Part: CD40106BMJ/883QS

Index Files

Offer Index 37

IR,
FREESCALE,
LINEAR,
MICRON,
FUJI,
LATTICE,
SEMIKRON,
MOT,
BRIGHT,
NVIDIA,
ROHM,
EVERLIGHT,
模块,
NEC,
PHI,
BROADCOM,
AVAGO,
COILCRAFT,
DALLAS,
YAGEO,
ALLEGRO,
INTERSIL,
TDK,
AMD,
QUALCOMM,
WURTH,
MIT,
RENESAS,
MICREL,
HIT,
HARVATEK,
KEMET,
SUMIDA,
ATI,
MOLEX,
SANYO,
ISD/NUVOTON,
SHARP,
HYNIX,
TYCO,
ISSI,
MPS,
STMICROELECTRONICS,
SST,
REALTEK,
IDT,
BOURNS,
JRC,
FUJITSU,
LITTELFUSE,
MIC,
SEIKO,
ELPIDA,
TE,
VICOR,
SILICON,
TRACO,
COOPER,
ABB,
BB,
MICRON(ST),
WINBOND,
DIODES,
MINDSPEED,
RECOM,
EPCOS,
EUPEC,
IC,
CREE,
SPANSION,
SIPEX,
HVCA,
CJ(CHINA),
QFN,
CIRRUS,
EPSON,
NXP/PHI,
AOS,
POWER,
TI,
AD,
ST,
MAX,
ALTERA,
NS,
XILINX,
ATMEL,
NXP,
SAMSUNG,
TOS,
MURATA,
MICROCHIP,
INTEL,
CY,
FSC,
ON,
INFINEON,
PANASONIC,
AVX,
VISHAY,
IR,
FREESCALE,
LINEAR,
MICRON,
FUJI,
LATTICE,
SEMIKRON,
MOT,
BRIGHT,
NVIDIA,
EVERLIGHT,
模块,
NEC,
PHI,
ROHM,
BROADCOM,
AVAGO,
COILCRAFT,
DALLAS,
YAGEO,
ALLEGRO,
INTERSIL,
QUALCOMM,
AMD,
TDK,
MIT,
WURTH,
RENESAS,
HARVATEK,
KEMET,
MICREL,
HIT,
SUMIDA,
ATI,
SANYO,
MOLEX,
ISD/NUVOTON,
SHARP,
TYCO,
STMICROELECTRONICS,
IDT,
HYNIX,
ISSI,
REALTEK,
BOURNS,
JRC,
LITTELFUSE,
FUJITSU,
MIC,
SEIKO,
ELPIDA,
TE,
VICOR,
SILICON,
TRACO,
MPS,
COOPER,
BB,
ABB,
MINDSPEED,
RECOM,
SST,
EPCOS,
EUPEC,
IC,
CREE,
DIODES,
CIRRUS,
SIPEX,
HVCA,
CJ(CHINA),
QFN,
AOS,
POWER,
WINBOND,
EPSON,
NXP/PHI,
CONEXANT,
SONY,
TI,
AD,
ST,
XILINX,
MAX,
ALTERA,
NS,
ATMEL,
SAMSUNG,
NXP,
TOS,
MURATA,
MICROCHIP,
INTEL,
FSC,
CY,
ON,
INFINEON,
PANASONIC,
AVX,
VISHAY,
IR,
MICRON,
FREESCALE,
LINEAR,
FUJI,
LATTICE,
SEMIKRON,
MOT,
BRIGHT,
NVIDIA,
EVERLIGHT,
模块,
PHI,
NEC,
ROHM,
BROADCOM,
AVAGO,
COILCRAFT,
DALLAS,
YAGEO,
ALLEGRO,
AMD,
INTERSIL,
QUALCOMM,
TDK,
MIT,
WURTH,
RENESAS,
HARVATEK,
KEMET,
MICREL,
HIT,
SUMIDA,
SANYO,
ATI,
MOLEX,
ISD/NUVOTON,
SHARP,
TYCO,
HYNIX,
IDT,
STMICROELECTRONICS,
ISSI,
JRC,
REALTEK,
BOURNS,
FUJITSU,
LITTELFUSE,
SEIKO,
MIC,
SILICON,
ELPIDA,
TE,
VICOR,
TRACO,
MPS,
COOPER,
BB,
ABB,
SST,
MINDSPEED,
RECOM,
EPCOS,
EUPEC,
IC,
CREE,
DIODES,
CIRRUS,
QFN,
SIPEX,
HVCA,
POWER,
CJ(CHINA),
AOS,
WINBOND,
EPSON,
NXP/PHI,
SPANSION,
CONEXANT,
TI,
AD,
ST,
MAX,
NS,
XILINX,
ALTERA,
ATMEL,
NXP,
SAMSUNG,
TOS,
MICROCHIP,
MURATA,
INTEL,
FSC,
CY,
ON,
INFINEON,
PANASONIC,
AVX,
VISHAY,
IR,
FREESCALE,
MICRON,
LINEAR,
FUJI,
LATTICE,
SEMIKRON,
MOT,
BRIGHT,
EVERLIGHT,
模块,
NEC,
PHI,
ROHM,
AVAGO,
NVIDIA,
COILCRAFT,
BROADCOM,
DALLAS,
YAGEO,
ALLEGRO,
MIT,
QUALCOMM,
WURTH,
TDK,
INTERSIL,
RENESAS,
AMD,
HARVATEK,
KEMET,
MICREL,
SANYO,
HIT,
SUMIDA,
MOLEX,
SHARP,
ISD/NUVOTON,
TYCO,
HYNIX,
STMICROELECTRONICS,
IDT,
ISSI,
JRC,
BOURNS,
FUJITSU,
LITTELFUSE,
REALTEK,
SEIKO,
MIC,
POWER,
ATI,
SILICON,
TE,
ELPIDA,
VICOR,
TRACO,
MPS,
COOPER,
BB,
ABB,
RECOM,
EPCOS,
SST,
EUPEC,
IC,
CREE,
DIODES,
CIRRUS,
QFN,
SIPEX,
HVCA,
CJ(CHINA),
NXP/PHI,
EPSON,
SPANSION,
BB/TI,
SONY,
AOS,
CONEXANT,
TI,
AD,
ST,
MAX,
NS,
XILINX,
ALTERA,
ATMEL,
NXP,
SAMSUNG,
TOS,
MICROCHIP,
MURATA,
INTEL,
FSC,
CY,
ON,
INFINEON,
PANASONIC,
AVX,
VISHAY,
IR,
FREESCALE,
LINEAR,
MICRON,
FUJI,
LATTICE,
SEMIKRON,
MOT,
BRIGHT,
EVERLIGHT,
NEC,
模块,
PHI,
ROHM,
AVAGO,
NVIDIA,
COILCRAFT,
BROADCOM,
DALLAS,
ALLEGRO,
YAGEO,
MIT,
QUALCOMM,
WURTH,
TDK,
RENESAS,
INTERSIL,
AMD,
HARVATEK,
KEMET,
MICREL,
SANYO,
HIT,
SUMIDA,
MOLEX,
SHARP,
ISD/NUVOTON,
TYCO,
JRC,
HYNIX,
STMICROELECTRONICS,
IDT,
ISSI,
BOURNS,
FUJITSU,
LITTELFUSE,
REALTEK,
SEIKO,
POWER,
MIC,
ATI,
SILICON,
TE,
ELPIDA,
VICOR,
TRACO,
MPS,
COOPER,
BB,
ABB,
RECOM,
EPCOS,
SST,
EUPEC,
IC,
CREE,
DIODES,
SIPEX,
CIRRUS,
QFN,
HVCA,
CJ(CHINA),
NXP/PHI,
EPSON,
SONY,
SPANSION,
BB/TI,
CONEXANT,
AOS,
TI,
AD,
ST,
MAX,
XILINX,
NS,
ATMEL,
ALTERA,
NXP,
SAMSUNG,
TOS,
MICROCHIP,
INTEL,
FSC,
CY,
ON,
MURATA,
INFINEON,
PANASONIC,
AVX,
VISHAY,
IR,
FREESCALE,
MICRON,
LINEAR,
LATTICE,
FUJI,
SEMIKRON,
MOT,
BRIGHT,
EVERLIGHT,
模块,
PHI,
NEC,
ROHM,
AVAGO,
NVIDIA,
COILCRAFT,
BROADCOM,
DALLAS,
ALLEGRO,
YAGEO,
QUALCOMM,
INTERSIL,
MIT,
RENESAS,
AMD,
HARVATEK,
KEMET,
MICREL,
SANYO,
SUMIDA,
HIT,
MOLEX,
ISD/NUVOTON,
TDK,
JRC,
HYNIX,
STMICROELECTRONICS,
IDT,
BOURNS,
FUJITSU,
LITTELFUSE,
REALTEK,
SEIKO,
POWER,
SHARP,
MIC,
ATI,
SILICON,
TE,
ELPIDA,
VICOR,
ABB,
TRACO,
COOPER,
MPS,
BB,
RECOM,
EPCOS,
EUPEC,
IC,
CREE,
SIPEX,
CIRRUS,
QFN,
DIODES,
HVCA,
SST,
CJ(CHINA),
EPSON,
SPANSION,
SONY,
BB/TI,
CONEXANT,
AOS,
TI ,
ISSI,
BOSCH,
EXAR(SIPEX),
TI,
AD,
ST,
MAX,
XILINX,
NS,
ATMEL,
ALTERA,
NXP,
SAMSUNG,
MICROCHIP,
INTEL,
FSC,
CY,
TOS,
ON,
MURATA,
INFINEON,
PANASONIC,
AVX,
VISHAY,
IR,
FREESCALE,
MICRON,
LINEAR,
LATTICE,
FUJI,
SEMIKRON,
MOT,
BRIGHT,
EVERLIGHT,
模块,
PHI,
NEC,
ROHM,
MIT,
AVAGO,
NVIDIA,
COILCRAFT,
BROADCOM,
DALLAS,
ALLEGRO,
YAGEO,
QUALCOMM,
INTERSIL,
RENESAS,
AMD,
HARVATEK,
KEMET,
MICREL,
SANYO,
SUMIDA,
HIT,
MOLEX,
ISD/NUVOTON,
TDK,
JRC,
HYNIX,
STMICROELECTRONICS,
IDT,
BOURNS,
FUJITSU,
LITTELFUSE,
REALTEK,
SEIKO,
POWER,
SHARP,
MIC,
ATI,
SILICON,
TE,
ELPIDA,
ABB,
TRACO,
COOPER,
MPS,
BB,
RECOM,
EPCOS,
EUPEC,
IC,
CREE,
SIPEX,
VICOR,
CIRRUS,
QFN,
DIODES,
HVCA,
SST,
CJ(CHINA),
EPSON,
SPANSION,
SONY,
BB/TI,
CONEXANT,
AOS,
TI ,
ISSI,
BOSCH,
EXAR(SIPEX),
TI,
ST,
AD,
MAX,
XILINX,
NS,
ATMEL,
ALTERA,
NXP,
SAMSUNG,
MICROCHIP,
INTEL,
FSC,
CY,
ON,
TOS,
MURATA,
PANASONIC,
INFINEON,
AVX,
VISHAY,
FREESCALE,
MICRON,
IR,
LINEAR,
LATTICE,
SEMIKRON,
BRIGHT,
MOT,
EVERLIGHT,
模块,
FUJI,
MIT,
PHI,
NEC,
ROHM,
NVIDIA,
AVAGO,
AMD,
COILCRAFT,
BROADCOM,
DALLAS,
ALLEGRO,
YAGEO,
QUALCOMM,
INTERSIL,
RENESAS,
HARVATEK,
KEMET,
MICREL,
SANYO,
SUMIDA,
HIT,
MOLEX,
TDK,
ISD/NUVOTON,
JRC,
HYNIX,
STMICROELECTRONICS,
IDT,
BOURNS,
FUJITSU,
LITTELFUSE,
POWER,
REALTEK,
SEIKO,
MIC,
SHARP,
ATI,
SILICON,
TE,
ELPIDA,
TRACO,
COOPER,
MPS,
VICOR,
BB,
RECOM,
EPCOS,
EUPEC,
CREE,
IC,
SIPEX,
CIRRUS,
QFN,
DIODES,
HVCA,
CJ(CHINA),
SST,
EPSON,
SONY,
SPANSION,
BB/TI,
AOS,
CONEXANT,
TI ,
ISSI,
BOSCH,
EXAR(SIPEX),
AT,
TI,
ST,
AD,
NS,
MAX,
XILINX,
ATMEL,
ALTERA,
SAMSUNG,
NXP,
MICROCHIP,
FSC,
INTEL,
TOS,
CY,
ON,
MURATA,
FUJI,
PANASONIC,
INFINEON,
AVX,
VISHAY,
IR,
MICRON,
FREESCALE,
MIT,
LINEAR,
LATTICE,
SEMIKRON,
MOT,
BRIGHT,
NVIDIA,
EVERLIGHT,
模块,
PHI,
NEC,
ROHM,
SANYO,
AMD,
BROADCOM,
AVAGO,
COILCRAFT,
DALLAS,
ALLEGRO,
YAGEO,
QUALCOMM,
SHARP,
RENESAS,
INTERSIL,
MICREL,
HARVATEK,
KEMET,
HIT,
MOLEX,
SUMIDA,
ATI,
COOPER,
TDK,
ISD/NUVOTON,
HYNIX,
JRC,
STMICROELECTRONICS,
ISSI,
REALTEK,
IDT,
FUJITSU,
BOURNS,
LITTELFUSE,
POWER,
SEIKO,
MIC,
SILICON,
ELPIDA,
TE,
SONY,
TRACO,
EPCOS,
MPS,
BB,
EUPEC,
SST,
RECOM,
COSEL,
CREE,
IC,
DIODES,
SIPEX,
CIRRUS,
QFN,
HVCA,
CJ(CHINA),
EPSON,
SPANSION,
NXP/PHI,
CONEXANT,
BB/TI,
ASTEC,
AOS,
TI ,
JAE,
TI,
AD,
ST,
XILINX,
MAX,
NS,
ATMEL,
ALTERA,
SAMSUNG,
NXP,
MICROCHIP,
INTEL,
FSC,
CY,
TOS,
MURATA,
FUJI,
PANASONIC,
ON,
INFINEON,
AVX,
IR,
MICRON,
MIT,
LINEAR,
SEMIKRON,
VISHAY,
LATTICE,
BRIGHT,
模块,
MOT,
FREESCALE,
NVIDIA,
NEC,
ROHM,
SANYO,
PHI,
BROADCOM,
AMD,
DALLAS,
YAGEO,
QUALCOMM,
SHARP,
INTERSIL,
RENESAS,
HARVATEK,
AVAGO,
KEMET,
HIT,
COOPER,
MICREL,
MOLEX,
ISD/NUVOTON,
TDK,
JRC,
ISSI,
HYNIX,
ATI,
IDT,
COILCRAFT,
FUJITSU,
BOURNS,
LITTELFUSE,
SEIKO,
TE,
ELPIDA,
TRACO,
SONY,
POWER,
EPCOS,
MPS,
RECOM,
EUPEC,
SST,
COSEL,
CREE,
IC,
EVERLIGHT,
SILICON,
QFN,
CIRRUS,
CJ(CHINA),
SIPEX,
BB,
NXP/PHI,
EPSON,
DIODES,
ASTEC,
AOS,
TI ,
SPANSION,
JAE,
JST,
CONEXANT,
MXIC,
AUO,
EXAR(SIPEX),
MIC,
REALTEK,
AT,
TI,
AD,
ST,
ALTERA,
MAX,
XILINX,
NS,
ATMEL,
NXP,
SAMSUNG,
MICROCHIP,
INTEL,
CY,
FSC,
TOS,
MURATA,
PANASONIC,
ON,
INFINEON,
AVX,
FUJI,
IR,
SEMIKRON,
MICRON,
LINEAR,
VISHAY,
LATTICE,
MIT,
BRIGHT,
模块,
FREESCALE,
NEC,
MOT,
NVIDIA,
ROHM,
SANYO,
BROADCOM,
AMD,
PHI,
QUALCOMM,
STMICROELECTRONICS,
DALLAS,
RENESAS,
YAGEO,
SHARP,
INTERSIL,
HIT,
AVAGO,
HARVATEK,
KEMET,
COOPER,
MICREL,
MOLEX,
ISD/NUVOTON,
TDK,
JRC,
ISSI,
HYNIX,
ATI,
IDT,
FUJITSU,
COILCRAFT,
BOURNS,
LITTELFUSE,
SEIKO,
EUPEC,
TE,
ELPIDA,
SONY,
TRACO,
MPS,
POWER,
EPCOS,
SST,
RECOM,
ASTEC,
CREE,
SILICON,
IC,
EVERLIGHT,
CIRRUS,
ABB,
QFN,
BB,
CJ(CHINA),
EPSON,
SIPEX,
NXP/PHI,
DIODES,
ALLEGRO,
AOS,
IXYS,
TI ,
FTDI,
SPANSION,
VICOR,
JAE,
JST,
MXIC,
CONEXANT,
TI,
AD,
ST,
ALTERA,
XILINX,
NS,
MAX,
ATMEL,
NXP,
SAMSUNG,
MICROCHIP,
INTEL,
CY,
MURATA,
FSC,
PANASONIC,
TOS,
ON,
INFINEON,
AVX,
IR,
FUJI,
MICRON,
LINEAR,
LATTICE,
SEMIKRON,
VISHAY,
BRIGHT,
模块,
FREESCALE,
MIT,
NVIDIA,
MOT,
SANYO,
NEC,
AMD,
BROADCOM,
ROHM,
STMICROELECTRONICS,
PHI,
DALLAS,
RENESAS,
YAGEO,
SHARP,
QUALCOMM,
HIT,
HARVATEK,
KEMET,
AVAGO,
COOPER,
INTERSIL,
MOLEX,
MICREL,
ISD/NUVOTON,
TDK,
ISSI,
AGILENT,
ATI,
HYNIX,
COILCRAFT,
BOURNS,
LITTELFUSE,
FUJITSU,
IDT,
SEIKO,
EUPEC,
TE,
ELPIDA,
TRACO,
CIRRUS,
SONY,
MPS,
EPCOS,
RECOM,
SST,
ASTEC,
CREE,
AUO,
IC,
SILICON,
ABB,
QFN,
EVERLIGHT,
CJ(CHINA),
SIPEX,
EPSON,
NXP/PHI,
DIODES,
BB,
AOS,
POWER,
ALLEGRO,
IXYS,
TI ,
FTDI,
VICOR,
JAE,
JRC,
JST,
MXIC,
TI,
AD,
ST,
ALTERA,
NS,
XILINX,
MAX,
ATMEL,
SAMSUNG,
NXP,
INTEL,
MICROCHIP,
CY,
FSC,
MURATA,
TOS,
PANASONIC,
ON,
INFINEON,
IR,
AVX,
LINEAR,
MICRON,
NVIDIA,
FUJI,
LATTICE,
VISHAY,
SEMIKRON,
FREESCALE,
MOT,
BRIGHT,
AMD,
模块,
NEC,
PHI,
BROADCOM,
ROHM,
SANYO,
STMICROELECTRONICS,
DALLAS,
RENESAS,
MIT,
SHARP,
YAGEO,
QUALCOMM,
HIT,
HARVATEK,
AVAGO,
KEMET,
INTERSIL,
COOPER,
MOLEX,
MICREL,
ATI,
ISD/NUVOTON,
TDK,
FUJITSU,
AGILENT,
HYNIX,
ISSI,
IDT,
COILCRAFT,
EUPEC,
BOURNS,
LITTELFUSE,
SEIKO,
TE,
ELPIDA,
CIRRUS,
TRACO,
SONY,
EPCOS,
MPS,
SST,
RECOM,
LAMBDA,
BB,
CREE,
AUO,
IC,
SILICON,
EVERLIGHT,
QFN,
CJ(CHINA),
EPSON,
SIPEX,
DIODES,
IXYS,
NXP/PHI,
BB/TI,
ASTEC,
ALLEGRO,
SPANSION,
AOS,
POWER,
CONEXANT,
TI ,
FTDI,
MXIC,
VICOR,
TI,
AD,
ST,
ALTERA,
XILINX,
NS,
ATMEL,
MAX,
NXP,
INTEL,
SAMSUNG,
MICROCHIP,
CY,
FSC,
MURATA,
PANASONIC,
TOS,
ON,
AVX,
IR,
INFINEON,
VISHAY,
LINEAR,
NVIDIA,
FUJI,
LATTICE,
MICRON,
BRIGHT,
AMD,
FREESCALE,
MOT,
模块,
PHI,
BROADCOM,
NEC,
SEMIKRON,
ROHM,
SANYO,
STMICROELECTRONICS,
DALLAS,
RENESAS,
SHARP,
YAGEO,
QUALCOMM,
HIT,
MIT,
HARVATEK,
KEMET,
AVAGO,
COOPER,
MOLEX,
INTERSIL,
MICREL,
ATI,
ISD/NUVOTON,
TDK,
AGILENT,
ISSI,
BOURNS,
HYNIX,
COILCRAFT,
IDT,
LITTELFUSE,
FUJITSU,
KOA KAOHSIUNG CORPORATION,
SEIKO,
ELPIDA,
TRACO,
CIRRUS,
MPS,
SONY,
EPCOS,
RECOM,
SST,
LAMBDA,
EPSON,
AUO,
CREE,
IC,
BB,
SILICON,
EVERLIGHT,
QFN,
CJ(CHINA),
NXP/PHI,
DIODES,
SIPEX,
STACKPOLE TECHNOLOGY, INC.,
ASTEC,
BB/TI,
MXIC,
POWER,
AOS,
SPANSION,
TI ,
ALLEGRO,
FTDI,
IXYS,
REALTEK,
VICOR,
TI,
AD,
ST,
ALTERA,
ATMEL,
XILINX,
NS,
MAX,
NXP,
INTEL,
SAMSUNG,
MICROCHIP,
CY,
FSC,
TOS,
MURATA,
ON,
PANASONIC,
IR,
AVX,
VISHAY,
INFINEON,
LINEAR,
FREESCALE,
NVIDIA,
FUJI,
MICRON,
LATTICE,
AMD,
BRIGHT,
MOT,
PHI,
NEC,
BROADCOM,
SANYO,
ROHM,
SEMIKRON,
STMICROELECTRONICS,
RENESAS,
DALLAS,
SHARP,
YAGEO,
INTERSIL,
QUALCOMM,
HIT,
MIT,
HARVATEK,
KEMET,
AVAGO,
MOLEX,
MICREL,
COOPER,
ATI,
ISD/NUVOTON,
TDK,
ISSI,
AGILENT,
HYNIX,
IDT,
BOURNS,
COILCRAFT,
FUJITSU,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
SEIKO,
ELPIDA,
CIRRUS,
TRACO,
MPS,
POWER,
AOS,
SST,
EPCOS,
SONY,
DIP,
EPSON,
SIPEX,
RECOM,
模块,
LAMBDA,
EUPEC,
AUO,
IC,
BB,
CREE,
QFN,
SILICON,
EVERLIGHT,
SPANSION,
CJ(CHINA),
DIODES,
NXP/PHI,
STACKPOLE TECHNOLOGY, INC.,
MXIC,
ASTEC,
BB/TI,
WINBOND,
ALLEGRO,
TI ,
FTDI,
TI,
ST,
AD,
ALTERA,
ATMEL,
XILINX,
NS,
MAX,
NXP,
INTEL,
SAMSUNG,
MICROCHIP,
CY,
FSC,
TOS,
MURATA,
ON,
PANASONIC,
VISHAY,
INFINEON,
AVX,
FUJI,
IR,
MICRON,
LINEAR,
FREESCALE,
NVIDIA,
LATTICE,
SEMIKRON,
MOT,
BRIGHT,
AMD,
NEC,
PHI,
SANYO,
ROHM,
BROADCOM,
STMICROELECTRONICS,
RENESAS,
SHARP,
DALLAS,
YAGEO,
INTERSIL,
HIT,
QUALCOMM,
MIT,
AVAGO,
HARVATEK,
KEMET,
MOLEX,
COOPER,
MICREL,
ATI,
ISD/NUVOTON,
ISSI,
TDK,
AGILENT,
HYNIX,
IDT,
BOURNS,
COILCRAFT,
FUJITSU,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
SEIKO,
ELPIDA,
CIRRUS,
TRACO,
MPS,
AOS,
EPCOS,
POWER,
DIP,
LAMBDA,
SIPEX,
RECOM,
模块,
EUPEC,
BB/TI,
SST,
AUO,
CREE,
IC,
EVERLIGHT,
QFN,
SILICON,
ABB,
RECTRON,
EPSON,
CJ(CHINA),
DIODES,
SONY,
NXP/PHI,
STACKPOLE TECHNOLOGY, INC.,
SPANSION,
ASTEC,
WINBOND,
ALLEGRO,
TI ,
CONEXANT,
TI,
ST,
AD,
ALTERA,
ATMEL,
XILINX,
NS,
MAX,
NXP,
INTEL,
SAMSUNG,
MICROCHIP,
FSC,
CY,
TOS,
MURATA,
ON,
PANASONIC,
INFINEON,
VISHAY,
AVX,
IR,
FUJI,
MICRON,
LINEAR,
FREESCALE,
NVIDIA,
SEMIKRON,
LATTICE,
MOT,
NEC,
AMD,
BRIGHT,
PHI,
SANYO,
ROHM,
BROADCOM,
RENESAS,
STMICROELECTRONICS,
DALLAS,
SHARP,
YAGEO,
INTERSIL,
HIT,
QUALCOMM,
MIT,
AVAGO,
KEMET,
HARVATEK,
MOLEX,
COOPER,
MICREL,
ATI,
ISD/NUVOTON,
TDK,
FUJITSU,
ISSI,
AGILENT,
HYNIX,
IDT,
BOURNS,
COILCRAFT,
LITTELFUSE,
SEIKO,
KOA KAOHSIUNG CORPORATION,
ELPIDA,
EPCOS,
TRACO,
CIRRUS,
MPS,
POWER,
LAMBDA,
DIP,
RECOM,
模块,
EUPEC,
SST,
AUO,
BB/TI,
CREE,
IC,
SILICON,
EVERLIGHT,
QFN,
ABB,
SONY,
EPSON,
RECTRON,
SIPEX,
DIODES,
CJ(CHINA),
SPANSION,
AOS,
ALLEGRO,
NXP/PHI,
STACKPOLE TECHNOLOGY, INC.,
WINBOND,
CONEXANT,
ASTEC,
MXIC,
TI,
ST,
AD,
ALTERA,
ATMEL,
NS,
MAX,
XILINX,
NXP,
INTEL,
MICROCHIP,
CY,
SAMSUNG,
FSC,
TOS,
MURATA,
ON,
PANASONIC,
INFINEON,
VISHAY,
AVX,
FUJI,
IR,
LINEAR,
FREESCALE,
NVIDIA,
SEMIKRON,
LATTICE,
MICRON,
MOT,
NEC,
AMD,
BRIGHT,
PHI,
BROADCOM,
ROHM,
SANYO,
STMICROELECTRONICS,
DALLAS,
RENESAS,
SHARP,
YAGEO,
INTERSIL,
HIT,
QUALCOMM,
AVAGO,
MIT,
KEMET,
HARVATEK,
MOLEX,
COOPER,
MICREL,
ATI,
ISD/NUVOTON,
TDK,
ISSI,
AGILENT,
FUJITSU,
HYNIX,
IDT,
BOURNS,
COILCRAFT,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
SEIKO,
ELPIDA,
TRACO,
CIRRUS,
EPCOS,
MPS,
POWER,
LAMBDA,
DIP,
RECOM,
模块,
EUPEC,
SST,
AUO,
BB/TI,
CREE,
IC,
SILICON,
EVERLIGHT,
ABB,
QFN,
SONY,
EPSON,
RECTRON,
SIPEX,
CJ(CHINA),
AOS,
ALLEGRO,
NXP/PHI,
SPANSION,
STACKPOLE TECHNOLOGY, INC.,
WINBOND,
CONEXANT,
ASTEC,
REALTEK,
TI ,
TI,
ST,
AD,
ALTERA,
ATMEL,
NS,
MAX,
XILINX,
NXP,
INTEL,
MICROCHIP,
CY,
SAMSUNG,
FSC,
TOS,
MURATA,
ON,
PANASONIC,
INFINEON,
VISHAY,
AVX,
FUJI,
IR,
LINEAR,
FREESCALE,
NVIDIA,
SEMIKRON,
LATTICE,
MICRON,
MOT,
NEC,
AMD,
BRIGHT,
PHI,
BROADCOM,
ROHM,
SANYO,
STMICROELECTRONICS,
DALLAS,
RENESAS,
SHARP,
YAGEO,
INTERSIL,
HIT,
QUALCOMM,
AVAGO,
MIT,
KEMET,
HARVATEK,
ISSI,
MOLEX,
COOPER,
MICREL,
NUVOTON,
ATI,
ISD/NUVOTON,
TDK,
AGILENT,
FUJITSU,
HYNIX,
IDT,
BOURNS,
COILCRAFT,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
SEIKO,
ELPIDA,
TRACO,
CIRRUS,
EPCOS,
MPS,
POWER,
LAMBDA,
DIP,
RECOM,
模块,
EUPEC,
WINBOND,
SST,
AUO,
BB/TI,
CREE,
IC,
SILICON,
BCD,
EVERLIGHT,
ABB,
QFN,
SONY,
EPSON,
RECTRON,
SIPEX,
CJ(CHINA),
AOS,
ALLEGRO,
NXP/PHI,
SPANSION,
STACKPOLE TECHNOLOGY, INC.,
CONEXANT,
ASTEC,
TI,
ST,
AD,
ALTERA,
ATMEL,
NS,
MAX,
XILINX,
NXP,
INTEL,
MICROCHIP,
CY,
SAMSUNG,
FSC,
MURATA,
TOS,
PANASONIC,
ON,
INFINEON,
VISHAY,
AVX,
FUJI,
IR,
FREESCALE,
LINEAR,
NVIDIA,
SEMIKRON,
LATTICE,
MICRON,
MOT,
AMD,
BRIGHT,
NEC,
PHI,
BROADCOM,
ROHM,
STMICROELECTRONICS,
SANYO,
DALLAS,
SHARP,
RENESAS,
YAGEO,
INTERSIL,
HIT,
QUALCOMM,
MIT,
KEMET,
AVAGO,
HARVATEK,
ISSI,
MOLEX,
COOPER,
MICREL,
NUVOTON,
ATI,
ISD/NUVOTON,
TDK,
AGILENT,
FUJITSU,
IDT,
HYNIX,
BOURNS,
COILCRAFT,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
SEIKO,
ELPIDA,
TRACO,
CIRRUS,
EPCOS,
MPS,
LAMBDA,
DIP,
RECOM,
模块,
EUPEC,
WINBOND,
SST,
AUO,
BB/TI,
CREE,
IC,
SILICON,
BCD,
EVERLIGHT,
ABB,
QFN,
EPSON,
RECTRON,
POWER,
SONY,
CJ(CHINA),
AOS,
NXP/PHI,
SIPEX,
SPANSION,
STACKPOLE TECHNOLOGY, INC.,
ASTEC,
ALLEGRO,
TI ,
TI,
AD,
ST,
ALTERA,
ATMEL,
NS,
MAX,
XILINX,
NXP,
INTEL,
SAMSUNG,
MICROCHIP,
CY,
FSC,
MURATA,
TOS,
ON,
PANASONIC,
INFINEON,
VISHAY,
AVX,
FUJI,
IR,
FREESCALE,
LINEAR,
NVIDIA,
SEMIKRON,
MICRON,
LATTICE,
AMD,
MOT,
BRIGHT,
NEC,
PHI,
BROADCOM,
ROHM,
DALLAS,
STMICROELECTRONICS,
SANYO,
ALLEGRO,
SHARP,
RENESAS,
YAGEO,
INTERSIL,
HIT,
QUALCOMM,
MIT,
KEMET,
AVAGO,
ISSI,
HARVATEK,
MOLEX,
MICREL,
COOPER,
NUVOTON,
ATI,
ISD/NUVOTON,
TDK,
AGILENT,
FUJITSU,
HYNIX,
IDT,
BOURNS,
COILCRAFT,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
INNOLUX,
SEIKO,
ELPIDA,
TRACO,
CIRRUS,
EPCOS,
MPS,
SST,
LAMBDA,
DIP,
RECOM,
模块,
EUPEC,
WINBOND,
AUO,
BB/TI,
SILICON,
CREE,
IC,
BB,
BCD,
EVERLIGHT,
ABB,
POWER,
QFN,
EPSON,
RECTRON,
SPANSION,
SONY,
CJ(CHINA),
AOS,
NXP/PHI,
SIPEX,
STACKPOLE TECHNOLOGY, INC.,
TI,
AD,
ST,
MAX,
ALTERA,
ATMEL,
NXP,
NS,
XILINX,
INTEL,
MICROCHIP,
SAMSUNG,
CY,
FSC,
ON,
MURATA,
TOS,
PANASONIC,
INFINEON,
VISHAY,
IR,
AVX,
FREESCALE,
LINEAR,
NVIDIA,
LATTICE,
MICRON,
MOT,
SEMIKRON,
AMD,
NEC,
PHI,
BROADCOM,
ALLEGRO,
ROHM,
SANYO,
DALLAS,
FUJI,
SHARP,
STMICROELECTRONICS,
COILCRAFT,
RENESAS,
YAGEO,
INTERSIL,
AVAGO,
QUALCOMM,
HIT,
MIT,
KEMET,
ISSI,
HARVATEK,
SUMIDA,
MOLEX,
COOPER,
MICREL,
TDK,
NUVOTON,
ATI,
ISD/NUVOTON,
FUJITSU,
HYNIX,
AGILENT,
IDT,
BOURNS,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
TRACO,
SEIKO,
INNOLUX,
BB,
ELPIDA,
CIRRUS,
EPCOS,
MPS,
SST,
SILICON,
DIP,
EUPEC,
RECOM,
模块,
POWER,
WINBOND,
AUO,
BB/TI,
CREE,
IC,
EVERLIGHT,
BCD,
SPANSION,
EPSON,
SONY,
RECTRON,
AOS,
CJ(CHINA),
QFN,
SIPEX,
NXP/PHI,
STACKPOLE TECHNOLOGY, INC.,
COSEL,
MXIC,
TI,
AD,
ST,
MAX,
ALTERA,
ATMEL,
NXP,
NS,
XILINX,
INTEL,
MICROCHIP,
CY,
SAMSUNG,
ON,
FSC,
MURATA,
TOS,
INFINEON,
PANASONIC,
VISHAY,
IR,
AVX,
FREESCALE,
LINEAR,
NVIDIA,
LATTICE,
MICRON,
MOT,
AMD,
SEMIKRON,
NEC,
PHI,
BROADCOM,
ALLEGRO,
ROHM,
SANYO,
DALLAS,
FUJI,
SHARP,
STMICROELECTRONICS,
COILCRAFT,
RENESAS,
YAGEO,
INTERSIL,
AVAGO,
HIT,
QUALCOMM,
MIT,
ISSI,
KEMET,
HARVATEK,
SUMIDA,
MOLEX,
COOPER,
MICREL,
TDK,
NUVOTON,
ATI,
ISD/NUVOTON,
FUJITSU,
AGILENT,
IDT,
BOURNS,
LITTELFUSE,
HYNIX,
KOA KAOHSIUNG CORPORATION,
TRACO,
BB,
SEIKO,
INNOLUX,
CIRRUS,
EPCOS,
MPS,
SST,
SILICON,
DIP,
EUPEC,
RECOM,
模块,
POWER,
WINBOND,
TE CONNECTIVITY ,
AUO,
BB/TI,
CREE,
IC,
EVERLIGHT,
BCD,
SPANSION,
SONY,
EPSON,
RECTRON,
DIODES,
AOS,
CJ(CHINA),
QFN,
SIPEX,
NXP/PHI,
STACKPOLE TECHNOLOGY, INC.,
COSEL,
TI,
AD,
MAX,
ALTERA,
ST,
ATMEL,
NXP,
NS,
MICROCHIP,
XILINX,
TOS,
CY,
ON,
INFINEON,
FSC,
INTEL,
MURATA,
PANASONIC,
IR,
VISHAY,
MICRON,
SAMSUNG,
AVX,
FREESCALE,
LINEAR,
LATTICE,
MOT,
SEMIKRON,
MIT,
NEC,
PHI,
BROADCOM,
ALLEGRO,
DALLAS,
COILCRAFT,
AMD,
ROHM,
RENESAS,
SHARP,
FUJI,
NVIDIA,
STMICROELECTRONICS,
YAGEO,
AVAGO,
INTERSIL,
HIT,
QUALCOMM,
KEMET,
HARVATEK,
ISSI,
SUMIDA,
MOLEX,
COOPER,
MICREL,
TDK,
NUVOTON,
SANYO,
ISD/NUVOTON,
AGILENT,
FUJITSU,
VICOR,
IDT,
BOURNS,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
TRACO,
BB,
SEIKO,
INNOLUX,
SONY,
CIRRUS,
EPCOS,
MPS,
SILICON,
DIP,
SST,
模块,
POWER,
TE CONNECTIVITY ,
BB/TI,
AUO,
WINBOND,
IC,
CREE,
EVERLIGHT,
ATI,
EUPEC,
BCD,
SPANSION,
EPSON,
DIODES,
AOS,
CJ(CHINA),
QFN,
NXP/PHI,
SIPEX,
STACKPOLE TECHNOLOGY, INC.,
MIC,
JST,
MXIC,
TI,
AD,
MAX,
ST,
ALTERA,
NS,
ATMEL,
NXP,
MICROCHIP,
XILINX,
TOS,
CY,
ON,
INFINEON,
INTEL,
FSC,
MURATA,
PANASONIC,
IR,
VISHAY,
MICRON,
SAMSUNG,
FREESCALE,
AVX,
LINEAR,
LATTICE,
MOT,
SEMIKRON,
PHI,
NEC,
RENESAS,
MIT,
BROADCOM,
ALLEGRO,
DALLAS,
NVIDIA,
ROHM,
COILCRAFT,
AMD,
SHARP,
FUJI,
STMICROELECTRONICS,
YAGEO,
HIT,
INTERSIL,
AVAGO,
QUALCOMM,
ISSI,
KEMET,
HARVATEK,
SUMIDA,
MOLEX,
MICREL,
COOPER,
SANYO,
TDK,
NUVOTON,
BB,
ISD/NUVOTON,
FUJITSU,
AGILENT,
VICOR,
IDT,
BOURNS,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
SONY,
TRACO,
SEIKO,
INNOLUX,
CIRRUS,
MPS,
EPCOS,
SST,
SILICON,
DIP,
模块,
POWER,
TE CONNECTIVITY ,
BB/TI,
WINBOND,
AUO,
IC,
CREE,
EVERLIGHT,
ATI,
EUPEC,
BCD,
SPANSION,
MIC,
EPSON,
DIODES,
AOS,
CJ(CHINA),
QFN,
SIPEX,
NXP/PHI,
STACKPOLE TECHNOLOGY, INC.,
HYNIX,
MXIC,
TI,
AD,
ST,
MAX,
NS,
NXP,
ALTERA,
TOS,
ATMEL,
ON,
MICROCHIP,
INTEL,
XILINX,
INFINEON,
VISHAY,
CY,
FSC,
MURATA,
PANASONIC,
MICRON,
SAMSUNG,
IR,
AVX,
LINEAR,
FREESCALE,
LATTICE,
MOT,
AMD,
PHI,
SEMIKRON,
NEC,
NVIDIA,
RENESAS,
BROADCOM,
ALLEGRO,
ROHM,
COILCRAFT,
DALLAS,
SHARP,
AVAGO,
YAGEO,
HIT,
INTERSIL,
KEMET,
HARVATEK,
ISSI,
MIT,
SANYO,
SUMIDA,
MOLEX,
COOPER,
MICREL,
QUALCOMM,
NUVOTON,
BB,
ATI,
ISD/NUVOTON,
TDK,
FUJI,
FUJITSU,
AGILENT,
VICOR,
BOURNS,
EUPEC,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
MCP,
TRACO,
IDT,
SEIKO,
SONY,
INNOLUX,
EPCOS,
MPS,
CIRRUS,
SST,
SILICON,
DIP,
RECOM,
模块,
POWER,
TE CONNECTIVITY ,
BB/TI,
AUO,
IC,
EVERLIGHT,
SPANSION,
WINBOND,
CREE,
MIC,
BCD,
DIODES,
AOS,
CJ(CHINA),
QFN,
NXP/PHI,
AT,
EPSON,
STACKPOLE TECHNOLOGY, INC.,
MXIC,
TI,
AD,
ST,
MAX,
NS,
NXP,
ALTERA,
TOS,
ATMEL,
FSC,
ON,
MICROCHIP,
INTEL,
XILINX,
INFINEON,
VISHAY,
CY,
MURATA,
PANASONIC,
MICRON,
SAMSUNG,
IR,
AVX,
FREESCALE,
LINEAR,
AMD,
LATTICE,
MOT,
PHI,
SEMIKRON,
NEC,
NVIDIA,
RENESAS,
BROADCOM,
ALLEGRO,
ROHM,
COILCRAFT,
DALLAS,
SHARP,
AVAGO,
YAGEO,
FUJI,
HIT,
HARVATEK,
ISSI,
KEMET,
MIT,
SANYO,
INTERSIL,
MOLEX,
SUMIDA,
COOPER,
MICREL,
QUALCOMM,
NUVOTON,
BB,
ATI,
ISD/NUVOTON,
TDK,
FUJITSU,
AGILENT,
VICOR,
BOURNS,
EUPEC,
LITTELFUSE,
KOA KAOHSIUNG CORPORATION,
MCP,
SONY,
TRACO,
IDT,
SEIKO,
INNOLUX,
EPCOS,
MPS,
CIRRUS,
SST,
SPANSION,
DIP,
SILICON,
RECOM,
模块,
TE CONNECTIVITY ,
WINBOND,
BB/TI,
AUO,
IC,
EVERLIGHT,
BCD,
CREE,
MIC,
POWER,
DIODES,
AOS,
HYNIX,
CJ(CHINA),
QFN,
NXP/PHI,
AT,
EPSON,
STACKPOLE TECHNOLOGY, INC.,
TI,
AD,
ST,
MAX,
NS,
NXP,
ALTERA,
ATMEL,
FSC,
MICROCHIP,
ON,
TOS,
INTEL,
XILINX,
INFINEON,
CY,
VISHAY,
MURATA,
PANASONIC,
MICRON,
SAMSUNG,
IR,
AVX,
FREESCALE,
LINEAR,
MOT,
LATTICE,
AMD,
SEMIKRON,
PHI,
NEC,
IXYS,
BROADCOM,
ALLEGRO,
ROHM,
RENESAS,
COILCRAFT,
AVAGO,
DALLAS,
SHARP,
NVIDIA,
YAGEO,
FUJI,
HIT,
模块,
SANYO,
HARVATEK,
ISSI,
KEMET,
MIT,
INTERSIL,
MOLEX,
SUMIDA,
ATI,
COOPER,
QUALCOMM,
MICREL,
NUVOTON,
POWER,
TDK,
BB,
ISD/NUVOTON,
VICOR,
EUPEC,
IDT,
BOURNS,
LITTELFUSE,
FUJITSU,
SONY,
TRACO,
KOA KAOHSIUNG CORPORATION,
MCP,
SEIKO,
EPCOS,
MPS,
SST,
SPANSION,
SILICON,
RECOM,
MURATA PS,
WINBOND,
TE CONNECTIVITY ,
INNOLUX,
BB/TI,
EVERLIGHT,
IC,
BCD,
CREE,
MIC,
CIRRUS,
DIODES,
AT,
QFN,
AOS,
NXP/PHI,
EPSON,
STACKPOLE TECHNOLOGY, INC.,
JST,
REALTEK,
MXIC,
TI,
AD,
ST,
MAX,
NS,
NXP,
ALTERA,
ATMEL,
FSC,
MICROCHIP,
ON,
TOS,
INTEL,
XILINX,
INFINEON,
CY,
VISHAY,
MURATA,
PANASONIC,
MICRON,
SAMSUNG,
IR,
AVX,
FREESCALE,
LINEAR,
MOT,
SEMIKRON,
LATTICE,
AMD,
PHI,
NEC,
IXYS,
BROADCOM,
ALLEGRO,
ROHM,
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Product Summary
CD40106BMJ/883QS
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: CD40106BMJ/883QS.


Available from: Beijing Circle World(HuanQiuChangTong) Electronics Co., Ltd
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:72F651AR6T1, TLV1117-33CDCYR, 1SMA5921BT3G, AR709LT, XC2S15, MAX6301, 74HC139, ATD75AA100, MAX208CAG, T491C476K016AT, TAJD476K025RNJ, XC5VLX85T-3FFG1136C, UBA2032T, PM100CVA060, FN3300055, MCR01MZSF5492-D

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: CD40106BMJ/883QS":

Post DatePart NumberBrandD/CDescQtyCompany
Sat Apr 13 03:07:00 UTC 2013CD40106BMJ/883QS (from standard server 2)200Beijing Circle World(HuanQiuChangTong) Electronics Co., Ltd
Sat Apr 13 03:07:00 UTC 2013CD40106BMJ/883QS (from parts server 2)200Beijing Circle World(HuanQiuChangTong) Electronics Co., Ltd
Sat Apr 13 03:07:00 UTC 2013CD40106BMJ/883QS (from hkin.com 2)200Beijing Circle World(HuanQiuChangTong) Electronics Co., Ltd
Sat Apr 13 03:07:00 UTC 2013CD40106BMJ/883QS (from hkin.com 2)200Beijing Circle World(HuanQiuChangTong) Electronics Co., Ltd

Last record MCR01MZSF5492-D:

Post DatePart NumberBrandD/CDescQtyCompany

Last record FN3300055:

Post DatePart NumberBrandD/CDescQtyCompany

Last record PM100CVA060:

Post DatePart NumberBrandD/CDescQtyCompany

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vid:offerengine20130514 Part Number Prefix

CD40106BMJ/883QS,CD40106BMJ/883QS,Comments from user about CD40106BMJ/883QS: The IGBT is a recent component, so its performance improves regularly as technology evolves. Competing projects would result in the IBM POWER and Sun SPARC architectures. The first commercial RISC microprocessor design was released either by MIPS Computer Systems, the 32-bit R2000 (the R1000 was not released) or by Acorn computers, the 32-bit ARM2 in 1987.Different temperature coefficients are specified for various applications, including nuclear, electrical and magnetic. In 1986, HP released its first system with a PA-RISC CPU. Noyce also came up with his own idea of an integrated circuit half a year later than Kilby. Modern designs have rather complex statistical prediction systems, which watch the results of past branches to predict the future with greater accuracy. Common-emitter amplifiers are also used in radio frequency circuits, for example to amplify faint signals received by an antenna. Anything related to :CD40106BMJ/883QS, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: CD40106BMJ/883QS, search hkinventory: CD40106BMJ/883QS, Its importance in today's society rests on its ability to be mass produced using a highly automated process (semiconductor device fabrication) that achieves astonishingly low per-transistor costs. This includes decisions on the performance-level and connectivity of these peripherals. Alternatively, additional logic can be added to a simple transparent latch to make it non-transparent or opaque when another input (an "enable" input) is not asserted. A component that is not passive is called an active component. Datasheet Dir, DataSheet Archive
In 2008, Accellera released VHDL 4. In 2005, the first personal computer dual-core processors were announced. The integrated circuit's mass production capability, reliability, and building-block approach to circuit design ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. LEDs present many advantages over incandescent light sources including lower energy consumption, longer lifetime, improved robustness, smaller size, faster switching, and greater durability and reliability. Most of them should not be used in linear operation. Digital Signal Processors are another example. Techniques for heat dissipation can include heat sinks and fans for air cooling, and other forms of computer cooling such as water cooling. The large contact area and short distance reduces both the inductance and resistance of the connection.
any passive component and active component such as:1N4148, or 6502 It is an example of sequential digital logic, as it has internal memory.0 also informally known as VHDL 2008, which addressed more than 90 issues discovered during the trial period for version 3. The MOSFET is the most used semiconductor device today. Digital Signal Processors are another example. For example driver circuit
CD40106BMJ/883QS,CD40106BMJ/883QS,Comments from user about CD40106BMJ/883QS: A minimal hypothetical microprocessor might only include an arithmetic logic unit (ALU) and a control logic section. The capacitance is greatest when there is a narrow separation between large areas of conductor, hence capacitor conductors are often called "plates," referring to an early means of construction. Passive filters are uncommon in monolithic integrated circuit design, where active devices are inexpensive compared to resistors and capacitors, and inductors are prohibitively expensive. Generally, in datasheets, turn-off energy is mentioned as a measured parameter and one has to multiply that number with the switching frequency of the intended application to estimate the turn-off loss. By paralleling several devices, it is possible to increase the current rating of a switch. Once a fault is detected, contacts within the circuit breaker must open to interrupt the circuit; some mechanically-stored energy (using something such as springs or compressed air) contained within the breaker is used to separate the contacts, although some of the energy required may be obtained from the fault current itself. The circuit can be made to change state by signals applied to one or more control inputs and will have one or two outputs. The trip solenoid that releases the latch is usually energized by a separate battery, although some high-voltage circuit breakers are self-contained with current transformers, protection relays, and an internal control power source. Anything related to :CD40106BMJ/883QS, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: CD40106BMJ/883QSSee also: