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SAC305 = 96.5% Sn, 3% Ag, 0.5% Cu. SAC302 = 96.8% Sn, 3Ag, 0.2% Cu. SAC387 = 95.5% Sn, 3.8Ag, 0.7% Cu. LF35 = 98.25% Sn, 1.2% Ag, 0.5% Cu, Sep 10, 2013 extensively investigated solder ball composition and proposed the use of SAC305 /405 solder alloys because of their high strength and Nov 1, 2012 Continuous and dramatic increase in metal cost o. Sn is up 30% in the past 2 years o. Ag is up 55% in the past years o. SAC305 solder is up SAC305 . Cu-OSP. 40. 10. 550. Y. SAC310. Cu-OSP. 40. Three factors investigated: Solder resist opening (SRO), Flux wash and Solder alloy. Sample size: 30 2 Pre-tinned termination, SnPb alloy (dip solder 2 Pre-tinned termination, SnPb alloy lXl options only) lZI 3 Pre-tinned termination, SAC305 alloy. 3 Pre-tinned