Part: AD2S83AP

Index Files

Offer Index 3

BOSCH,
EXAR(SIPEX),
TI,
ST,
AD,
MAX,
XILINX,
NS,
ATMEL,
ALTERA,
NXP,
SAMSUNG,
MICROCHIP,
INTEL,
FSC,
CY,
ON,
TOS,
MURATA,
PANASONIC,
INFINEON,
AVX,
VISHAY,
FREESCALE,
MICRON,
IR,
LINEAR,
LATTICE,
SEMIKRON,
BRIGHT,
MOT,
EVERLIGHT,
模块,
FUJI,
MIT,
PHI,
NEC,
ROHM,
NVIDIA,
AVAGO,
AMD,
COILCRAFT,
BROADCOM,
DALLAS,
ALLEGRO,
YAGEO,
QUALCOMM,
INTERSIL,
RENESAS,
HARVATEK,
KEMET,
MICREL,
SANYO,
SUMIDA,
HIT,
MOLEX,
TDK,
ISD/NUVOTON,
JRC,
HYNIX,
STMICROELECTRONICS,
IDT,
BOURNS,
FUJITSU,
LITTELFUSE,
POWER,
REALTEK,
SEIKO,
MIC,
SHARP,
ATI,
SILICON,
TE,
ELPIDA,
TRACO,
COOPER,
MPS,
VICOR,
BB,
RECOM,
EPCOS,
EUPEC,
CREE,
IC,
SIPEX,
CIRRUS,
QFN,
DIODES,
HVCA,
CJ(CHINA),
SST,
EPSON,
SONY,
SPANSION,
BB/TI,
AOS,
CONEXANT,
TI ,
ISSI,
BOSCH,
EXAR(SIPEX),
AT,
TI,
ST,
AD,
NS,
MAX,
XILINX,
ATMEL,
ALTERA,
SAMSUNG,
NXP,
MICROCHIP,
FSC,
INTEL,
TOS,
CY,
ON,
MURATA,
FUJI,
PANASONIC,
INFINEON,
AVX,
VISHAY,
IR,
MICRON,
FREESCALE,
MIT,
LINEAR,
LATTICE,
SEMIKRON,
MOT,
BRIGHT,
NVIDIA,
EVERLIGHT,
模块,
PHI,
NEC,
ROHM,
SANYO,
AMD,
BROADCOM,
AVAGO,
COILCRAFT,
DALLAS,
ALLEGRO,
YAGEO,
QUALCOMM,
SHARP,
RENESAS,
INTERSIL,
MICREL,
HARVATEK,
KEMET,
HIT,
MOLEX,
SUMIDA,
ATI,
COOPER,
TDK,
ISD/NUVOTON,
HYNIX,
JRC,
STMICROELECTRONICS,
ISSI,
REALTEK,
IDT,
FUJITSU,
BOURNS,
LITTELFUSE,
POWER,
SEIKO,
MIC,
SILICON,
ELPIDA,
TE,
SONY,
TRACO,
EPCOS,
MPS,
BB,
EUPEC,
SST,
RECOM,
COSEL,
CREE,
IC,
DIODES,
SIPEX,
CIRRUS,
QFN,
HVCA,
CJ(CHINA),
EPSON,
SPANSION,
NXP/PHI,
CONEXANT,
BB/TI,
ASTEC,
AOS,
TI ,
JAE,
TI,
AD,
ST,
XILINX,
MAX,
NS,
ATMEL,
ALTERA,
SAMSUNG,
NXP,
MICROCHIP,
INTEL,
FSC,
CY,
TOS,
MURATA,
FUJI,
PANASONIC,
ON,
INFINEON,
AVX,
IR,
MICRON,
MIT,
LINEAR,
SEMIKRON,
VISHAY,
LATTICE,
BRIGHT,
模块,
MOT,
FREESCALE,
NVIDIA,
NEC,
ROHM,
SANYO,
PHI,
BROADCOM,
AMD,
DALLAS,
YAGEO,
QUALCOMM,
SHARP,
INTERSIL,
RENESAS,
HARVATEK,
AVAGO,
KEMET,
HIT,
COOPER,
MICREL,
MOLEX,
ISD/NUVOTON,
TDK,
JRC,
ISSI,
HYNIX,
ATI,
IDT,
COILCRAFT,
FUJITSU,
BOURNS,
LITTELFUSE,
SEIKO,
TE,
ELPIDA,
TRACO,
SONY,
POWER,
EPCOS,
MPS,
RECOM,
EUPEC,
SST,
COSEL,
CREE,
IC,
EVERLIGHT,
SILICON,
QFN,
CIRRUS,
CJ(CHINA),
SIPEX,
BB,
NXP/PHI,
EPSON,
DIODES,
ASTEC,
AOS,
TI ,
SPANSION,
JAE,
JST,
CONEXANT,
MXIC,
AUO,
EXAR(SIPEX),
MIC,
REALTEK,
AT,
TI,
AD,
ST,
ALTERA,
MAX,
XILINX,
NS,
ATMEL,
NXP,
SAMSUNG,
MICROCHIP,
INTEL,
CY,
FSC,
TOS,
MURATA,
PANASONIC,
ON,
INFINEON,
AVX,
FUJI,
IR,
SEMIKRON,
MICRON,
LINEAR,
VISHAY,
LATTICE,
MIT,
BRIGHT,
模块,
FREESCALE,
NEC,
MOT,
NVIDIA,
ROHM,
SANYO,
BROADCOM,
AMD,
PHI,
QUALCOMM,
STMICROELECTRONICS,
DALLAS,
RENESAS,
YAGEO,
SHARP,
INTERSIL,
HIT,
AVAGO,
HARVATEK,
KEMET,
COOPER,
MICREL,
MOLEX,
ISD/NUVOTON,
TDK,
JRC,
ISSI,
HYNIX,
ATI,
IDT,
FUJITSU,
COILCRAFT,
BOURNS,
LITTELFUSE,
SEIKO,
EUPEC,
TE,
ELPIDA,
SONY,
TRACO,
MPS,
POWER,
EPCOS,
SST,
RECOM,
ASTEC,
CREE,
SILICON,
IC,
EVERLIGHT,
CIRRUS,
ABB,
QFN,
BB,
CJ(CHINA),
EPSON,
SIPEX,
NXP/PHI,
DIODES,
ALLEGRO,
AOS,
IXYS,
TI ,
FTDI,
SPANSION,
VICOR,
JAE,
JST,
MXIC,
CONEXANT,
TI,
AD,
ST,
ALTERA,
XILINX,
NS,
MAX,
ATMEL,
NXP,
SAMSUNG,
MICROCHIP,
INTEL,
CY,
MURATA,
FSC,
PANASONIC,
TOS,
ON,
INFINEON,
AVX,
IR,
FUJI,
MICRON,
LINEAR,
LATTICE,
SEMIKRON,
VISHAY,
BRIGHT,
模块,
FREESCALE,
MIT,
NVIDIA,
MOT,
SANYO,
NEC,
AMD,
BROADCOM,
ROHM,
STMICROELECTRONICS,
PHI,
DALLAS,
RENESAS,
YAGEO,
SHARP,
QUALCOMM,
HIT,
HARVATEK,
KEMET,
AVAGO,
COOPER,
INTERSIL,
MOLEX,
MICREL,
ISD/NUVOTON,
TDK,
ISSI,
AGILENT,
ATI,
HYNIX,
COILCRAFT,
BOURNS,
LITTELFUSE,
FUJITSU,
IDT,
SEIKO,
EUPEC,
TE,
ELPIDA,
TRACO,
CIRRUS,
SONY,
MPS,
EPCOS,
RECOM,
SST,
ASTEC,
CREE,
AUO,
IC,
SILICON,
ABB,
QFN,
EVERLIGHT,
CJ(CHINA),
SIPEX,
EPSON,
NXP/PHI,
DIODES,
BB,
AOS,
POWER,
ALLEGRO,
IXYS,
TI ,
FTDI,
VICOR,
JAE,
JRC,
JST,
MXIC,
TI,
AD,
ST,
ALTERA,
NS,
XILINX,
MAX,
ATMEL,
SAMSUNG,
NXP,
INTEL,
MICROCHIP,
CY,
FSC,
MURATA,
TOS,
PANASONIC,
ON,
INFINEON,
IR,
AVX,
LINEAR,
MICRON,
NVIDIA,
FUJI,
LATTICE,
VISHAY,
SEMIKRON,
FREESCALE,
MOT,
BRIGHT,
AMD,
模块,
NEC,
PHI,
BROADCOM,
ROHM,
SANYO,
STMICROELECTRONICS,
DALLAS,
RENESAS,
MIT,
SHARP,
YAGEO,
QUALCOMM,
HIT,
HARVATEK,
AVAGO,
KEMET,
INTERSIL,
COOPER,
MOLEX,
MICREL,
ATI,
ISD/NUVOTON,
TDK,
FUJITSU,
AGILENT,
HYNIX,
ISSI,
IDT,
COILCRAFT,
EUPEC,
BOURNS,
LITTELFUSE,
SEIKO,
TE,
ELPIDA,
CIRRUS,
TRACO,
SONY,
EPCOS,
MPS,
SST,
RECOM,
LAMBDA,
BB,
CREE,
AUO,
IC,
SILICON,
EVERLIGHT,
QFN,
CJ(CHINA),
EPSON,
SIPEX,
DIODES,
IXYS,
NXP/PHI,
BB/TI,
ASTEC,
ALLEGRO,
SPANSION,
AOS,
POWER,
CONEXANT,
TI ,
FTDI,
MXIC,
VICOR,
TI,
AD,
ST,
ALTERA,
XILINX,
NS,
ATMEL,
MAX,
NXP,
INTEL,
SAMSUNG,
MICROCHIP,
CY,
FSC,
MURATA,
PANASONIC,
TOS,
ON,
AVX,
IR,
INFINEON,
VISHAY,
LINEAR,
NVIDIA,
FUJI,
LATTICE,
MICRON,
BRIGHT,
AMD,
FREESCALE,
MOT,
模块,
PHI,
BROADCOM,
NEC,
SEMIKRON,
ROHM,
SANYO,
STMICROELECTRONICS,
DALLAS,
RENESAS,
SHARP,
YAGEO,
QUALCOMM,
HIT,
MIT,
HARVATEK,
KEMET,
AVAGO,
COOPER,
MOLEX,
INTERSIL,
MICREL,
ATI,
ISD/NUVOTON,
TDK,
AGILENT,
ISSI,
BOURNS,
HYNIX,
COILCRAFT,
IDT,
LITTELFUSE,
FUJITSU,
KOA KAOHSIUNG CORPORATION,
SEIKO,
ELPIDA,
TRACO,
CIRRUS,
MPS,
SONY,
EPCOS,
RECOM,
SST,
LAMBDA,
EPSON,
AUO,
CREE,
IC,
BB,
SILICON,
EVERLIGHT,
QFN,
CJ(CHINA),
NXP/PHI,
DIODES,
SIPEX,
STACKPOLE TECHNOLOGY, INC.,
ASTEC,
BB/TI,
MXIC,
POWER,
AOS,
SPANSION,
TI ,
ALLEGRO,
FTDI,
IXYS,
REALTEK,
VICOR,
TI,
AD,
ST,
ALTERA,
ATMEL,
XILINX,
NS,
MAX,
NXP,
INTEL,
SAMSUNG,
MICROCHIP,
CY,
FSC,
TOS,
MURATA,
ON,
PANASONIC,
IR,
AVX,
VISHAY,
INFINEON,
LINEAR,
FREESCALE,
NVIDIA,
FUJI,
MICRON,
LATTICE,
AMD,
BRIGHT,
MOT,
PHI,
NEC,
BROADCOM,
SANYO,
ROHM,
SEMIKRON,
STMICROELECTRONICS,
RENESAS,
DALLAS,
SHARP,
YAGEO,
INTERSIL,
QUALCOMM,
HIT,
MIT,
HARVATEK,
KEMET,
AVAGO,
MOLEX,
MICREL,
COOPER,
ATI,
ISD/NUVOTON,
TDK,
ISSI,
AGILENT,
HYNIX,
IDT,
BOURNS,
COILCRAFT,
FUJITSU,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
SEIKO,
ELPIDA,
CIRRUS,
TRACO,
MPS,
POWER,
AOS,
SST,
EPCOS,
SONY,
DIP,
EPSON,
SIPEX,
RECOM,
模块,
LAMBDA,
EUPEC,
AUO,
IC,
BB,
CREE,
QFN,
SILICON,
EVERLIGHT,
SPANSION,
CJ(CHINA),
DIODES,
NXP/PHI,
STACKPOLE TECHNOLOGY, INC.,
MXIC,
ASTEC,
BB/TI,
WINBOND,
ALLEGRO,
TI ,
FTDI,
TI,
ST,
AD,
ALTERA,
ATMEL,
XILINX,
NS,
MAX,
NXP,
INTEL,
SAMSUNG,
MICROCHIP,
CY,
FSC,
TOS,
MURATA,
ON,
PANASONIC,
VISHAY,
INFINEON,
AVX,
FUJI,
IR,
MICRON,
LINEAR,
FREESCALE,
NVIDIA,
LATTICE,
SEMIKRON,
MOT,
BRIGHT,
AMD,
NEC,
PHI,
SANYO,
ROHM,
BROADCOM,
STMICROELECTRONICS,
RENESAS,
SHARP,
DALLAS,
YAGEO,
INTERSIL,
HIT,
QUALCOMM,
MIT,
AVAGO,
HARVATEK,
KEMET,
MOLEX,
COOPER,
MICREL,
ATI,
ISD/NUVOTON,
ISSI,
TDK,
AGILENT,
HYNIX,
IDT,
BOURNS,
COILCRAFT,
FUJITSU,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
SEIKO,
ELPIDA,
CIRRUS,
TRACO,
MPS,
AOS,
EPCOS,
POWER,
DIP,
LAMBDA,
SIPEX,
RECOM,
模块,
EUPEC,
BB/TI,
SST,
AUO,
CREE,
IC,
EVERLIGHT,
QFN,
SILICON,
ABB,
RECTRON,
EPSON,
CJ(CHINA),
DIODES,
SONY,
NXP/PHI,
STACKPOLE TECHNOLOGY, INC.,
SPANSION,
ASTEC,
WINBOND,
ALLEGRO,
TI ,
CONEXANT,
TI,
ST,
AD,
ALTERA,
ATMEL,
XILINX,
NS,
MAX,
NXP,
INTEL,
SAMSUNG,
MICROCHIP,
FSC,
CY,
TOS,
MURATA,
ON,
PANASONIC,
INFINEON,
VISHAY,
AVX,
IR,
FUJI,
MICRON,
LINEAR,
FREESCALE,
NVIDIA,
SEMIKRON,
LATTICE,
MOT,
NEC,
AMD,
BRIGHT,
PHI,
SANYO,
ROHM,
BROADCOM,
RENESAS,
STMICROELECTRONICS,
DALLAS,
SHARP,
YAGEO,
INTERSIL,
HIT,
QUALCOMM,
MIT,
AVAGO,
KEMET,
HARVATEK,
MOLEX,
COOPER,
MICREL,
ATI,
ISD/NUVOTON,
TDK,
FUJITSU,
ISSI,
AGILENT,
HYNIX,
IDT,
BOURNS,
COILCRAFT,
LITTELFUSE,
SEIKO,
KOA KAOHSIUNG CORPORATION,
ELPIDA,
EPCOS,
TRACO,
CIRRUS,
MPS,
POWER,
LAMBDA,
DIP,
RECOM,
模块,
EUPEC,
SST,
AUO,
BB/TI,
CREE,
IC,
SILICON,
EVERLIGHT,
QFN,
ABB,
SONY,
EPSON,
RECTRON,
SIPEX,
DIODES,
CJ(CHINA),
SPANSION,
AOS,
ALLEGRO,
NXP/PHI,
STACKPOLE TECHNOLOGY, INC.,
WINBOND,
CONEXANT,
ASTEC,
MXIC,
TI,
ST,
AD,
ALTERA,
ATMEL,
NS,
MAX,
XILINX,
NXP,
INTEL,
MICROCHIP,
CY,
SAMSUNG,
FSC,
TOS,
MURATA,
ON,
PANASONIC,
INFINEON,
VISHAY,
AVX,
FUJI,
IR,
LINEAR,
FREESCALE,
NVIDIA,
SEMIKRON,
LATTICE,
MICRON,
MOT,
NEC,
AMD,
BRIGHT,
PHI,
BROADCOM,
ROHM,
SANYO,
STMICROELECTRONICS,
DALLAS,
RENESAS,
SHARP,
YAGEO,
INTERSIL,
HIT,
QUALCOMM,
AVAGO,
MIT,
KEMET,
HARVATEK,
MOLEX,
COOPER,
MICREL,
ATI,
ISD/NUVOTON,
TDK,
ISSI,
AGILENT,
FUJITSU,
HYNIX,
IDT,
BOURNS,
COILCRAFT,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
SEIKO,
ELPIDA,
TRACO,
CIRRUS,
EPCOS,
MPS,
POWER,
LAMBDA,
DIP,
RECOM,
模块,
EUPEC,
SST,
AUO,
BB/TI,
CREE,
IC,
SILICON,
EVERLIGHT,
ABB,
QFN,
SONY,
EPSON,
RECTRON,
SIPEX,
CJ(CHINA),
AOS,
ALLEGRO,
NXP/PHI,
SPANSION,
STACKPOLE TECHNOLOGY, INC.,
WINBOND,
CONEXANT,
ASTEC,
REALTEK,
TI ,
TI,
ST,
AD,
ALTERA,
ATMEL,
NS,
MAX,
XILINX,
NXP,
INTEL,
MICROCHIP,
CY,
SAMSUNG,
FSC,
TOS,
MURATA,
ON,
PANASONIC,
INFINEON,
VISHAY,
AVX,
FUJI,
IR,
LINEAR,
FREESCALE,
NVIDIA,
SEMIKRON,
LATTICE,
MICRON,
MOT,
NEC,
AMD,
BRIGHT,
PHI,
BROADCOM,
ROHM,
SANYO,
STMICROELECTRONICS,
DALLAS,
RENESAS,
SHARP,
YAGEO,
INTERSIL,
HIT,
QUALCOMM,
AVAGO,
MIT,
KEMET,
HARVATEK,
ISSI,
MOLEX,
COOPER,
MICREL,
NUVOTON,
ATI,
ISD/NUVOTON,
TDK,
AGILENT,
FUJITSU,
HYNIX,
IDT,
BOURNS,
COILCRAFT,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
SEIKO,
ELPIDA,
TRACO,
CIRRUS,
EPCOS,
MPS,
POWER,
LAMBDA,
DIP,
RECOM,
模块,
EUPEC,
WINBOND,
SST,
AUO,
BB/TI,
CREE,
IC,
SILICON,
BCD,
EVERLIGHT,
ABB,
QFN,
SONY,
EPSON,
RECTRON,
SIPEX,
CJ(CHINA),
AOS,
ALLEGRO,
NXP/PHI,
SPANSION,
STACKPOLE TECHNOLOGY, INC.,
CONEXANT,
ASTEC,
TI,
ST,
AD,
ALTERA,
ATMEL,
NS,
MAX,
XILINX,
NXP,
INTEL,
MICROCHIP,
CY,
SAMSUNG,
FSC,
MURATA,
TOS,
PANASONIC,
ON,
INFINEON,
VISHAY,
AVX,
FUJI,
IR,
FREESCALE,
LINEAR,
NVIDIA,
SEMIKRON,
LATTICE,
MICRON,
MOT,
AMD,
BRIGHT,
NEC,
PHI,
BROADCOM,
ROHM,
STMICROELECTRONICS,
SANYO,
DALLAS,
SHARP,
RENESAS,
YAGEO,
INTERSIL,
HIT,
QUALCOMM,
MIT,
KEMET,
AVAGO,
HARVATEK,
ISSI,
MOLEX,
COOPER,
MICREL,
NUVOTON,
ATI,
ISD/NUVOTON,
TDK,
AGILENT,
FUJITSU,
IDT,
HYNIX,
BOURNS,
COILCRAFT,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
SEIKO,
ELPIDA,
TRACO,
CIRRUS,
EPCOS,
MPS,
LAMBDA,
DIP,
RECOM,
模块,
EUPEC,
WINBOND,
SST,
AUO,
BB/TI,
CREE,
IC,
SILICON,
BCD,
EVERLIGHT,
ABB,
QFN,
EPSON,
RECTRON,
POWER,
SONY,
CJ(CHINA),
AOS,
NXP/PHI,
SIPEX,
SPANSION,
STACKPOLE TECHNOLOGY, INC.,
ASTEC,
ALLEGRO,
TI ,
TI,
AD,
ST,
ALTERA,
ATMEL,
NS,
MAX,
XILINX,
NXP,
INTEL,
SAMSUNG,
MICROCHIP,
CY,
FSC,
MURATA,
TOS,
ON,
PANASONIC,
INFINEON,
VISHAY,
AVX,
FUJI,
IR,
FREESCALE,
LINEAR,
NVIDIA,
SEMIKRON,
MICRON,
LATTICE,
AMD,
MOT,
BRIGHT,
NEC,
PHI,
BROADCOM,
ROHM,
DALLAS,
STMICROELECTRONICS,
SANYO,
ALLEGRO,
SHARP,
RENESAS,
YAGEO,
INTERSIL,
HIT,
QUALCOMM,
MIT,
KEMET,
AVAGO,
ISSI,
HARVATEK,
MOLEX,
MICREL,
COOPER,
NUVOTON,
ATI,
ISD/NUVOTON,
TDK,
AGILENT,
FUJITSU,
HYNIX,
IDT,
BOURNS,
COILCRAFT,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
INNOLUX,
SEIKO,
ELPIDA,
TRACO,
CIRRUS,
EPCOS,
MPS,
SST,
LAMBDA,
DIP,
RECOM,
模块,
EUPEC,
WINBOND,
AUO,
BB/TI,
SILICON,
CREE,
IC,
BB,
BCD,
EVERLIGHT,
ABB,
POWER,
QFN,
EPSON,
RECTRON,
SPANSION,
SONY,
CJ(CHINA),
AOS,
NXP/PHI,
SIPEX,
STACKPOLE TECHNOLOGY, INC.,
TI,
AD,
ST,
MAX,
ALTERA,
ATMEL,
NXP,
NS,
XILINX,
INTEL,
MICROCHIP,
SAMSUNG,
CY,
FSC,
ON,
MURATA,
TOS,
PANASONIC,
INFINEON,
VISHAY,
IR,
AVX,
FREESCALE,
LINEAR,
NVIDIA,
LATTICE,
MICRON,
MOT,
SEMIKRON,
AMD,
NEC,
PHI,
BROADCOM,
ALLEGRO,
ROHM,
SANYO,
DALLAS,
FUJI,
SHARP,
STMICROELECTRONICS,
COILCRAFT,
RENESAS,
YAGEO,
INTERSIL,
AVAGO,
QUALCOMM,
HIT,
MIT,
KEMET,
ISSI,
HARVATEK,
SUMIDA,
MOLEX,
COOPER,
MICREL,
TDK,
NUVOTON,
ATI,
ISD/NUVOTON,
FUJITSU,
HYNIX,
AGILENT,
IDT,
BOURNS,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
TRACO,
SEIKO,
INNOLUX,
BB,
ELPIDA,
CIRRUS,
EPCOS,
MPS,
SST,
SILICON,
DIP,
EUPEC,
RECOM,
模块,
POWER,
WINBOND,
AUO,
BB/TI,
CREE,
IC,
EVERLIGHT,
BCD,
SPANSION,
EPSON,
SONY,
RECTRON,
AOS,
CJ(CHINA),
QFN,
SIPEX,
NXP/PHI,
STACKPOLE TECHNOLOGY, INC.,
COSEL,
MXIC,
TI,
AD,
ST,
MAX,
ALTERA,
ATMEL,
NXP,
NS,
XILINX,
INTEL,
MICROCHIP,
CY,
SAMSUNG,
ON,
FSC,
MURATA,
TOS,
INFINEON,
PANASONIC,
VISHAY,
IR,
AVX,
FREESCALE,
LINEAR,
NVIDIA,
LATTICE,
MICRON,
MOT,
AMD,
SEMIKRON,
NEC,
PHI,
BROADCOM,
ALLEGRO,
ROHM,
SANYO,
DALLAS,
FUJI,
SHARP,
STMICROELECTRONICS,
COILCRAFT,
RENESAS,
YAGEO,
INTERSIL,
AVAGO,
HIT,
QUALCOMM,
MIT,
ISSI,
KEMET,
HARVATEK,
SUMIDA,
MOLEX,
COOPER,
MICREL,
TDK,
NUVOTON,
ATI,
ISD/NUVOTON,
FUJITSU,
AGILENT,
IDT,
BOURNS,
LITTELFUSE,
HYNIX,
KOA KAOHSIUNG CORPORATION,
TRACO,
BB,
SEIKO,
INNOLUX,
CIRRUS,
EPCOS,
MPS,
SST,
SILICON,
DIP,
EUPEC,
RECOM,
模块,
POWER,
WINBOND,
TE CONNECTIVITY ,
AUO,
BB/TI,
CREE,
IC,
EVERLIGHT,
BCD,
SPANSION,
SONY,
EPSON,
RECTRON,
DIODES,
AOS,
CJ(CHINA),
QFN,
SIPEX,
NXP/PHI,
STACKPOLE TECHNOLOGY, INC.,
COSEL,
TI,
AD,
MAX,
ALTERA,
ST,
ATMEL,
NXP,
NS,
MICROCHIP,
XILINX,
TOS,
CY,
ON,
INFINEON,
FSC,
INTEL,
MURATA,
PANASONIC,
IR,
VISHAY,
MICRON,
SAMSUNG,
AVX,
FREESCALE,
LINEAR,
LATTICE,
MOT,
SEMIKRON,
MIT,
NEC,
PHI,
BROADCOM,
ALLEGRO,
DALLAS,
COILCRAFT,
AMD,
ROHM,
RENESAS,
SHARP,
FUJI,
NVIDIA,
STMICROELECTRONICS,
YAGEO,
AVAGO,
INTERSIL,
HIT,
QUALCOMM,
KEMET,
HARVATEK,
ISSI,
SUMIDA,
MOLEX,
COOPER,
MICREL,
TDK,
NUVOTON,
SANYO,
ISD/NUVOTON,
AGILENT,
FUJITSU,
VICOR,
IDT,
BOURNS,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
TRACO,
BB,
SEIKO,
INNOLUX,
SONY,
CIRRUS,
EPCOS,
MPS,
SILICON,
DIP,
SST,
模块,
POWER,
TE CONNECTIVITY ,
BB/TI,
AUO,
WINBOND,
IC,
CREE,
EVERLIGHT,
ATI,
EUPEC,
BCD,
SPANSION,
EPSON,
DIODES,
AOS,
CJ(CHINA),
QFN,
NXP/PHI,
SIPEX,
STACKPOLE TECHNOLOGY, INC.,
MIC,
JST,
MXIC,
TI,
AD,
MAX,
ST,
ALTERA,
NS,
ATMEL,
NXP,
MICROCHIP,
XILINX,
TOS,
CY,
ON,
INFINEON,
INTEL,
FSC,
MURATA,
PANASONIC,
IR,
VISHAY,
MICRON,
SAMSUNG,
FREESCALE,
AVX,
LINEAR,
LATTICE,
MOT,
SEMIKRON,
PHI,
NEC,
RENESAS,
MIT,
BROADCOM,
ALLEGRO,
DALLAS,
NVIDIA,
ROHM,
COILCRAFT,
AMD,
SHARP,
FUJI,
STMICROELECTRONICS,
YAGEO,
HIT,
INTERSIL,
AVAGO,
QUALCOMM,
ISSI,
KEMET,
HARVATEK,
SUMIDA,
MOLEX,
MICREL,
COOPER,
SANYO,
AOS,
HYNIX,
TI ,
IXYS,
REALTEK,
WCH,
ASTEC,
EUPEC,
AUO,
BOSCH,
TDK,
NUVOTON,
BB,
ISD/NUVOTON,
FUJITSU,
AGILENT,
VICOR,
IDT,
BOURNS,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
SONY,
TRACO,
SEIKO,
INNOLUX,
CIRRUS,
MPS,
EPCOS,
SST,
SILICON,
DIP,
模块,
POWER,
TE CONNECTIVITY ,
BB/TI,
WINBOND,
AUO,
IC,
CREE,
EVERLIGHT,
ATI,
EUPEC,
BCD,
SPANSION,
MIC,
EPSON,
DIODES,
AOS,
CJ(CHINA),
QFN,
SIPEX,
NXP/PHI,
STACKPOLE TECHNOLOGY, INC.,
HYNIX,
MXIC,
TI,
AD,
ST,
MAX,
NS,
NXP,
ALTERA,
TOS,
ATMEL,
ON,
MICROCHIP,
INTEL,
XILINX,
INFINEON,
VISHAY,
CY,
FSC,
MURATA,
PANASONIC,
MICRON,
SAMSUNG,
IR,
AVX,
LINEAR,
FREESCALE,
LATTICE,
MOT,
AMD,
PHI,
SEMIKRON,
NEC,
NVIDIA,
RENESAS,
BROADCOM,
ALLEGRO,
ROHM,
COILCRAFT,
DALLAS,
SHARP,
AVAGO,
YAGEO,
HIT,
INTERSIL,
KEMET,
HARVATEK,
ISSI,
MIT,
SANYO,
SUMIDA,
MOLEX,
COOPER,
MICREL,
QUALCOMM,
NUVOTON,
BB,
ATI,
ISD/NUVOTON,
TDK,
FUJI,
FUJITSU,
AGILENT,
VICOR,
BOURNS,
EUPEC,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
MCP,
TRACO,
IDT,
SEIKO,
SONY,
INNOLUX,
EPCOS,
MPS,
CIRRUS,
SST,
SILICON,
DIP,
RECOM,
模块,
POWER,
TE CONNECTIVITY ,
BB/TI,
AUO,
IC,
EVERLIGHT,
SPANSION,
WINBOND,
CREE,
MIC,
BCD,
DIODES,
AOS,
CJ(CHINA),
QFN,
NXP/PHI,
AT,
EPSON,
STACKPOLE TECHNOLOGY, INC.,
MXIC,
TI,
AD,
ST,
MAX,
NS,
NXP,
ALTERA,
TOS,
ATMEL,
FSC,
ON,
MICROCHIP,
INTEL,
XILINX,
INFINEON,
VISHAY,
CY,
MURATA,
PANASONIC,
MICRON,
SAMSUNG,
IR,
AVX,
FREESCALE,
LINEAR,
AMD,
LATTICE,
MOT,
PHI,
SEMIKRON,
NEC,
NVIDIA,
RENESAS,
BROADCOM,
ALLEGRO,
ROHM,
COILCRAFT,
DALLAS,
SHARP,
AVAGO,
YAGEO,
FUJI,
HIT,
HARVATEK,
ISSI,
KEMET,
MIT,
SANYO,
INTERSIL,
MOLEX,
SUMIDA,
COOPER,
MICREL,
QUALCOMM,
NUVOTON,
BB,
ATI,
ISD/NUVOTON,
TDK,
FUJITSU,
AGILENT,
VICOR,
BOURNS,
EUPEC,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
MCP,
SONY,
TRACO,
IDT,
SEIKO,
INNOLUX,
EPCOS,
MPS,
CIRRUS,
SST,
SPANSION,
DIP,
SILICON,
RECOM,
模块,
TE CONNECTIVITY ,
WINBOND,
BB/TI,
AUO,
IC,
EVERLIGHT,
BCD,
CREE,
MIC,
POWER,
DIODES,
AOS,
HYNIX,
CJ(CHINA),
QFN,
NXP/PHI,
AT,
EPSON,
STACKPOLE TECHNOLOGY, INC.,
TI,
AD,
ST,
MAX,
NS,
NXP,
ALTERA,
ATMEL,
FSC,
MICROCHIP,
ON,
TOS,
INTEL,
XILINX,
INFINEON,
CY,
VISHAY,
MURATA,
PANASONIC,
MICRON,
SAMSUNG,
IR,
AVX,
FREESCALE,
LINEAR,
MOT,
LATTICE,
AMD,
SEMIKRON,
PHI,
NEC,
IXYS,
BROADCOM,
ALLEGRO,
ROHM,
RENESAS,
COILCRAFT,
AVAGO,
DALLAS,
SHARP,
NVIDIA,
YAGEO,
FUJI,
HIT,
模块,
SANYO,
HARVATEK,
ISSI,
KEMET,
MIT,
INTERSIL,
MOLEX,
SUMIDA,
ATI,
COOPER,
QUALCOMM,
MICREL,
NUVOTON,
POWER,
TDK,
BB,
ISD/NUVOTON,
VICOR,
EUPEC,
IDT,
BOURNS,
LITTELFUSE,
FUJITSU,
SONY,
TRACO,
KOA KAOHSIUNG CORPORATION,
MCP,
SEIKO,
EPCOS,
MPS,
SST,
SPANSION,
SILICON,
RECOM,
MURATA PS,
WINBOND,
TE CONNECTIVITY ,
INNOLUX,
BB/TI,
EVERLIGHT,
IC,
BCD,
CREE,
MIC,
CIRRUS,
DIODES,
AT,
QFN,
AOS,
NXP/PHI,
EPSON,
STACKPOLE TECHNOLOGY, INC.,
JST,
REALTEK,
MXIC,
TI,
AD,
ST,
MAX,
NS,
NXP,
ALTERA,
ATMEL,
FSC,
MICROCHIP,
ON,
TOS,
INTEL,
XILINX,
INFINEON,
CY,
VISHAY,
MURATA,
PANASONIC,
MICRON,
SAMSUNG,
IR,
AVX,
FREESCALE,
LINEAR,
MOT,
SEMIKRON,
LATTICE,
AMD,
PHI,
NEC,
IXYS,
BROADCOM,
ALLEGRO,
ROHM,
RENESAS,
AVAGO,
COILCRAFT,
DALLAS,
SHARP,
NVIDIA,
YAGEO,
FUJI,
HIT,
模块,
MIT,
SANYO,
HARVATEK,
ISSI,
KEMET,
INTERSIL,
MOLEX,
SUMIDA,
ATI,
COOPER,
QUALCOMM,
MICREL,
NUVOTON,
POWER,
TDK,
BB,
ISD/NUVOTON,
VICOR,
EUPEC,
IDT,
BOURNS,
FUJITSU,
LITTELFUSE,
SONY,
TRACO,
KOA KAOHSIUNG CORPORATION,
MCP,
SEIKO,
EPCOS,
MPS,
SST,
SPANSION,
SILICON,
RECOM,
MURATA PS,
WINBOND,
TE CONNECTIVITY ,
INNOLUX,
BB/TI,
EVERLIGHT,
IC,
BCD,
CREE,
MIC,
CIRRUS,
DIODES,
AT,
QFN,
AOS,
NXP/PHI,
EPSON,
STACKPOLE TECHNOLOGY, INC.,
JST,
REALTEK,
MXIC,
TI,
AD,
ST,
MAX,
NS,
NXP,
FSC,
MICROCHIP,
ATMEL,
ALTERA,
ON,
XILINX,
TOS,
INFINEON,
CY,
INTEL,
VISHAY,
MURATA,
MICRON,
PANASONIC,
SAMSUNG,
AVX,
IR,
FREESCALE,
LINEAR,
MOT,
NEC,
SEMIKRON,
LATTICE,
AMD,
ALLEGRO,
PHI,
BROADCOM,
HIT,
ROHM,
RENESAS,
AVAGO,
DALLAS,
SHARP,
YAGEO,
FUJI,
IXYS,
SUMIDA,
模块,
MIT,
HARVATEK,
SANYO,
KEMET,
MOLEX,
COOPER,
QUALCOMM,
MICREL,
NUVOTON,
BB,
ISD/NUVOTON,
TDK,
NVIDIA,
VICOR,
INTERSIL,
EUPEC,
COILCRAFT,
BOURNS,
FUJITSU,
LITTELFUSE,
SONY,
TRACO,
MCP,
SEIKO,
IDT,
POWER,
EPCOS,
ATI,
ISSI,
MPS,
SILICON,
RECOM,
SPANSION,
TE CONNECTIVITY ,
VISHAY DALE,
WINBOND,
INNOLUX,
BB/TI,
EVERLIGHT,
IC,
SST,
CREE,
BCD,
MIC,
DIODES,
CIRRUS,
AT,
QFN,
AOS,
EPSON,
JST,
AUO,
HYNIX,
TI ,
JAE,
WCH,
TI,
AD,
ST,
MAX,
NS,
NXP,
FSC,
MICROCHIP,
ATMEL,
ALTERA,
ON,
XILINX,
TOS,
INFINEON,
CY,
INTEL,
VISHAY,
MURATA,
MICRON,
PANASONIC,
SAMSUNG,
AVX,
IR,
FREESCALE,
MOT,
LINEAR,
NEC,
SEMIKRON,
LATTICE,
AMD,
ALLEGRO,
PHI,
BROADCOM,
HIT,
ROHM,
RENESAS,
AVAGO,
DALLAS,
RECOM,
SHARP,
YAGEO,
FUJI,
IXYS,
SUMIDA,
模块,
MIT,
HARVATEK,
SANYO,
KEMET,
MOLEX,
COOPER,
QUALCOMM,
MICREL,
NUVOTON,
BB,
ISD/NUVOTON,
TDK,
NVIDIA,
TRACO,
VICOR,
INTERSIL,
EUPEC,
COILCRAFT,
BOURNS,
FUJITSU,
LITTELFUSE,
SONY,
MCP,
SEIKO,
IDT,
POWER,
EPCOS,
ATI,
ISSI,
MPS,
SILICON,
SPANSION,
TE CONNECTIVITY ,
VISHAY DALE,
WINBOND,
INNOLUX,
BB/TI,
EVERLIGHT,
IC,
SST,
CREE,
BCD,
MIC,
DIODES,
CIRRUS,
AT,
QFN,
AOS,
EPSON,
JST,
AUO,
HYNIX,
TI ,
JAE,
WCH,
TI,
AD,
ST,
MAX,
NS,
NXP,
MICROCHIP,
FSC,
ATMEL,
ALTERA,
ON,
XILINX,
TOS,
CY,
INTEL,
INFINEON,
VISHAY,
MURATA,
MICRON,
PANASONIC,
SAMSUNG,
AVX,
FREESCALE,
IR,
LINEAR,
MOT,
LATTICE,
NEC,
AMD,
ALLEGRO,
PHI,
SEMIKRON,
HIT,
BROADCOM,
ROHM,
RENESAS,
DALLAS,
RECOM,
AVAGO,
SHARP,
YAGEO,
IXYS,
FUJI,
SUMIDA,
模块,
HARVATEK,
KEMET,
MIT,
SANYO,
MOLEX,
COOPER,
QUALCOMM,
MICREL,
NUVOTON,
BB,
ISD/NUVOTON,
TDK,
NVIDIA,
TRACO,
VICOR,
COILCRAFT,
INTERSIL,
BOURNS,
LITTELFUSE,
SONY,
MCP,
EUPEC,
SEIKO,
POWER,
FUJITSU,
IDT,
ATI,
ISSI,
MPS,
EPCOS,
SILICON,
SPANSION,
TE CONNECTIVITY ,
VISHAY DALE,
INNOLUX,
BB/TI,
WINBOND,
IC,
CREE,
SST,
BCD,
DIODES,
EVERLIGHT,
AT,
QFN,
MIC,
AOS,
CIRRUS,
EPSON,
JST,
AUO,
TI ,
JAE,
WCH,
HYNIX,
TI,
AD,
ST,
MAX,
NS,
NXP,
MICROCHIP,
FSC,
ATMEL,
ALTERA,
ON,
XILINX,
TOS,
CY,
INTEL,
INFINEON,
VISHAY,
MURATA,
MICRON,
PANASONIC,
SAMSUNG,
AVX,
FREESCALE,
IR,
LINEAR,
MOT,
LATTICE,
NEC,
AMD,
ALLEGRO,
PHI,
SEMIKRON,
HIT,
BROADCOM,
ROHM,
RENESAS,
DALLAS,
RECOM,
AVAGO,
SHARP,
YAGEO,
IXYS,
FUJI,
SUMIDA,
模块,
HARVATEK,
KEMET,
MIT,
SANYO,
MOLEX,
COOPER,
QUALCOMM,
MICREL,
NUVOTON,
BB,
ISD/NUVOTON,
TDK,
NVIDIA,
TRACO,
VICOR,
COILCRAFT,
INTERSIL,
BOURNS,
LITTELFUSE,
SONY,
MCP,
EUPEC,
SEIKO,
POWER,
FUJITSU,
IDT,
ATI,
ISSI,
MPS,
EPCOS,
SILICON,
SPANSION,
TE CONNECTIVITY ,
VISHAY DALE,
INNOLUX,
BB/TI,
WINBOND,
IC,
CREE,
SST,
BCD,
DIODES,
EVERLIGHT,
AT,
QFN,
MIC,
AOS,
CIRRUS,
EPSON,
JST,
AUO,
TI ,
JAE,
WCH,
HYNIX,
TI,
AD,
ST,
MAX,
NS,
NXP,
MICROCHIP,
FSC,
ATMEL,
ALTERA,
ON,
XILINX,
TOS,
CY,
INTEL,
INFINEON,
VISHAY,
MURATA,
MICRON,
PANASONIC,
SAMSUNG,
AVX,
FREESCALE,
IR,
LINEAR,
MOT,
LATTICE,
NEC,
AMD,
ALLEGRO,
PHI,
SEMIKRON,
HIT,
BROADCOM,
ROHM,
RENESAS,
DALLAS,
RECOM,
AVAGO,
SHARP,
YAGEO,
IXYS,
FUJI,
SUMIDA,
模块,
HARVATEK,
KEMET,
MIT,
SANYO,
MOLEX,
COOPER,
QUALCOMM,
MICREL,
BB,
ISD/NUVOTON,
TDK,
NVIDIA,
TRACO,
VICOR,
COILCRAFT,
INTERSIL,
BOURNS,
LITTELFUSE,
SONY,
MCP,
EUPEC,
SEIKO,
POWER,
FUJITSU,
IDT,
ATI,
MPS,
EPCOS,
SILICON,
SPANSION,
TE CONNECTIVITY ,
VISHAY DALE,
INNOLUX,
BB/TI,
IC,
CREE,
SST,
DIODES,
EVERLIGHT,
AT,
QFN,
MIC,
AOS,
CIRRUS,
EPSON,
ISSI,
WINBOND,
JST,
AUO,
TI ,
JAE,
WCH,
HYNIX,
BOSCH,
EXAR(SIPEX),
TI,
AD,
ST,
MAX,
NS,
NXP,
MICROCHIP,
FSC,
ATMEL,
ALTERA,
ON,
XILINX,
TOS,
CY,
INTEL,
INFINEON,
VISHAY,
MURATA,
MICRON,
PANASONIC,
SAMSUNG,
AVX,
FREESCALE,
IR,
LINEAR,
MOT,
LATTICE,
NEC,
AMD,
PHI,
SEMIKRON,
HIT,
BROADCOM,
ROHM,
RENESAS,
RECOM,
AVAGO,
DALLAS

 
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Product Summary
AD AD2S83AP
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: AD2S83AP.


Available from: Greelly Technology (H.K.) Limited
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:LIS3LV02DQ, LM4864M, EPF10K50EFC484-2, IP-B3L-CU01, 25LC64, IRDAK0705169, FQP20N06, UC3823DW, AD1837AS, MIC5209-3.3, MC3306, ADS1232IPW, ACS758LCB-050U-PFF, LP2989AIM-1.8, XC4010E-4PQ160C, CS5368-CQZ

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: AD2S83AP":

Post DatePart NumberBrandD/CDescQtyCompany
Mon Apr 22 10:43:00 UTC 2013AD2S83APZ (from standard server 2)AD11+5000Greelly Technology (H.K.) Limited
Mon Apr 22 10:43:00 UTC 2013AD2S83APZ (from parts server 2)AD11+5000Greelly Technology (H.K.) Limited
Mon Apr 22 10:43:00 UTC 2013AD2S83APZ (from hkin.com 2)AD11+5000Greelly Technology (H.K.) Limited
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AD2S83AP,AD2S83AP,Comments from user about AD2S83AP: With operating systems Windows XP x64, Windows Vista x64, Windows 7 x64, Linux, BSD and Mac OS X that run 64-bit native, the software is also geared to fully utilize the capabilities of such processors. Actually, all power semiconductors rely on a PIN diode structure to sustain voltage. Several specialized processing devices have followed from the technology., followed soon after. Execution units include arithmetic logic units (ALU), floating point units (FPU), load/store units, branch prediction, and SIMD. These days analog circuitry may use digital or even microprocessor techniques to improve performance. Being created for one element base, a computing device project can be ported on another element base, for example VLSI with various technologies. From the time that the processor's instruction decoder has figured out that it has encountered a conditional branch instruction to the time that the deciding register value can be read out, the pipeline needs to be stalled for several cycles, or if it's not and the branch is taken, the pipeline needs to be flushed. Anything related to :AD2S83AP, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: AD2S83AP, search hkinventory: AD2S83AP, In response, microprocessor manufacturers look for other ways to improve performance in order to hold on to the momentum of constant upgrades in the market. The forms of practical capacitors vary widely, but all contain at least two conductors separated by a non-conductor. By paralleling several devices, it is possible to increase the current rating of a switch. Flip-flops and latches are used as data storage elements. Datasheet Dir, DataSheet Archive
The logic section retrieves instruction operation codes from memory, and iniates whatever sequence of operations of the ALU required to carry out the instruction. Its importance in today's society rests on its ability to be mass produced using a highly automated process (semiconductor device fabrication) that achieves astonishingly low per-transistor costs. A capacitor is a passive electronic component consisting of a pair of conductors separated by a dielectric (insulator). Computers, electronic clocks, and programmable logic controllers (used to control industrial processes) are constructed of digital circuits. System-level design decisions such as whether or not to include peripherals, such as memory controllers, can be considered part of the microarchitectural design process. Computers, cellular phones, and other digital appliances are now inextricable parts of the structure of modern societies, made possible by the low cost of production of integrated circuits. There is an ever increasing need to keep product information updated and comparable, for the consumer to make an informed choice. The choice of the number of execution units, their latency and throughput is a central microarchitectural design task.
any passive component and active component such as:1N4148, or 6502, the power must be disconnected from the device. It is relatively easy for an inexperienced developer to produce code that simulates successfully but that cannot be synthesized into a real device, or is too large to be practical. From the time that the processor's instruction decoder has figured out that it has encountered a conditional branch instruction to the time that the deciding register value can be read out, the pipeline needs to be stalled for several cycles, or if it's not and the branch is taken, the pipeline needs to be flushed. Machines with different microarchitectures may have the same instruction set architecture, and thus be capable of executing the same programs. For example driver circuit
AD2S83AP,AD2S83AP,Comments from user about AD2S83AP: In the case of narrow-band bandpass filters, the Q determines the -3dB bandwidth but also the degree of rejection of frequencies far removed from the center frequency; if these two requirements are in conflict then a staggered-tuning bandpass filter may be needed. Common-emitter amplifiers are also used in radio frequency circuits, for example to amplify faint signals received by an antenna. For instance, a resonant series LC circuit will have unbounded voltage output for a bounded voltage input, but will be stable in the sense of Lyapunov, and given bounded energy input will have bounded energy output. This is driven by gains in manufacturing efficiency and automation, lower labor costs as manufacturing has moved to lower-wage countries, and improvements in semiconductor design. In the mid-1980s to early-1990s, a crop of new high-performance Reduced Instruction Set Computer (RISC) microprocessors appeared, influenced by discrete RISC-like CPU designs such as the IBM 801 and others. A passive component, depending on field, may be either a component that consumes (but does not produce) energy (thermodynamic passivity), or a component that is incapable of power gain (incremental passivity). VHDL is commonly used to write text models that describe a logic circuit. Integrated circuits were made possible by experimental discoveries showing that semiconductor devices could perform the functions of vacuum tubes and by mid-20th-century technology advancements in semiconductor device fabrication. Anything related to :AD2S83AP, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: AD2S83APSee also: