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Description
LPC11U35FHI33 / 501 . HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5 5 0.85 mm n/a. LPC11U35FET48/ 501. Jun 11, 2014 LPC11U35FHI33 / 501 . HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5 5 0.85 mm n/a. Feb 18, 2014 PIO0_18/RXD/CT32B0_MAT0. 31. PIO0_19/TXD/CT32B0_MAT1. 32. VSS. 33. IC1. LPC11U35FHI33 / 501 . VBUS. 1. D-. 2. D+. 3. GND. 4. DAP. ES_LPC11U3x. Errata sheet LPC11U3x. Rev. 3 8 August 2014. Errata sheet. Document information. Info. Content. Keywords. LPC11U34FHN33
| Part Number | LPC11U35FHI33/501 |
| Main Category | Integrated Circuits (ICs) |
| Sub Category | Embedded - Microcontrollers |
| Brand | |
| Description | IC MCU 32BIT 64KB FLASH 33HVQFN |
| Series | LPC11Uxx |
| Packaging | Tray |
| Core Processor | ARM Cortex-M0 |
| Core Size | 32-Bit |
| Speed | 50MHz |
| Connectivity | I²ÂC, Microwire, SmartCard, SPI, SSP, UART/USART, USB |
| Peripherals | Brown-out Detect/Reset, POR, WDT |
| Number of I/O | 26 |
| Program Memory Size | 64KB (64K x 8) |
| Program Memory Type | FLASH |
| EEPROM Size | 4K x 8 |
| RAM Size | 12K x 8 |
| Voltage - Supply (Vcc/Vdd) | 1.8 V ~ 3.6 V |
| Data Converters | A/D 8x10b |
| Oscillator Type | Internal |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Package / Case | 32-VFQFN Exposed Pad |
| Supplier Device Package | 32-HVQFN (5x5) |
| Image |  |
Hot Offer
LPC11U35FHI33/501
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50000
1.67
BENETEK LIMITED
LPC11U35FHI33/501
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17000
2.58
DONGGUAN FENGKE ELECTRONIC TECHNOLOGY CO.,LTD
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2878
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REALCHIP TECHNOLOGY (HK) CO., LIMITED
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N&S Electronic Co., Limited
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5.31
HK GUANGLIANDA ELECTRONIC LIMITED
