Part: K3PE7E700M-XGC10JR

Index Files

Offer Index 12

EUPEC,
IC,
CREE,
DIODES,
CIRRUS,
SIPEX,
HVCA,
CJ(CHINA),
QFN,
AOS,
POWER,
WINBOND,
EPSON,
NXP/PHI,
CONEXANT,
SONY,
TI,
AD,
ST,
XILINX,
MAX,
ALTERA,
NS,
ATMEL,
SAMSUNG,
NXP,
TOS,
MURATA,
MICROCHIP,
INTEL,
FSC,
CY,
ON,
INFINEON,
PANASONIC,
AVX,
VISHAY,
IR,
MICRON,
FREESCALE,
LINEAR,
FUJI,
LATTICE,
SEMIKRON,
MOT,
BRIGHT,
NVIDIA,
EVERLIGHT,
模块,
PHI,
NEC,
ROHM,
BROADCOM,
AVAGO,
COILCRAFT,
DALLAS,
YAGEO,
ALLEGRO,
AMD,
INTERSIL,
QUALCOMM,
TDK,
MIT,
WURTH,
RENESAS,
HARVATEK,
KEMET,
MICREL,
HIT,
SUMIDA,
SANYO,
ATI,
MOLEX,
ISD/NUVOTON,
SHARP,
TYCO,
HYNIX,
IDT,
STMICROELECTRONICS,
ISSI,
JRC,
REALTEK,
BOURNS,
FUJITSU,
LITTELFUSE,
SEIKO,
MIC,
SILICON,
ELPIDA,
TE,
VICOR,
TRACO,
MPS,
COOPER,
BB,
ABB,
SST,
MINDSPEED,
RECOM,
EPCOS,
EUPEC,
IC,
CREE,
DIODES,
CIRRUS,
QFN,
SIPEX,
HVCA,
POWER,
CJ(CHINA),
AOS,
WINBOND,
EPSON,
NXP/PHI,
SPANSION,
CONEXANT,
TI,
AD,
ST,
MAX,
NS,
XILINX,
ALTERA,
ATMEL,
NXP,
SAMSUNG,
TOS,
MICROCHIP,
MURATA,
INTEL,
FSC,
CY,
ON,
INFINEON,
PANASONIC,
AVX,
VISHAY,
IR,
FREESCALE,
MICRON,
LINEAR,
FUJI,
LATTICE,
SEMIKRON,
MOT,
BRIGHT,
EVERLIGHT,
模块,
NEC,
PHI,
ROHM,
AVAGO,
NVIDIA,
COILCRAFT,
BROADCOM,
DALLAS,
YAGEO,
ALLEGRO,
MIT,
QUALCOMM,
WURTH,
TDK,
INTERSIL,
RENESAS,
AMD,
HARVATEK,
KEMET,
MICREL,
SANYO,
HIT,
SUMIDA,
MOLEX,
SHARP,
ISD/NUVOTON,
TYCO,
HYNIX,
STMICROELECTRONICS,
IDT,
ISSI,
JRC,
BOURNS,
FUJITSU,
LITTELFUSE,
REALTEK,
SEIKO,
MIC,
POWER,
ATI,
SILICON,
TE,
ELPIDA,
VICOR,
TRACO,
MPS,
COOPER,
BB,
ABB,
RECOM,
EPCOS,
SST,
EUPEC,
IC,
CREE,
DIODES,
CIRRUS,
QFN,
SIPEX,
HVCA,
CJ(CHINA),
NXP/PHI,
EPSON,
SPANSION,
BB/TI,
SONY,
AOS,
CONEXANT,
TI,
AD,
ST,
MAX,
NS,
XILINX,
ALTERA,
ATMEL,
NXP,
SAMSUNG,
TOS,
MICROCHIP,
MURATA,
INTEL,
FSC,
CY,
ON,
INFINEON,
PANASONIC,
AVX,
VISHAY,
IR,
FREESCALE,
LINEAR,
MICRON,
FUJI,
LATTICE,
SEMIKRON,
MOT,
BRIGHT,
EVERLIGHT,
NEC,
模块,
PHI,
ROHM,
AVAGO,
NVIDIA,
COILCRAFT,
BROADCOM,
DALLAS,
ALLEGRO,
YAGEO,
MIT,
QUALCOMM,
WURTH,
TDK,
RENESAS,
INTERSIL,
AMD,
HARVATEK,
KEMET,
MICREL,
SANYO,
HIT,
SUMIDA,
MOLEX,
SHARP,
ISD/NUVOTON,
TYCO,
JRC,
HYNIX,
STMICROELECTRONICS,
IDT,
ISSI,
BOURNS,
FUJITSU,
LITTELFUSE,
REALTEK,
SEIKO,
POWER,
MIC,
ATI,
SILICON,
TE,
ELPIDA,
VICOR,
TRACO,
MPS,
COOPER,
BB,
ABB,
RECOM,
EPCOS,
SST,
EUPEC,
IC,
CREE,
DIODES,
SIPEX,
CIRRUS,
QFN,
HVCA,
CJ(CHINA),
NXP/PHI,
EPSON,
SONY,
SPANSION,
BB/TI,
CONEXANT,
AOS,
TI,
AD,
ST,
MAX,
XILINX,
NS,
ATMEL,
ALTERA,
NXP,
SAMSUNG,
TOS,
MICROCHIP,
INTEL,
FSC,
CY,
ON,
MURATA,
INFINEON,
PANASONIC,
AVX,
VISHAY,
IR,
FREESCALE,
MICRON,
LINEAR,
LATTICE,
FUJI,
SEMIKRON,
MOT,
BRIGHT,
EVERLIGHT,
模块,
PHI,
NEC,
ROHM,
AVAGO,
NVIDIA,
COILCRAFT,
BROADCOM,
DALLAS,
ALLEGRO,
YAGEO,
QUALCOMM,
INTERSIL,
MIT,
RENESAS,
AMD,
HARVATEK,
KEMET,
MICREL,
SANYO,
SUMIDA,
HIT,
MOLEX,
ISD/NUVOTON,
TDK,
JRC,
HYNIX,
STMICROELECTRONICS,
IDT,
BOURNS,
FUJITSU,
LITTELFUSE,
REALTEK,
SEIKO,
POWER,
SHARP,
MIC,
ATI,
SILICON,
TE,
ELPIDA,
VICOR,
ABB,
TRACO,
COOPER,
MPS,
BB,
RECOM,
EPCOS,
EUPEC,
IC,
CREE,
SIPEX,
CIRRUS,
QFN,
DIODES,
HVCA,
SST,
CJ(CHINA),
EPSON,
SPANSION,
SONY,
BB/TI,
CONEXANT,
AOS,
TI ,
ISSI,
BOSCH,
EXAR(SIPEX),
TI,
AD,
ST,
MAX,
XILINX,
NS,
ATMEL,
ALTERA,
NXP,
SAMSUNG,
MICROCHIP,
INTEL,
FSC,
CY,
TOS,
ON,
MURATA,
INFINEON,
PANASONIC,
AVX,
VISHAY,
IR,
FREESCALE,
MICRON,
LINEAR,
LATTICE,
FUJI,
SEMIKRON,
MOT,
BRIGHT,
EVERLIGHT,
模块,
PHI,
NEC,
ROHM,
MIT,
AVAGO,
NVIDIA,
COILCRAFT,
BROADCOM,
DALLAS,
ALLEGRO,
YAGEO,
QUALCOMM,
INTERSIL,
RENESAS,
AMD,
HARVATEK,
KEMET,
MICREL,
SANYO,
SUMIDA,
HIT,
MOLEX,
ISD/NUVOTON,
TDK,
JRC,
HYNIX,
STMICROELECTRONICS,
IDT,
BOURNS,
FUJITSU,
LITTELFUSE,
REALTEK,
SEIKO,
POWER,
SHARP,
MIC,
ATI,
SILICON,
TE,
ELPIDA,
ABB,
TRACO,
COOPER,
MPS,
BB,
RECOM,
EPCOS,
EUPEC,
IC,
CREE,
SIPEX,
VICOR,
CIRRUS,
QFN,
DIODES,
HVCA,
SST,
CJ(CHINA),
EPSON,
SPANSION,
SONY,
BB/TI,
CONEXANT,
AOS,
TI ,
ISSI,
BOSCH,
EXAR(SIPEX),
TI,
ST,
AD,
MAX,
XILINX,
NS,
ATMEL,
ALTERA,
NXP,
SAMSUNG,
MICROCHIP,
INTEL,
FSC,
CY,
ON,
TOS,
MURATA,
PANASONIC,
INFINEON,
AVX,
VISHAY,
FREESCALE,
MICRON,
IR,
LINEAR,
LATTICE,
SEMIKRON,
BRIGHT,
MOT,
EVERLIGHT,
模块,
FUJI,
MIT,
PHI,
NEC,
ROHM,
NVIDIA,
AVAGO,
AMD,
COILCRAFT,
BROADCOM,
DALLAS,
ALLEGRO,
YAGEO,
QUALCOMM,
INTERSIL,
RENESAS,
HARVATEK,
KEMET,
MICREL,
SANYO,
SUMIDA,
HIT,
MOLEX,
TDK,
ISD/NUVOTON,
JRC,
HYNIX,
STMICROELECTRONICS,
IDT,
BOURNS,
FUJITSU,
LITTELFUSE,
POWER,
REALTEK,
SEIKO,
MIC,
SHARP,
ATI,
SILICON,
TE,
ELPIDA,
TRACO,
COOPER,
MPS,
VICOR,
BB,
RECOM,
EPCOS,
EUPEC,
CREE,
IC,
SIPEX,
CIRRUS,
QFN,
DIODES,
HVCA,
CJ(CHINA),
SST,
EPSON,
SONY,
SPANSION,
BB/TI,
AOS,
CONEXANT,
TI ,
ISSI,
BOSCH,
EXAR(SIPEX),
AT,
TI,
ST,
AD,
NS,
MAX,
XILINX,
ATMEL,
ALTERA,
SAMSUNG,
NXP,
MICROCHIP,
FSC,
INTEL,
TOS,
CY,
ON,
MURATA,
FUJI,
PANASONIC,
INFINEON,
AVX,
VISHAY,
IR,
MICRON,
FREESCALE,
MIT,
LINEAR,
LATTICE,
SEMIKRON,
MOT,
BRIGHT,
NVIDIA,
EVERLIGHT,
模块,
PHI,
NEC,
ROHM,
SANYO,
AMD,
BROADCOM,
AVAGO,
COILCRAFT,
DALLAS,
ALLEGRO,
YAGEO,
QUALCOMM,
SHARP,
RENESAS,
INTERSIL,
MICREL,
HARVATEK,
KEMET,
HIT,
MOLEX,
SUMIDA,
ATI,
COOPER,
TDK,
ISD/NUVOTON,
HYNIX,
JRC,
STMICROELECTRONICS,
ISSI,
REALTEK,
IDT,
FUJITSU,
BOURNS,
LITTELFUSE,
POWER,
SEIKO,
MIC,
SILICON,
ELPIDA,
TE,
SONY,
TRACO,
EPCOS,
MPS,
BB,
EUPEC,
SST,
RECOM,
COSEL,
CREE,
IC,
DIODES,
SIPEX,
CIRRUS,
QFN,
HVCA,
CJ(CHINA),
EPSON,
SPANSION,
NXP/PHI,
CONEXANT,
BB/TI,
ASTEC,
AOS,
TI ,
JAE,
TI,
AD,
ST,
XILINX,
MAX,
NS,
ATMEL,
ALTERA,
SAMSUNG,
NXP,
MICROCHIP,
INTEL,
FSC,
CY,
TOS,
MURATA,
FUJI,
PANASONIC,
ON,
INFINEON,
AVX,
IR,
MICRON,
MIT,
LINEAR,
SEMIKRON,
VISHAY,
LATTICE,
BRIGHT,
模块,
MOT,
FREESCALE,
NVIDIA,
NEC,
ROHM,
SANYO,
PHI,
BROADCOM,
AMD,
DALLAS,
YAGEO,
QUALCOMM,
SHARP,
INTERSIL,
RENESAS,
HARVATEK,
AVAGO,
KEMET,
HIT,
COOPER,
MICREL,
MOLEX,
ISD/NUVOTON,
TDK,
JRC,
ISSI,
HYNIX,
ATI,
IDT,
COILCRAFT,
FUJITSU,
BOURNS,
LITTELFUSE,
SEIKO,
TE,
ELPIDA,
TRACO,
SONY,
POWER,
EPCOS,
MPS,
RECOM,
EUPEC,
SST,
COSEL,
CREE,
IC,
EVERLIGHT,
SILICON,
QFN,
CIRRUS,
CJ(CHINA),
SIPEX,
BB,
NXP/PHI,
EPSON,
DIODES,
ASTEC,
AOS,
TI ,
SPANSION,
JAE,
JST,
CONEXANT,
MXIC,
AUO,
EXAR(SIPEX),
MIC,
REALTEK,
AT,
TI,
AD,
ST,
ALTERA,
MAX,
XILINX,
NS,
ATMEL,
NXP,
SAMSUNG,
MICROCHIP,
INTEL,
CY,
FSC,
TOS,
MURATA,
PANASONIC,
ON,
INFINEON,
AVX,
FUJI,
IR,
SEMIKRON,
MICRON,
LINEAR,
VISHAY,
LATTICE,
MIT,
BRIGHT,
模块,
FREESCALE,
NEC,
MOT,
NVIDIA,
ROHM,
SANYO,
BROADCOM,
AMD,
PHI,
QUALCOMM,
STMICROELECTRONICS,
DALLAS,
RENESAS,
YAGEO,
SHARP,
INTERSIL,
HIT,
AVAGO,
HARVATEK,
KEMET,
COOPER,
MICREL,
MOLEX,
ISD/NUVOTON,
TDK,
JRC,
ISSI,
HYNIX,
ATI,
IDT,
FUJITSU,
COILCRAFT,
BOURNS,
LITTELFUSE,
SEIKO,
EUPEC,
TE,
ELPIDA,
SONY,
TRACO,
MPS,
POWER,
EPCOS,
SST,
RECOM,
ASTEC,
CREE,
SILICON,
IC,
EVERLIGHT,
CIRRUS,
ABB,
QFN,
BB,
CJ(CHINA),
EPSON,
SIPEX,
NXP/PHI,
DIODES,
ALLEGRO,
AOS,
IXYS,
TI ,
FTDI,
SPANSION,
VICOR,
JAE,
JST,
MXIC,
CONEXANT,
TI,
AD,
ST,
ALTERA,
XILINX,
NS,
MAX,
ATMEL,
NXP,
SAMSUNG,
MICROCHIP,
INTEL,
CY,
MURATA,
FSC,
PANASONIC,
TOS,
ON,
INFINEON,
AVX,
IR,
FUJI,
MICRON,
LINEAR,
LATTICE,
SEMIKRON,
VISHAY,
BRIGHT,
模块,
FREESCALE,
MIT,
NVIDIA,
MOT,
SANYO,
NEC,
AMD,
BROADCOM,
ROHM,
STMICROELECTRONICS,
PHI,
DALLAS,
RENESAS,
YAGEO,
SHARP,
QUALCOMM,
HIT,
HARVATEK,
KEMET,
AVAGO,
COOPER,
INTERSIL,
MOLEX,
MICREL,
ISD/NUVOTON,
TDK,
ISSI,
AGILENT,
ATI,
HYNIX,
COILCRAFT,
BOURNS,
LITTELFUSE,
FUJITSU,
IDT,
SEIKO,
EUPEC,
TE,
ELPIDA,
TRACO,
CIRRUS,
SONY,
MPS,
EPCOS,
RECOM,
SST,
ASTEC,
CREE,
AUO,
IC,
SILICON,
ABB,
QFN,
EVERLIGHT,
CJ(CHINA),
SIPEX,
EPSON,
NXP/PHI,
DIODES,
BB,
AOS,
POWER,
ALLEGRO,
IXYS,
TI ,
FTDI,
VICOR,
JAE,
JRC,
JST,
MXIC,
TI,
AD,
ST,
ALTERA,
NS,
XILINX,
MAX,
ATMEL,
SAMSUNG,
NXP,
INTEL,
MICROCHIP,
CY,
FSC,
MURATA,
TOS,
PANASONIC,
ON,
INFINEON,
IR,
AVX,
LINEAR,
MICRON,
NVIDIA,
FUJI,
LATTICE,
VISHAY,
SEMIKRON,
FREESCALE,
MOT,
BRIGHT,
AMD,
模块,
NEC,
PHI,
BROADCOM,
ROHM,
SANYO,
STMICROELECTRONICS,
DALLAS,
RENESAS,
MIT,
SHARP,
YAGEO,
QUALCOMM,
HIT,
HARVATEK,
AVAGO,
KEMET,
INTERSIL,
COOPER,
MOLEX,
MICREL,
ATI,
ISD/NUVOTON,
TDK,
FUJITSU,
AGILENT,
HYNIX,
ISSI,
IDT,
COILCRAFT,
EUPEC,
BOURNS,
LITTELFUSE,
SEIKO,
TE,
ELPIDA,
CIRRUS,
TRACO,
SONY,
EPCOS,
MPS,
SST,
RECOM,
LAMBDA,
BB,
CREE,
AUO,
IC,
SILICON,
EVERLIGHT,
QFN,
CJ(CHINA),
EPSON,
SIPEX,
DIODES,
IXYS,
NXP/PHI,
BB/TI,
ASTEC,
ALLEGRO,
SPANSION,
AOS,
POWER,
CONEXANT,
TI ,
FTDI,
MXIC,
VICOR,
TI,
AD,
ST,
ALTERA,
XILINX,
NS,
ATMEL,
MAX,
NXP,
INTEL,
SAMSUNG,
MICROCHIP,
CY,
FSC,
MURATA,
PANASONIC,
TOS,
ON,
AVX,
IR,
INFINEON,
VISHAY,
LINEAR,
NVIDIA,
FUJI,
LATTICE,
MICRON,
BRIGHT,
AMD,
FREESCALE,
MOT,
模块,
PHI,
BROADCOM,
NEC,
SEMIKRON,
ROHM,
SANYO,
STMICROELECTRONICS,
DALLAS,
RENESAS,
SHARP,
YAGEO,
QUALCOMM,
HIT,
MIT,
HARVATEK,
KEMET,
AVAGO,
COOPER,
MOLEX,
INTERSIL,
MICREL,
ATI,
ISD/NUVOTON,
TDK,
AGILENT,
ISSI,
BOURNS,
HYNIX,
COILCRAFT,
IDT,
LITTELFUSE,
FUJITSU,
KOA KAOHSIUNG CORPORATION,
SEIKO,
ELPIDA,
TRACO,
CIRRUS,
MPS,
SONY,
EPCOS,
RECOM,
SST,
LAMBDA,
EPSON,
AUO,
CREE,
IC,
BB,
SILICON,
EVERLIGHT,
QFN,
CJ(CHINA),
NXP/PHI,
DIODES,
SIPEX,
STACKPOLE TECHNOLOGY, INC.,
ASTEC,
BB/TI,
MXIC,
POWER,
AOS,
SPANSION,
TI ,
ALLEGRO,
FTDI,
IXYS,
REALTEK,
VICOR,
TI,
AD,
ST,
ALTERA,
ATMEL,
XILINX,
NS,
MAX,
NXP,
INTEL,
SAMSUNG,
MICROCHIP,
CY,
FSC,
TOS,
MURATA,
ON,
PANASONIC,
IR,
AVX,
VISHAY,
INFINEON,
LINEAR,
FREESCALE,
NVIDIA,
FUJI,
MICRON,
LATTICE,
AMD,
BRIGHT,
MOT,
PHI,
NEC,
BROADCOM,
SANYO,
ROHM,
SEMIKRON,
STMICROELECTRONICS,
RENESAS,
DALLAS,
SHARP,
YAGEO,
INTERSIL,
QUALCOMM,
HIT,
MIT,
HARVATEK,
KEMET,
AVAGO,
MOLEX,
MICREL,
COOPER,
ATI,
ISD/NUVOTON,
TDK,
ISSI,
AGILENT,
HYNIX,
IDT,
BOURNS,
COILCRAFT,
FUJITSU,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
SEIKO,
ELPIDA,
CIRRUS,
TRACO,
MPS,
POWER,
AOS,
SST,
EPCOS,
SONY,
DIP,
EPSON,
SIPEX,
RECOM,
模块,
LAMBDA,
EUPEC,
AUO,
IC,
BB,
CREE,
QFN,
SILICON,
EVERLIGHT,
SPANSION,
CJ(CHINA),
DIODES,
NXP/PHI,
STACKPOLE TECHNOLOGY, INC.,
MXIC,
ASTEC,
BB/TI,
WINBOND,
ALLEGRO,
TI ,
FTDI,
TI,
ST,
AD,
ALTERA,
ATMEL,
XILINX,
NS,
MAX,
NXP,
INTEL,
SAMSUNG,
MICROCHIP,
CY,
FSC,
TOS,
MURATA,
ON,
PANASONIC,
VISHAY,
INFINEON,
AVX,
FUJI,
IR,
MICRON,
LINEAR,
FREESCALE,
NVIDIA,
LATTICE,
SEMIKRON,
MOT,
BRIGHT,
AMD,
NEC,
PHI,
SANYO,
ROHM,
BROADCOM,
STMICROELECTRONICS,
RENESAS,
SHARP,
DALLAS,
YAGEO,
INTERSIL,
HIT,
QUALCOMM,
MIT,
AVAGO,
HARVATEK,
KEMET,
MOLEX,
COOPER,
MICREL,
ATI,
ISD/NUVOTON,
ISSI,
TDK,
AGILENT,
HYNIX,
IDT,
BOURNS,
COILCRAFT,
FUJITSU,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
SEIKO,
ELPIDA,
CIRRUS,
TRACO,
MPS,
AOS,
EPCOS,
POWER,
DIP,
LAMBDA,
SIPEX,
RECOM,
模块,
EUPEC,
BB/TI,
SST,
AUO,
CREE,
IC,
EVERLIGHT,
QFN,
SILICON,
ABB,
RECTRON,
EPSON,
CJ(CHINA),
DIODES,
SONY,
NXP/PHI,
STACKPOLE TECHNOLOGY, INC.,
SPANSION,
ASTEC,
WINBOND,
ALLEGRO,
TI ,
CONEXANT,
TI,
ST,
AD,
ALTERA,
ATMEL,
XILINX,
NS,
MAX,
NXP,
INTEL,
SAMSUNG,
MICROCHIP,
FSC,
CY,
TOS,
MURATA,
ON,
PANASONIC,
INFINEON,
VISHAY,
AVX,
IR,
FUJI,
MICRON,
LINEAR,
FREESCALE,
NVIDIA,
SEMIKRON,
LATTICE,
MOT,
NEC,
AMD,
BRIGHT,
PHI,
SANYO,
ROHM,
BROADCOM,
RENESAS,
STMICROELECTRONICS,
DALLAS,
SHARP,
YAGEO,
INTERSIL,
HIT,
QUALCOMM,
MIT,
AVAGO,
KEMET,
HARVATEK,
MOLEX,
COOPER,
MICREL,
ATI,
ISD/NUVOTON,
TDK,
FUJITSU,
ISSI,
AGILENT,
HYNIX,
IDT,
BOURNS,
COILCRAFT,
LITTELFUSE,
SEIKO,
KOA KAOHSIUNG CORPORATION,
ELPIDA,
EPCOS,
TRACO,
CIRRUS,
MPS,
POWER,
LAMBDA,
DIP,
RECOM,
模块,
EUPEC,
SST,
AUO,
BB/TI,
CREE,
IC,
SILICON,
EVERLIGHT,
QFN,
ABB,
SONY,
EPSON,
RECTRON,
SIPEX,
DIODES,
CJ(CHINA),
SPANSION,
AOS,
ALLEGRO,
NXP/PHI,
STACKPOLE TECHNOLOGY, INC.,
WINBOND,
CONEXANT,
ASTEC,
MXIC,
TI,
ST,
AD,
ALTERA,
ATMEL,
NS,
MAX,
XILINX,
NXP,
INTEL,
MICROCHIP,
CY,
SAMSUNG,
FSC,
TOS,
MURATA,
ON,
PANASONIC,
INFINEON,
VISHAY,
AVX,
FUJI,
IR,
LINEAR,
FREESCALE,
NVIDIA,
SEMIKRON,
LATTICE,
MICRON,
MOT,
NEC,
AMD,
BRIGHT,
PHI,
BROADCOM,
ROHM,
SANYO,
STMICROELECTRONICS,
DALLAS,
RENESAS,
SHARP,
YAGEO,
INTERSIL,
HIT,
QUALCOMM,
AVAGO,
MIT,
KEMET,
HARVATEK,
MOLEX,
COOPER,
MICREL,
ATI,
ISD/NUVOTON,
TDK,
ISSI,
AGILENT,
FUJITSU,
HYNIX,
IDT,
BOURNS,
COILCRAFT,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
SEIKO,
ELPIDA,
TRACO,
CIRRUS,
EPCOS,
MPS,
POWER,
LAMBDA,
DIP,
RECOM,
模块,
EUPEC,
SST,
AUO,
BB/TI,
CREE,
IC,
SILICON,
EVERLIGHT,
ABB,
QFN,
SONY,
EPSON,
RECTRON,
SIPEX,
CJ(CHINA),
AOS,
ALLEGRO,
NXP/PHI,
SPANSION,
STACKPOLE TECHNOLOGY, INC.,
WINBOND,
CONEXANT,
ASTEC,
REALTEK,
TI ,
TI,
ST,
AD,
ALTERA,
ATMEL,
NS,
MAX,
XILINX,
NXP,
INTEL,
MICROCHIP,
CY,
SAMSUNG,
FSC,
TOS,
MURATA,
ON,
PANASONIC,
INFINEON,
VISHAY,
AVX,
FUJI,
IR,
LINEAR,
FREESCALE,
NVIDIA,
SEMIKRON,
LATTICE,
MICRON,
MOT,
NEC,
AMD,
BRIGHT,
PHI,
BROADCOM,
ROHM,
SANYO,
STMICROELECTRONICS,
DALLAS,
RENESAS,
SHARP,
YAGEO,
INTERSIL,
HIT,
QUALCOMM,
AVAGO,
MIT,
KEMET,
HARVATEK,
ISSI,
MOLEX,
COOPER,
MICREL,
NUVOTON,
ATI,
ISD/NUVOTON,
TDK,
AGILENT,
FUJITSU,
HYNIX,
IDT,
BOURNS,
COILCRAFT,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
SEIKO,
ELPIDA,
TRACO,
CIRRUS,
EPCOS,
MPS,
POWER,
LAMBDA,
DIP,
RECOM,
模块,
EUPEC,
WINBOND,
SST,
AUO,
BB/TI,
CREE,
IC,
SILICON,
BCD,
EVERLIGHT,
ABB,
QFN,
SONY,
EPSON,
RECTRON,
SIPEX,
CJ(CHINA),
AOS,
ALLEGRO,
NXP/PHI,
SPANSION,
STACKPOLE TECHNOLOGY, INC.,
CONEXANT,
ASTEC,
TI,
ST,
AD,
ALTERA,
ATMEL,
NS,
MAX,
XILINX,
NXP,
INTEL,
MICROCHIP,
CY,
SAMSUNG,
FSC,
MURATA,
TOS,
PANASONIC,
ON,
INFINEON,
VISHAY,
AVX,
FUJI,
IR,
FREESCALE,
LINEAR,
NVIDIA,
SEMIKRON,
LATTICE,
MICRON,
MOT,
AMD,
BRIGHT,
NEC,
PHI,
BROADCOM,
ROHM,
STMICROELECTRONICS,
SANYO,
DALLAS,
SHARP,
RENESAS,
YAGEO,
INTERSIL,
HIT,
QUALCOMM,
MIT,
KEMET,
AVAGO,
HARVATEK,
ISSI,
MOLEX,
COOPER,
MICREL,
NUVOTON,
ATI,
ISD/NUVOTON,
TDK,
AGILENT,
FUJITSU,
IDT,
HYNIX,
BOURNS,
COILCRAFT,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
SEIKO,
ELPIDA,
TRACO,
CIRRUS,
EPCOS,
MPS,
LAMBDA,
DIP,
RECOM,
模块,
EUPEC,
WINBOND,
SST,
AUO,
BB/TI,
CREE,
IC,
SILICON,
BCD,
EVERLIGHT,
ABB,
QFN,
EPSON,
RECTRON,
POWER,
SONY,
CJ(CHINA),
AOS,
NXP/PHI,
SIPEX,
SPANSION,
STACKPOLE TECHNOLOGY, INC.,
ASTEC,
ALLEGRO,
TI ,
TI,
AD,
ST,
ALTERA,
ATMEL,
NS,
MAX,
XILINX,
NXP,
INTEL,
SAMSUNG,
MICROCHIP,
CY,
FSC,
MURATA,
TOS,
ON,
PANASONIC,
INFINEON,
VISHAY,
AVX,
FUJI,
IR,
FREESCALE,
LINEAR,
NVIDIA,
SEMIKRON,
MICRON,
LATTICE,
AMD,
MOT,
BRIGHT,
NEC,
PHI,
BROADCOM,
ROHM,
DALLAS,
STMICROELECTRONICS,
SANYO,
ALLEGRO,
SHARP,
RENESAS,
YAGEO,
INTERSIL,
HIT,
QUALCOMM,
MIT,
KEMET,
AVAGO,
ISSI,
HARVATEK,
MOLEX,
MICREL,
COOPER,
NUVOTON,
ATI,
ISD/NUVOTON,
TDK,
AGILENT,
FUJITSU,
HYNIX,
IDT,
BOURNS,
COILCRAFT,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
INNOLUX,
SEIKO,
ELPIDA,
TRACO,
CIRRUS,
EPCOS,
MPS,
SST,
LAMBDA,
DIP,
RECOM,
模块,
EUPEC,
WINBOND,
AUO,
BB/TI,
SILICON,
CREE,
IC,
BB,
BCD,
EVERLIGHT,
ABB,
POWER,
QFN,
EPSON,
RECTRON,
SPANSION,
SONY,
CJ(CHINA),
AOS,
NXP/PHI,
SIPEX,
STACKPOLE TECHNOLOGY, INC.,
TI,
AD,
ST,
MAX,
ALTERA,
ATMEL,
NXP,
NS,
XILINX,
INTEL,
MICROCHIP,
SAMSUNG,
CY,
FSC,
ON,
MURATA,
TOS,
PANASONIC,
INFINEON,
VISHAY,
IR,
AVX,
FREESCALE,
LINEAR,
NVIDIA,
LATTICE,
MICRON,
MOT,
SEMIKRON,
AMD,
NEC,
PHI,
BROADCOM,
ALLEGRO,
ROHM,
SANYO,
DALLAS,
FUJI,
SHARP,
STMICROELECTRONICS,
COILCRAFT,
RENESAS,
YAGEO,
INTERSIL,
AVAGO,
QUALCOMM,
HIT,
MIT,
KEMET,
ISSI,
HARVATEK,
SUMIDA,
MOLEX,
COOPER,
MICREL,
TDK,
NUVOTON,
ATI,
ISD/NUVOTON,
FUJITSU,
HYNIX,
AGILENT,
IDT,
BOURNS,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
TRACO,
SEIKO,
INNOLUX,
BB,
ELPIDA,
CIRRUS,
EPCOS,
MPS,
SST,
SILICON,
DIP,
EUPEC,
RECOM,
模块,
POWER,
WINBOND,
AUO,
BB/TI,
CREE,
IC,
EVERLIGHT,
BCD,
SPANSION,
EPSON,
SONY,
RECTRON,
AOS,
CJ(CHINA),
QFN,
SIPEX,
NXP/PHI,
STACKPOLE TECHNOLOGY, INC.,
COSEL,
MXIC,
TI,
AD,
MAX,
ST,
NS,
ATMEL,
XILINX,
ALTERA,
MURATA,
FSC,
MICROCHIP,
NXP,
INFINEON,
SAMSUNG,
TOS,
ON,
PANASONIC,
MOT,
CY,
VISHAY,
IR,
MIT,
LINEAR,
INTEL,
AVX,
MICREL,
FREESCALE,
SEMIKRON,
SHARP,
ALLEGRO,
ROHM,
NEC,
PHI,
TDK,
THINKING,
NVIDIA,
EVERLIGHT,
RENESAS,
POWER,
YAGEO,
DALLAS,
BROADCOM,
SANYO,
HIT,
SONY,
AVAGO,
QUALCOMM,
MICRON,
WURTH,
AUO,
INTERSIL,
MIC,
HARVATEK,
IDT - INTE,
NUVOTON,
BB/TI,
KEMET,
SILICON,
ISD/NUVOTON,
FUJITSU,
TYCO,
NIPPON CHEMI-CON,
BB,
AMD,
BOURNS,
COILCRAFT,
FUJI,
LITTELFUSE,
SEIKO,
IDT,
IXYS,
MPS,
TRACO,
COOPER,
MOLEX,
ERICSSOM,
BCD,
CREE,
QFP,
EPCOS,
FTDI,
SPANSION,
ISSI,
REALTEK,
SST,
HYNIX,
MICRON(ST),
WINBOND,
CIRRUS,
EPSON,
QFN,
SIPEX,
BOSCH,
LATTICE,
ATI,
DIODES,
EUPEC,
RAMTRON,
TI ,
SW,
TI,
AD,
MAX,
ST,
NS,
ATMEL,
XILINX,
ALTERA,
MURATA,
FSC,
MICROCHIP,
NXP,
INFINEON,
TOS,
SAMSUNG,
ON,
CY,
PANASONIC,
MOT,
VISHAY,
IR,
MIT,
LINEAR,
INTEL,
AVX,
MICREL,
FREESCALE,
SEMIKRON,
SHARP,
ALLEGRO,
ROHM,
NEC,
PHI,
TDK,
THINKING,
NVIDIA,
EVERLIGHT,
RENESAS,
POWER,
YAGEO,
DALLAS,
BROADCOM,
SANYO,
HIT,
SONY,
QUALCOMM,
AVAGO,
MICRON,
WURTH,
AUO,
INTERSIL,
MIC,
HARVATEK,
IDT - INTE,
NUVOTON,
BB/TI,
KEMET,
SILICON,
ISD/NUVOTON,
FUJITSU,
TYCO,
NIPPON CHEMI-CON,
BB,
AMD,
BOURNS,
COILCRAFT,
FUJI,
LITTELFUSE,
SEIKO,
IDT,
IXYS,
MPS,
TRACO,
COOPER,
MOLEX,
ERICSSOM,
BCD,
CREE,
QFP,
EPCOS,
FTDI,
SPANSION,
ISSI,
REALTEK,
SST,
HYNIX,
MICRON(ST),
WINBOND,
CIRRUS,
EPSON,
QFN,
SIPEX,
BOSCH,
LATTICE,
ATI,
DIODES,
EUPEC,
RAMTRON,
TI ,
SW,
TI,
AD,
MAX,
ST,
NS,
ATMEL,
XILINX,
ALTERA,
MURATA,
FSC,
MICROCHIP,
NXP,
INFINEON,
TOS,
SAMSUNG,
ON,
CY,
PANASONIC,
MOT,
VISHAY,
IR,
MIT,
LINEAR,
INTEL,
AVX,
MICREL,
FREESCALE,
SEMIKRON,
SHARP,
ALLEGRO,
ROHM,
NEC,
PHI,
TDK,
THINKING,
NVIDIA,
EVERLIGHT,
RENESAS,
POWER,
YAGEO,
DALLAS,
BROADCOM,
SANYO,
HIT,
SONY,
QUALCOMM,
AVAGO,
MICRON,
WURTH,
AUO,
INTERSIL,
MIC,
HARVATEK,
IDT - INTE,
NUVOTON,
BB/TI,
KEMET,
SILICON,
ISD/NUVOTON,
FUJITSU,
TYCO,
NIPPON CHEMI-CON,
BB,
AMD,
BOURNS,
COILCRAFT,
FUJI,
LITTELFUSE,
SEIKO,
IDT,
IXYS,
MPS,
TRACO,
COOPER,
MOLEX,
ERICSSOM,
BCD,
CREE,
EPCOS,
QFP,
FTDI,
SPANSION,
ISSI,
REALTEK,
SST,
HYNIX,
MICRON(ST),
WINBOND,
CIRRUS,
EPSON,
QFN,
SIPEX,
BOSCH,
LATTICE,
ATI,
DIODES,
EUPEC,
RAMTRON,
TI ,
SW,
TI,
AD,
MAX,
ST,
NS,
ATMEL,
XILINX,
ALTERA,
MURATA,
FSC,
MICROCHIP,
NXP,
INFINEON,
TOS,
SAMSUNG,
ON,
CY,
PANASONIC,
MOT,
VISHAY,
IR,
MIT,
LINEAR,
INTEL,
AVX,
MICREL,
FREESCALE,
SEMIKRON,
SHARP,
ALLEGRO,
ROHM,
NEC,
PHI,
TDK,
THINKING,
NVIDIA,
EVERLIGHT,
RENESAS,
POWER,
YAGEO,
DALLAS,
BROADCOM,
SANYO,
HIT,
SONY,
QUALCOMM,
AVAGO,
MICRON,
WURTH,
AUO,
INTERSIL,
MIC,
HARVATEK,
IDT - INTE,
NUVOTON,
BB/TI,
KEMET,
SILICON,
ISD/NUVOTON,
FUJITSU,
TYCO,
NIPPON CHEMI-CON,
BB,
AMD,
BOURNS,
COILCRAFT,
FUJI,
LITTELFUSE,
SEIKO,
IDT,
IXYS,
MPS,
TRACO,
COOPER,
MOLEX,
ERICSSOM,
BCD,
CREE,
EPCOS,
QFP,
FTDI,
SPANSION,
ISSI,
REALTEK,
SST,
HYNIX,
MICRON(ST),
WINBOND,
CIRRUS,
EPSON,
QFN,
SIPEX,
BOSCH,
LATTICE,
ATI,
DIODES,
EUPEC,
RAMTRON,
TI ,
SW,
TI,
AD,
ST,
MAX,
ATMEL,
NS,
ALTERA,
MURATA,
XILINX,
FSC,
NXP,
MICROCHIP,
SAMSUNG,
TOS,
INFINEON,
CY,
ON,
PANASONIC,
VISHAY,
MIT,
IR,
AVX,
INTEL,
LINEAR,
MICREL,
BROADCOM,
SEMIKRON,
FREESCALE,
SHARP,
ALLEGRO,
ROHM,
MOT,
NEC,
THINKING,
NVIDIA,
EVERLIGHT,
PHI,
TDK,
RENESAS,
YAGEO,
SANYO,
DALLAS,
QUALCOMM,
SONY,
WURTH,
HIT,
MICRON,
NUVOTON,
AUO,
AVAGO,
MPS,
INTERSIL,
BB/TI,
HARVATEK,
IDT - INTE,
MIC,
KEMET,
SILICON,
FUJITSU,
TYCO,
NIPPON CHEMI-CON,
BB,
POWER,
BOURNS,
COILCRAFT,
FUJI,
AMD,
LITTELFUSE,
SEIKO,
IXYS,
IDT,
TRACO,
COOPER,
FTDI,
MOLEX,
ERICSSOM,
BCD,
EPSON,
QFP,
CREE,
EPCOS,
ISSI,
SPANSION,
MICRON(ST),
REALTEK,
HYNIX,
WINBOND,
CIRRUS,
SST,
QFN,
ATI,
PAM,
SIPEX,
DIODES,
SAMXON,
LATTICE,
RAMTRON,
TI ,
ZETEX,
EUPEC,
TI,
AD,
ST,
MAX,
ATMEL,
NS,
ALTERA,
MURATA,
XILINX,
FSC,
NXP,
MICROCHIP,
SAMSUNG,
TOS,
INFINEON,
CY,
ON,
PANASONIC,
VISHAY,
MIT,
IR,
AVX,
INTEL,
LINEAR,
MICREL,
BROADCOM,
SEMIKRON,
FREESCALE,
SHARP,
ALLEGRO,
ROHM,
MOT,
NEC,
THINKING,
NVIDIA,
EVERLIGHT,
PHI,
TDK,
RENESAS,
MICRON,
AVAGO,
YAGEO,
SANYO,
DALLAS,
QUALCOMM,
WURTH,
HIT,
NUVOTON,
AUO,
MPS,
INTERSIL,
BB/TI,
HARVATEK,
IDT - INTE,
MIC,
SONY,
KEMET,
SILICON,
FUJITSU,
TYCO,
BB,
NIPPON CHEMI-CON,
POWER,
COILCRAFT,
BOURNS,
FUJI,
AMD,
LITTELFUSE,
SEIKO,
IXYS,
IDT,
TRACO,
COOPER,
FTDI

 
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Product Summary
SAMSUNG K3PE7E700M-XGC10JR
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: K3PE7E700M-XGC10JR.


Available from: HK Jiaweiyi Technology Limited
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:M62443FP, MAX492ESA, SN65HVD230D, 6MBI50U4A-120, 10G0018, APSC160ETD331MJC5S, EPM7128ELC84-20N, HSB2838TR-E, GRM188R, OPA4348AIDG, LT1790ACS6-2.5, SM6T33CA, 6MBI225U4-170, CRCW080515K0FHEAP, CRCW080522K1FHEAP, K4M51163LE-YPF1H

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: K3PE7E700M-XGC10JR":

Post DatePart NumberBrandD/CDescQtyCompany
Wed Apr 10 03:41:00 UTC 2013K3PE7E700M-XGC10JR (from standard server 2)SAMSUNG9478HK Jiaweiyi Technology Limited
Wed Apr 10 03:41:00 UTC 2013K3PE7E700M-XGC10JR (from parts server 2)SAMSUNG9478HK Jiaweiyi Technology Limited
Wed Apr 10 03:41:00 UTC 2013K3PE7E700M-XGC10JR (from hkin.com 2)SAMSUNG9478HK Jiaweiyi Technology Limited
Wed Apr 10 03:41:00 UTC 2013K3PE7E700M-XGC10JR (from hkin.com 2)SAMSUNG9478HK Jiaweiyi Technology Limited

Last record K4M51163LE-YPF1H:

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Last record CRCW080522K1FHEAP:

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Last record CRCW080515K0FHEAP:

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vid:offerengine20130415 Part Number Prefix

K3PE7E700M-XGC10JR,K3PE7E700M-XGC10JR,Comments from user about K3PE7E700M-XGC10JR: In response, microprocessor manufacturers look for other ways to improve performance in order to hold on to the momentum of constant upgrades in the market. They are commonly used in speaker crossover design (due to the moderately large voltages and currents, and the lack of easy access to power), filters in power distribution networks (due to the large voltages and currents), power supply bypassing (due to low cost, and in some cases, power requirements), as well as a variety of discrete and home brew circuits (for low-cost and simplicity). On average, every fifth instruction executed is a branch, so without any intervention, that's a high amount of stalling. The microarchitecture of a machine is usually represented as (more or less detailed) diagrams that describe the interconnections of the various microarchitectural elements of the machine, which may be everything from single gates and registers, to complete arithmetic logic units (ALU)s and even larger elements. The capacitance is greatest when there is a narrow separation between large areas of conductor, hence capacitor conductors are often called "plates," referring to an early means of construction. Another benefit is that VHDL allows the description of a concurrent system. With operating systems Windows XP x64, Windows Vista x64, Windows 7 x64, Linux, BSD and Mac OS X that run 64-bit native, the software is also geared to fully utilize the capabilities of such processors. This can be seen in figure 2. Anything related to :K3PE7E700M-XGC10JR, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: K3PE7E700M-XGC10JR, search hkinventory: K3PE7E700M-XGC10JR, However, many formational and functional block parameters can be tuned (capacity parameters, memory size, element base, block composition and interconnection structure). This indicates the variety of filter (see above) and the center or corner frequencies. The pipelined datapath is the most commonly used datapath design in microarchitecture today., followed soon after. Datasheet Dir, DataSheet Archive
A microprocessor control program can be easily tailored to different needs of a product line, allowing upgrades in performance with minimal redesign of the product. Indeed, it may be the desire to incorporate a passive filter that leads the designer to use the hybrid format. Machines with different microarchitectures may have the same instruction set architecture, and thus be capable of executing the same programs. The circuit breaker must detect a fault condition; in low-voltage circuit breakers this is usually done within the breaker enclosure. The size of data objects became larger; allowing more transistors on a chip allowed word sizes to increase from 4- and 8-bit words up to today's 64-bit words. For example, an engine control system in an automobile can adjust ignition timing based on engine speed, load on the engine, ambient temperature, and any observed tendency for knocking - allowing an automobile to operate on a range of fuel grades. It was made of Germanium and had a voltage capability of 200 volts and a current rating of 35 amperes. The circuit breaker must detect a fault condition; in low-voltage circuit breakers this is usually done within the breaker enclosure.
any passive component and active component such as:1N4148, or 6502 Some common power devices are the power diode, thyristor, power MOSFET and IGBT. During the 1960s, computer processors were constructed out of small and medium-scale ICs each containing from tens to a few hundred transistors. However, remember that the internal output impedance of operational amplifiers, if used, may rise markedly at high frequencies and reduce the attenuation from that expected.Integrated circuits were made possible by experimental discoveries showing that semiconductor devices could perform the functions of vacuum tubes and by mid-20th-century technology advancements in semiconductor device fabrication. For example driver circuit
K3PE7E700M-XGC10JR,K3PE7E700M-XGC10JR,Comments from user about K3PE7E700M-XGC10JR: Its major limitation for low voltage applications is the high voltage drop it exhibits in on-state (2 to 4 V). Each logic gate is in turn represented by a circuit diagram describing the connections of the transistors used to implement it in some particular logic family. Although the MOSFET is named in part for its "metal" gate, in modern devices polysilicon is typically used instead. The integrated circuit's mass production capability, reliability, and building-block approach to circuit design ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. With the ability to put large numbers of transistors on one chip, it becomes feaible to integrate memory on the same die as the processor. These diagrams generally separate the datapath (where data is placed) and the control path (which can be said to steer the data). A logic gate consists of up to about twenty transistors whereas an advanced microprocessor, as of 2011, can use as many as 3 billion transistors (MOSFETs). The integrated circuit's mass production capability, reliability, and building-block approach to circuit design ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. Anything related to :K3PE7E700M-XGC10JR, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: K3PE7E700M-XGC10JRSee also: