Description
Sep 27, 2016 Z-7045. Z-7100. Part Number. XC7Z007S XC7Z012S XC7Z014S. XC7Z010. XC7Z015. XC7Z020. XC7Z030. XC7Z035. XC7Z045. XC7Z100 Nov 24, 2015 XC7Z035, XC7Z045, XQ7Z045, XC7Z100 , and XQ7Z100 complements the Zynq- 7000 AP SoC documentation suite available on the Xilinx Mar 1, 2016 Zynq-7000 AP SoC Packaging Guide www.xilinx.com. 6. UG865 (v1.6) March 1, 2016. FFG1156/FFV1156 ( XC7Z100 ). Flip-Chip BGA (1.0 mm Sep 27, 2016 Added XC7Z100 devices to Table 3-1 and Table 3-2. Updated ESR range values in. Table 3-3. Changed 0805 Ceramic Capacitor section Page 1. Zynq-7000. All Programmable SoC. Technical Reference Manual. UG585 (v1.11) September 27, 2016. Page 2. Zynq-7000 AP SoC Technical
Part Number | XC7Z1002FFG900I |
Main Category | Integrated Circuits (ICs) |
Sub Category | Embedded - System On Chip (SoC) |
Brand | |
Description | IC SOC CORTEX-A9 KINTEX7 900FBGA |
Series | Zynq-7000 |
Packaging | Tray |
Architecture | MCU, FPGA |
Core Processor | Dual ARM Cortex-A9 MPCore,with CoreSight,,-" |
MCU Flash | 256KB |
MCU RAM | DMA |
Peripherals | CAN, EBI/EMI, Ethernet, I²ÂC, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Connectivity | 800MHz |
Speed | Kintex,7 FPGA, 444K Logic Cells |
Primary Attributes | -40°C ~ 100°C (TJ) |
Operating Temperature | 900-BBGA, FCBGA |
Package / Case | 900-FCBGA (31x31) |
Supplier Device Package | |
Image |
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