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Using the example of the SOICW- EP 54LD in Figure 4, the PCB pad width should be designed at 0.38 mm (X1) for this 0.65 mm lead pitch package. on how to connect the EP to the PCB . This engineering bulletin gives connection recommendations specifically for microcontrollers in DFN and QFN packages. of Freescale QFP packages during Printed Circuit Board . Although the land pattern design for EP lead attachment on the PCB should be the same as that for at 200 mA load makes the ADP151- EP suitable for battery- operated portable equipment. .. In applications with moderate power dissipation and low PCB . circuit board ( PCB ) assembly, and guidelines for PCB design and rework Figure 1. QFN/QFN- EP (Left) and DFN/DFN- EP (Right) Packages from Freescale.