Part: 2N3055G

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Product Summary
ON 2N3055G
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: 2N3055G.


Available from: Juncheng International (Hongkong) Co.,Ltd
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:EP1C4Q144C8, HEC3150-012-110, 88E1111-BAB, 2SC4226/R25, 54F273DMQB, MAX503CWG, AT28C256E-20TU, SHT11, SI2307DS-T1, STR50092, TPS2141IPWP, TSA5520T/C4, MDD250-16io1B, QGAH02094, MDD72-16io1B, CD4512BE

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: 2N3055G":

Post DatePart NumberBrandD/CDescQtyCompany
Fri Dec 2 07:40:00 UTC 20112N3055G (from hkin.com)ON07+TO-20410000Juncheng International (Hongkong) Co.,Ltd
Fri Dec 2 07:40:00 UTC 20112N3055G (from standard server 2)ON07+TO-20410000Juncheng International (Hongkong) Co.,Ltd
Fri Dec 2 07:40:00 UTC 20112N3055G (from parts server 2)ON07+TO-20410000Juncheng International (Hongkong) Co.,Ltd
Fri Dec 2 07:40:00 UTC 20112N3055G (from hkin.com 2)ON07+TO-20410000Juncheng International (Hongkong) Co.,Ltd
Fri Dec 2 07:40:00 UTC 20112N3055G (from hkin.com 2)ON07+TO-20410000Juncheng International (Hongkong) Co.,Ltd

Last record CD4512BE:

Post DatePart NumberBrandD/CDescQtyCompany
Wed Dec 28 06:38:00 UTC 2011CD4512BE (from hkin.com)TI11+DIP-161000Fortune Micro-Electronics Company

Last record MDD72-16io1B:

Post DatePart NumberBrandD/CDescQtyCompany
Sat Dec 17 01:24:00 UTC 2011MDD72-16io1B (from hkin.com)IXYS10+new & original500HK Sensi Technology Co., Limited

Last record QGAH02094:

Post DatePart NumberBrandD/CDescQtyCompany
Thu Dec 15 09:42:00 UTC 2011QGAH02094 (from hkin.com)samsung11+2583Shenzhen Meiritong Electron Technology Co.,Ltd

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vid:offerengine20120101

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3 introduced signed and unsigned types to facilitate arithmetical operations on vectors. Techniques for heat dissipation can include heat sinks and fans for air cooling, and other forms of computer cooling such as water cooling. A passive component, depending on field, may be either a component that consumes (but does not produce) energy (thermodynamic passivity), or a component that is incapable of power gain (incremental passivity). Infrared LEDs are also used in the remote control units of many commercial products including televisions, DVD players, and other domestic appliances. Most of them should not be used in linear operation. In 1986, HP released its first system with a PA-RISC CPU. Performance is high because the components switch quickly and consume little power (compared to their discrete counterparts) as a result of the small size and close proximity of the components. The vast majority of the discrete (i.e non integrated) power devices are built using a vertical structure, whereas small-signal devices employ a lateral structure.
any passive component and active component such as:Diode, Passive filters are still found, however, in hybrid integrated circuits. Power semiconductor devices first appeared in 1952 with the introduction of the power diode by R. In February 2008, Accellera approved VHDL 4. Some common power devices are the power diode, thyristor, power MOSFET and IGBT. For example driver circuit
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