. Noyce also came up with his own idea of an integrated circuit half a year later than Kilby. Anything related to :SN74LVC1G332DCK, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: SN74LVC1G332DCKSee also: Capacitor Transistor Diode