Part: TISP7380F3DR-S

Index Files

Offer Index 0

DALLAS,
MICROCHIP,
MIT,
BB,
PHI,
INTEL,
PANASONIC,
ALLEGRO,
IXYS,
WJ,
FUJI,
RENESAS,
INTERSIL,
AMD,
YAGEO,
MPS,
AVAGO,
SIEMENS,
SHARP,
MIC,
BOURNS,
VICOR,
HIT,
MOLEX,
NICHICON,
ISSI,
MICREL,
AMP,
TDK,
NIPPON CHEMI-CON,
PERICOM,
LAMBDA,
EPSON,
SANYO,
COOPER,
EUPEC,
MICRON,
NUVOTON,
LITTELFUSE,
SILICON,
EPCOS,
MURATAPS,
COILCRAFT,
HYNIX,
AVX,
ISD/NUVOTON,
MURATA PS,
SEMIKRON,
BROADCOM,
WINBOND

 
Google Search

Product Summary
Bourns TISP7380F3DR-S
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: TISP7380F3DR-S.


Available from: Hongkong Dassin Electronics Technology Limited
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:TB1230N, TC35301BP, TC7W08FU, TCA0372DWR2G, TCA785P, TCM1A475M8R, TD035STED7, TD285N16KOF, TDA7299, TDA8007, TDA8029, TDA9886HN, TEA1001, TIM4450-16UL, TIM6472-6UL, TIS6NTP2ADR-S

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: TISP7380F3DR-S":

Post DatePart NumberBrandD/CDescQtyCompany
Thu Jan 12 05:55:00 UTC 2012TISP7380F3DR-S (from hkin.com)Bourns10+半导体闸流管 - 两端交流、单端交流、SCR 与三端交流 Triple Element Bidirectional5000Hongkong Dassin Electronics Technology Limited
Thu Jan 12 05:55:00 UTC 2012TISP7380F3DR-S (from standard server 2)Bourns10+半导体闸流管 - 两端交流、单端交流、SCR 与三端交流 Triple Element Bidirectional5000Hongkong Dassin Electronics Technology Limited
Thu Jan 12 05:55:00 UTC 2012TISP7380F3DR-S (from parts server 2)Bourns10+半导体闸流管 - 两端交流、单端交流、SCR 与三端交流 Triple Element Bidirectional5000Hongkong Dassin Electronics Technology Limited
Thu Jan 12 05:55:00 UTC 2012TISP7380F3DR-S (from hkin.com 2)Bourns10+半导体闸流管 - 两端交流、单端交流、SCR 与三端交流 Triple Element Bidirectional5000Hongkong Dassin Electronics Technology Limited
Thu Jan 12 05:55:00 UTC 2012TISP7380F3DR-S (from hkin.com 2)Bourns10+半导体闸流管 - 两端交流、单端交流、SCR 与三端交流 Triple Element Bidirectional5000Hongkong Dassin Electronics Technology Limited

Last record TIS6NTP2ADR-S:

Post DatePart NumberBrandD/CDescQtyCompany
Tue Jan 17 04:00:00 UTC 2012TIS6NTP2ADR-S (from hkin.com)BOURNS0747+SOP82500Novelty Electronics Limited

Last record TIM6472-6UL:

Post DatePart NumberBrandD/CDescQtyCompany
Mon Jan 16 04:22:00 UTC 2012TIM6472-6UL (from hkin.com)TOS11+2-11D1B5000Benew Industry Limited

Last record TIM4450-16UL:

Post DatePart NumberBrandD/CDescQtyCompany
Mon Jan 16 04:22:00 UTC 2012TIM4450-16UL (from hkin.com)TOS11+2-16G1B1000Benew Industry Limited
Mon Jan 16 04:22:00 UTC 2012TIM4450-16UL (from hkin.com)TOS11+2-16G1B1000Benew Industry Limited

If you want to find more about TISP7380F3DR-S, please visit us on HKin


vid:offerengine20120117

TISP7380F3DR-S,TISP7380F3DR-S,Comments from user about TISP7380F3DR-S: IEEE standard 1076. Although several companies each produce over a billion individually packaged (known as discrete) transistors every year, the vast majority of transistors now produced are in integrated circuits (often shortened to IC, microchips or simply chips), along with diodes, resistors, capacitors and other electronic components, to produce complete electronic circuits. This is driven by gains in manufacturing efficiency and automation, lower labor costs as manufacturing has moved to lower-wage countries, and improvements in semiconductor design. The circuit can be made to change state by signals applied to one or more control inputs and will have one or two outputs. For quantities that vary polynomially or logarithmically with temperature, it may be possible to calculate a temperature coefficient that is a useful approximation for a certain range of temperatures. An LED is often small in area (less than 1 mm2), and integrated optical components may be used to shape its radiation pattern. The IGCT's much faster turn-off times compared to the GTO's allows them to operate at higher frequenciesXup to several of kHz for very short periods of time. The integration of large numbers of tiny transistors into a small chip was an enormous improvement over the manual assembly of circuits using electronic components. Anything related to :TISP7380F3DR-S, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: TISP7380F3DR-S, search hkinventory: TISP7380F3DR-S, The integrated circuit's mass production capability, reliability, and building-block approach to circuit design ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. These diagrams generally separate the datapath (where data is placed) and the control path (which can be said to steer the data). A circuit breaker is an automatically operated electrical switch designed to protect an electrical circuit from damage caused by overload or short circuit. The MOSFET is the most used semiconductor device today. Datasheet Dir, DataSheet Archive
Capacitors used as parts of electrical systems, for example, consist of metal foils separated by a layer of insulating film. For quantities that vary polynomially or logarithmically with temperature, it may be possible to calculate a temperature coefficient that is a useful approximation for a certain range of temperatures. More importantly it also allows the circuit to operate at higher frequencies as the tuned circuit can be used to resonate any inter-electrode and stray capacitances, which normally limit the frequency response. The degree to which unwanted signals should be rejected. It is generally considered a "best practice" to write very idiomatic code for synthesis as results can be incorrect or suboptimal for non-standard constructs. The distance that signals had to travel between ICs on the boards limited the speed at which a computer could operate. This includes decisions on the performance-level and connectivity of these peripherals. In response, microprocessor manufacturers look for other ways to improve performance in order to hold on to the momentum of constant upgrades in the market.
any passive component and active component such as:Diode, The IGBT is a recent component, so its performance improves regularly as technology evolves. Cost is low because the chips, with all their components, are printed as a unit by photolithography rather than being constructed one transistor at a time.Most analog electronic appliances, such as radio receivers, are constructed from combinations of a few types of basic circuits. Being created for one element base, a computing device project can be ported on another element base, for example VLSI with various technologies. For example driver circuit
TISP7380F3DR-S,TISP7380F3DR-S,Comments from user about TISP7380F3DR-S: This includes decisions on the performance-level and connectivity of these peripherals. However, its excellent performance in low voltage make it the device of choice (actually the only choice) for applications below 200 V. Circuit designers will sometimes refer to this class of components as dissipative, or thermodynamically passive. The number of different analog circuits so far devised is huge, especially because a 'circuit' can be defined as anything from a single component, to systems containing thousands of components. Consumer electronics are manufactured throughout the world, although there is a particularly high concentration of headquarters, factories, research and development activity in East Asia, especially in Japan. These components overcame some limitations of the thyristors because they can be turned on or off with an applied signal. VHDL is a dataflow language, unlike procedural computing languages such as BASIC, C, and assembly code, which all run sequentially, one instruction at a time. A single operation code might affect many individual data paths, registers, and other elements of the processor. Anything related to :TISP7380F3DR-S, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: TISP7380F3DR-SSee also: