Part: DAC7742YB/250

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Product Summary
BB DAC7742YB/250
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: DAC7742YB/250.


Available from: Mingar Electronic (HK) Limited
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:XC5VLX110-1FF1153C, XHW910, XQV300-3PQ240N, XYAB2327, Z8523310VSC, ZR39760HGCF-HS-A1, ZUW1R50515, ZUW60512, MG600Q1US59A, STM32F102, IR4428STRPBF, IRF7410TRPBF, IRF7473TRPBF, OPA348AIDBVR, C1210F475K3PAC7800, KM68V1002AJ-12

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: DAC7742YB/250":

Post DatePart NumberBrandD/CDescQtyCompany
Sun Jan 15 04:15:00 UTC 2012DAC7742YB/250 (from hkin.com)BB09+LQFP48832Mingar Electronic (HK) Limited
Sun Jan 15 04:15:00 UTC 2012DAC7742YB/250 (from standard server 2)BB09+LQFP48832Mingar Electronic (HK) Limited
Sun Jan 15 04:15:00 UTC 2012DAC7742YB/250 (from parts server 2)BB09+LQFP48832Mingar Electronic (HK) Limited
Sun Jan 15 04:15:00 UTC 2012DAC7742YB/250 (from hkin.com 2)BB09+LQFP48832Mingar Electronic (HK) Limited
Sun Jan 15 04:15:00 UTC 2012DAC7742YB/250 (from hkin.com 2)BB09+LQFP48832Mingar Electronic (HK) Limited

Last record KM68V1002AJ-12:

Post DatePart NumberBrandD/CDescQtyCompany
Fri Jan 13 02:00:00 UTC 2012KM68V1002AJ-12 (from hkin.com)SEC07+SOJ247Huaerda Technology Co.,Limited

Last record C1210F475K3PAC7800:

Post DatePart NumberBrandD/CDescQtyCompany
Mon Jan 9 01:48:00 UTC 2012C1210F475K3PAC7800 (from hkin.com)KEMET4000Deko Technology Limited.

Last record OPA348AIDBVR:

Post DatePart NumberBrandD/CDescQtyCompany
Tue Jan 10 00:51:00 UTC 2012OPA348AIDBVRG4 (from hkin.com)BB07+/08+SOT23-5148Chang Feng Electronics (HK) Co.,Ltd

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DAC7742YB/250,DAC7742YB/250,Comments from user about DAC7742YB/250: Although several companies each produce over a billion individually packaged (known as discrete) transistors every year, the vast majority of transistors now produced are in integrated circuits (often shortened to IC, microchips or simply chips), along with diodes, resistors, capacitors and other electronic components, to produce complete electronic circuits. Different features can be implemented in different models of a product line at negligible production cost. A light-emitting diode (LED) is a semiconductor light source. One barrier to achieving higher performance through instruction-level parallelism stems from pipeline stalls and flushes due to branches. This problem is caused by the slow decay of the conduction current during turn-off resulting from slow recombination of large number of carriers, which flood the thick 'drift' region of the IGBT during conduction. The logic section retrieves instruction operation codes from memory, and iniates whatever sequence of operations of the ALU required to carry out the instruction. The IGBT is a recent component, so its performance improves regularly as technology evolves. The power MOSFET has the advantages of the majority carrier devices, so it can achieve very high operating frequency, but can't be used with high voltages. Anything related to :DAC7742YB/250, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: DAC7742YB/250, search hkinventory: DAC7742YB/250, The range of desired frequencies (the passband) together with the shape of the frequency response. Products not traditionally associated with computer use (such as TVs or Hi-Fi equipment) now provide options to connect to the Internet or to a computer using a home network to provide access to digital content. Furthermore, much less material is used to construct a packaged IC die than to construct a discrete circuit. During the 1960s, computer processors were constructed out of small and medium-scale ICs each containing from tens to a few hundred transistors. Datasheet Dir, DataSheet Archive
IEEE 1076. System-level design decisions such as whether or not to include peripherals, such as memory controllers, can be considered part of the microarchitectural design process. An integrated circuit or monolithic integrated circuit (also referred to as IC, chip, and microchip) is an electronic circuit manufactured by the patterned diffusion of trace elements into the surface of a thin substrate of semiconductor material. A single operation code might affect many individual data paths, registers, and other elements of the processor.[3] Each microarchitectural element is in turn represented by a schematic describing the interconnections of logic gates used to implement it. Light-emitting diodes are used in applications as diverse as replacements for aviation lighting, automotive lighting (particularly brake lamps, turn signals and indicators) as well as in traffic signals. The vast majority of the discrete (i.e non integrated) power devices are built using a vertical structure, whereas small-signal devices employ a lateral structure.Different temperature coefficients are specified for various applications, including nuclear, electrical and magnetic.
any passive component and active component such as:Diode, For each computer built, all of these had to be placed and soldered onto printed circuit boards, and often multiple boards would have to be interconnected in a chassis. These units perform the operations or calculations of the processor. One barrier to achieving higher performance through instruction-level parallelism stems from pipeline stalls and flushes due to branches. New microarchitectures and/or circuitry solutions, along with advances in semiconductor manufacturing, are what allows newer generations of processors to achieve higher performance while using the same ISA. For example driver circuit
DAC7742YB/250,DAC7742YB/250,Comments from user about DAC7742YB/250: While maintaining full compatibility with older versions, this proposed standard provides numerous extensions that make writing and managing VHDL code easier. Circuit designers will sometimes refer to this class of components as dissipative, or thermodynamically passive. In electronics, a flip-flop or latch is a circuit that has two stable states and can be used to store state information. The first commercial RISC microprocessor design was released either by MIPS Computer Systems, the 32-bit R2000 (the R1000 was not released) or by Acorn computers, the 32-bit ARM2 in 1987. The vast majority of the discrete (i.e non integrated) power devices are built using a vertical structure, whereas small-signal devices employ a lateral structure. They are also called power devices or when used in integrated circuits, called power ICs. Bipolar junction transistors are formed from two p-n junctions, in either n-p-n or p-n-p configuration. Generally, in datasheets, turn-off energy is mentioned as a measured parameter and one has to multiply that number with the switching frequency of the intended application to estimate the turn-off loss. Anything related to :DAC7742YB/250, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: DAC7742YB/250See also: