Part: BUW12AF

Index Files

Offer Index 7

XILINX,
MAX,
MURATA,
ATMEL,
TOS,
ALTERA,
CY,
NXP,
FSC,
INTEL,
VISHAY,
SAMSUNG,
ROHM,
MICROCHIP,
FREESCALE,
NEC,
POWER,
DALLAS,
PHI,
MOT,
LINEAR,
AMD,
RENESAS,
WINSTAR,
MIT,
MIC,
ALLEGRO,
KEMET,
ATI,
YAGEO,
PANASONIC,
MPS,
BROADCOM,
BB,
IXYS,
TDK,
MICRON,
BOURNS,
ISSI,
LAMBDA,
ERICSSON,
AVAGO,
HIT,
AGILENT,
VICOR,
SHARP,
PERICOM,
FUJI,
NIPPON CHEMI-CON,
INTERSIL,
AVX,
FUJITSU,
HYNIX,
MICREL,
SKYWORKS,
SIEMENS,
SANYO,
LITTELFUSE,
NUVOTON,
SK,
NVIDIA,
NICHICON,
COOPER,
EPCOS,
COILCRAFT,
MURATAPS,
SILICON,
MOLEX,
WINBOND,
REALTEK,
COSEL,
EPSON,
MURATA PS,
BSI,
SST,
UTC,
LATTICE,
MITSUBI,
BCD,
SIPEX,
EUPEC,
KEC,
VIA,
IMP,
JRC,
SPANSION,
IDT,
LG,
BOSCH,
LUCENT,
TRACOPOWE,
OSRAM,
RAMTRON,
TI,
AD,
ST,
NS,
ON,
IR,
INFINEON,
XILINX,
MAX,
MURATA,
ATMEL,
TOS,
ALTERA,
CY,
NXP,
FSC,
INTEL,
VISHAY,
SAMSUNG,
ROHM,
MICROCHIP,
NEC,
FREESCALE,
DALLAS,
POWER,
PHI,
MOT,
ALLEGRO,
LINEAR,
AMD,
RENESAS,
MIT,
WINSTAR,
MIC,
KEMET,
ATI,
YAGEO,
PANASONIC,
MPS,
BROADCOM,
BB,
TDK,
IXYS,
MICRON,
VICOR,
ISSI,
BOURNS,
FUJI,
LAMBDA,
ERICSSON,
AVAGO,
PERICOM,
HIT,
AGILENT,
SHARP,
INTERSIL,
NIPPON CHEMI-CON,
AVX,
FUJITSU,
HYNIX,
MICREL,
SKYWORKS,
SIEMENS,
SANYO,
LITTELFUSE,
NUVOTON,
SK,
NVIDIA,
NICHICON,
EPCOS,
WINBOND,
COOPER,
SILICON,
COILCRAFT,
MURATAPS,
REALTEK,
MOLEX,
COSEL,
EPSON,
SST,
BSI,
MURATA PS,
UTC,
LATTICE,
MITSUBI,
SIPEX,
BCD,
EUPEC,
KEC,
VIA,
JRC,
SPANSION,
LG,
IMP,
IDT,
ZARLINK,
BOSCH,
LUCENT,
TRACOPOWE,
OSRAM,
TI,
AD,
ST,
NS,
ON,
IR,
INFINEON,
XILINX,
MAX,
MURATA,
ATMEL,
TOS,
ALTERA,
CY,
NXP,
FSC,
INTEL,
VISHAY,
SAMSUNG,
ROHM,
MICROCHIP,
NEC,
DALLAS,
FREESCALE,
PHI,
POWER,
MOT,
ALLEGRO,
LINEAR,
AMD,
RENESAS,
MIT,
WINSTAR,
MIC,
KEMET,
ATI,
YAGEO,
PANASONIC,
MPS,
BROADCOM,
BB,
TDK,
IXYS,
MICRON,
VICOR,
ISSI,
BOURNS,
FUJI,
LAMBDA,
ERICSSON,
AVAGO,
PERICOM,
HIT,
AGILENT,
SHARP,
INTERSIL,
NIPPON CHEMI-CON,
AVX,
FUJITSU,
HYNIX,
MICREL,
SKYWORKS,
SIEMENS,
SANYO,
LITTELFUSE,
NUVOTON,
SK,
NVIDIA,
NICHICON,
EPCOS,
WINBOND,
COOPER,
SILICON,
COILCRAFT,
MURATAPS,
REALTEK,
MOLEX,
COSEL,
EPSON,
SST,
BSI,
KEC,
MURATA PS,
UTC,
LATTICE,
MITSUBI,
SIPEX,
BCD,
EUPEC,
VIA,
JRC,
SPANSION,
IMP,
LG,
IDT,
ZARLINK,
BOSCH,
LUCENT,
TRACOPOWE,
OSRAM,
TI,
AD,
ST,
NS,
ON,
IR,
INFINEON,
XILINX,
MAX,
MURATA,
ATMEL,
TOS,
ALTERA,
CY,
NXP,
FSC,
INTEL,
VISHAY,
SAMSUNG,
ROHM,
MICROCHIP,
NEC,
DALLAS,
FREESCALE,
PHI,
POWER,
MOT,
ALLEGRO,
LINEAR,
AMD,
RENESAS,
MIT,
WINSTAR,
MIC,
KEMET,
ATI,
YAGEO,
PANASONIC,
MPS,
BROADCOM,
BB,
TDK,
IXYS,
MICRON,
VICOR,
ISSI,
BOURNS,
FUJI,
LAMBDA,
ERICSSON,
AVAGO,
PERICOM,
HIT,
AGILENT,
SHARP,
INTERSIL,
NIPPON CHEMI-CON,
AVX,
FUJITSU,
HYNIX,
MICREL,
SKYWORKS,
SIEMENS,
SANYO,
LITTELFUSE,
NUVOTON,
SK,
NVIDIA,
NICHICON,
EPCOS,
WINBOND,
COOPER,
SILICON,
COILCRAFT,
MURATAPS,
REALTEK,
MOLEX,
COSEL,
EPSON,
SST,
BSI,
KEC,
MURATA PS,
UTC,
LATTICE,
MITSUBI,
SIPEX

 
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Product Summary
PH  BUW12AF
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: BUW12AF.


Available from: Tongyou (HK) Electronics Limited
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:SC417214DW, CY8CTMA300E-36LQXIT, XC4010E-4PQ208C, AZ7500EP-E1, DFA200AA120, A5367CA, DCR1594SW28, DD100GB120, DD70F120, MIP0245SY, DF654, IRFR3412PBF, CY7C1356C-166AXC, MAX3430ESA, BCP53-10, XC2S600E-6FGG456C

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: BUW12AF":

Post DatePart NumberBrandD/CDescQtyCompany
Wed Feb 1 06:02:00 UTC 2012BUW12AF (from hkin.com)PH 04+7749Tongyou (HK) Electronics Limited
Wed Feb 1 06:02:00 UTC 2012BUW12AF (from standard server 2)PH 04+7749Tongyou (HK) Electronics Limited
Wed Feb 1 06:02:00 UTC 2012BUW12AF (from parts server 2)PH 04+7749Tongyou (HK) Electronics Limited
Wed Feb 1 06:02:00 UTC 2012BUW12AF (from hkin.com 2)PH 04+7749Tongyou (HK) Electronics Limited
Wed Feb 1 06:02:00 UTC 2012BUW12AF (from hkin.com 2)PH 04+7749Tongyou (HK) Electronics Limited

Last record XC2S600E-6FGG456C:

Post DatePart NumberBrandD/CDescQtyCompany
Fri Feb 3 09:31:00 UTC 2012XC2S600E-6FGG456C (from hkin.com)XILINX05+BGA500Min Xin Technology (H.K.) Electronics Co.
Tue Feb 28 11:44:00 UTC 2012XC2S600E-6FGG456C (from hkin.com)XILINX05+BGA500Shenzhen Chuangxinda Electronic-Tech Co.,Ltd

Last record BCP53-10:

Post DatePart NumberBrandD/CDescQtyCompany
Wed Feb 29 01:32:00 UTC 2012BCP53-10T1G (from hkin.com)ON2010+SOT-223250000Atom (Hong Kong) Electronics Co., Limited

Last record MAX3430ESA:

Post DatePart NumberBrandD/CDescQtyCompany
Tue Feb 21 09:48:00 UTC 2012MAX3430ESA (from hkin.com)MAXIM10+5000Top Electronics Co.,

If you want to find more about BUW12AF, please visit us on HKin


vid:offerengine20120303 Part Number Prefix

BUW12AF,BUW12AF,Comments from user about BUW12AF: Thyristors are able to withstand very high reverse breakdown voltage and are also capable of carrying high current. While different synthesis tools have different capabilities, there exists a common synthesizable subset of VHDL that defines what language constructs and idioms map into common hardware for many synthesis tools. Microprocessors operate on numbers and symbols represented in the binary numeral system. Analog circuits use a continuous range of voltage as opposed to discrete levels as in digital circuits. Semiconductor components benefit from Moore's Law, an observed principle which states that, for a given price, semiconductor functionality doubles every two years. While different synthesis tools have different capabilities, there exists a common synthesizable subset of VHDL that defines what language constructs and idioms map into common hardware for many synthesis tools. The first bipolar transistors devices with substantial power handling capabilities were introduced in the 1960s. However, many formational and functional block parameters can be tuned (capacity parameters, memory size, element base, block composition and interconnection structure). Anything related to :BUW12AF, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: BUW12AF, search hkinventory: BUW12AF, They use electronic conduction in the solid state as opposed to the gaseous state or thermionic emission in a high vacuum. With the vertical structure, the current rating of the device is proportional to its area, and the voltage blocking capability is achieved in the height of the die. In order to directly represent operations which are common in hardware, there are many features of VHDL which are not found in Ada, such as an extended set of Boolean operators including nand and nor. voltage amplifiers or buffer amplifiers. Datasheet Dir, DataSheet Archive
Desirable properties of MOSFETs, such as their utility in low-power devices, usually in the CMOS configuration, allowed them to capture nearly all market share for digital circuits; more recently MOSFETs have captured most analog and power applications as well, including modern clocked analog circuits, voltage regulators, amplifiers, power transmitters, motor drivers, etc. The integrated circuit processor was produced in large numbers by highly automated processes, so unit cost was low. The middle, or base, region between the junctions is typically very narrow. Increasingly stringent pollution control standards effectively require automobile manufacturers to use microprocessor engine management systems, to allow optimal control of emissions over widely-varying operating conditions of an automobile. The design of pipelines is one of the central microarchitectural tasks. Performance is high because the components switch quickly and consume little power (compared to their discrete counterparts) as a result of the small size and close proximity of the components. Capacitors used as parts of electrical systems, for example, consist of metal foils separated by a layer of insulating film. While maintaining full compatibility with older versions, this proposed standard provides numerous extensions that make writing and managing VHDL code easier.
any passive component and active component such as:Diode, They use electronic conduction in the solid state as opposed to the gaseous state or thermionic emission in a high vacuum. Once a fault is detected, contacts within the circuit breaker must open to interrupt the circuit; some mechanically-stored energy (using something such as springs or compressed air) contained within the breaker is used to separate the contacts, although some of the energy required may be obtained from the fault current itself. These days analog circuitry may use digital or even microprocessor techniques to improve performance. When there is a potential difference (voltage) across the conductors, a static electric field develops across the dielectric, causing positive charge to collect on one plate and negative charge on the other plate. For example driver circuit
BUW12AF,BUW12AF,Comments from user about BUW12AF: Other embedded uses of 4-bit and 8-bit microprocessors, such as terminals, printers, various kinds of automation etc. The large contact area and short distance reduces both the inductance and resistance of the connection. Energy is stored in the electrostatic field. The desire for High definition (HD) content has led the industry to develop a number of technologies, such as WirelessHD or ITU-T G. The integrated circuit processor was produced in large numbers by highly automated processes, so unit cost was low. Instead of processing all of a long word on one integrated circuit, multiple circuits in parallel processed subsets of each data word. The trip solenoid that releases the latch is usually energized by a separate battery, although some high-voltage circuit breakers are self-contained with current transformers, protection relays, and an internal control power source.0 of VHDL-2006. Anything related to :BUW12AF, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: BUW12AFSee also: