Part: PIC16C712-20I/P

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Offer Index 23

INTERSIL,
AMD,
YAGEO,
MPS,
AVAGO,
SIEMENS,
SHARP,
MIC,
BOURNS,
VICOR,
HIT,
MOLEX,
NICHICON,
ISSI,
MICREL,
AMP,
TDK,
NIPPON CHEMI-CON,
PERICOM,
LAMBDA,
EPSON,
SANYO,
COOPER,
EUPEC,
MICRON,
NUVOTON,
LITTELFUSE,
SILICON,
EPCOS,
MURATAPS,
COILCRAFT,
HYNIX,
AVX,
ISD/NUVOTON,
MURATA PS,
SEMIKRON,
BROADCOM,
WINBOND,
COSEL,
SST

 
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Product Summary
MICROCHIP PIC16C712-20I/P
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: PIC16C712-20I/P.


Available from: EkeLive Technology (Hongkong) Limited
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:NSCW505CT, NTJS4405N, OPA2244EA/2K5G4, OPA2333AIDGKR, OPA2350UA, OPA547T, P0300ECLRP1, P6KE20A, P87C750EBPN, PC411, PDTC143ZE, PEB4266TV1.2, PGA309AIPWT, PIC12F510, PIC12F629-I/SN, PIC12F683

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: PIC16C712-20I/P":

Post DatePart NumberBrandD/CDescQtyCompany
Fri Jan 13 00:54:00 UTC 2012PIC16C712-20I/P (from hkin.com)MICROCHIP0413+DIP175EkeLive Technology (Hongkong) Limited
Fri Jan 13 00:54:00 UTC 2012PIC16C712-20I/P (from standard server 2)MICROCHIP0413+DIP175EkeLive Technology (Hongkong) Limited
Fri Jan 13 00:54:00 UTC 2012PIC16C712-20I/P (from parts server 2)MICROCHIP0413+DIP175EkeLive Technology (Hongkong) Limited
Fri Jan 13 00:54:00 UTC 2012PIC16C712-20I/P (from hkin.com 2)MICROCHIP0413+DIP175EkeLive Technology (Hongkong) Limited
Fri Jan 13 00:54:00 UTC 2012PIC16C712-20I/P (from hkin.com 2)MICROCHIP0413+DIP175EkeLive Technology (Hongkong) Limited

Last record PIC12F683:

Post DatePart NumberBrandD/CDescQtyCompany
Wed Jan 11 01:32:00 UTC 2012PIC12F683-I/SN (from hkin.com)MicrochipROHSnew & original10000Ontech Electronics International Limited
Mon Jan 9 01:53:00 UTC 2012PIC12F683-I/P (from hkin.com)MICROCHIP11+DIP-811800Hong Kong Rding Tech Co., Limited
Mon Jan 9 01:53:00 UTC 2012PIC12F683-I/SN (from hkin.com)MICROCHIP11+SOP811800Hong Kong Rding Tech Co., Limited
Wed Jan 11 01:32:00 UTC 2012PIC12F683-I/SN (from hkin.com)MicrochipROHSNew&Original20000Ontech Electronics International Limited
Tue Jan 10 04:00:00 UTC 2012PIC12F683-I/MD (from hkin.com)MIC09+4522Jacico Electronic Co., Limited
Fri Jan 13 06:04:00 UTC 2012PIC12F683-I/SN (from hkin.com)MICROCHIP10+SOP-815800E-Future International Trading Co., Limited
Wed Jan 11 02:25:00 UTC 2012PIC12F683-I/P (from hkin.com)Microchip11+new and original10000Power Start Electronics Company

Last record PIC12F629-I/SN:

Post DatePart NumberBrandD/CDescQtyCompany
Wed Jan 11 01:32:00 UTC 2012PIC12F629-I/SN (from hkin.com)MicrochipROHSnew & original10000Ontech Electronics International Limited
Tue Jan 17 03:10:00 UTC 2012PIC12F629-I/SN (from hkin.com)MICROCHIP10+IN ORIGINAL PACKAGE20000Forbest Global Communication Co., Limited
Wed Dec 28 03:18:00 UTC 2011PIC12F629-I/SN (from hkin.com)MICROCHIP2010+SOP-825600Shenzhen Xinyuanjiang Trade Co.,Ltd
Mon Jan 9 01:53:00 UTC 2012PIC12F629-I/SN (from hkin.com)MICROCHIP11+SOP811800Hong Kong Rding Tech Co., Limited
Fri Jan 13 00:55:00 UTC 2012PIC12F629-I/SN (from hkin.com)MIC10+36200HK Xlwy International Co., Limited
Fri Dec 23 02:34:00 UTC 2011PIC12F629-I/SN (from hkin.com)402S&L Technology Development Co. ,Limited
Wed Jan 11 01:32:00 UTC 2012PIC12F629-I/SN (from hkin.com)MicrochipROHSNew&Original20000Ontech Electronics International Limited
Mon Jan 16 02:18:00 UTC 2012PIC12F629-I/SN (from hkin.com)Microchip20098000Rs (Int'l) Electronics Limited
Thu Dec 22 02:14:00 UTC 2011PIC12F629-I/SN (from hkin.com)MICROCHIP11+100000Shinever Technology Limited

Last record PIC12F510:

Post DatePart NumberBrandD/CDescQtyCompany
Wed Jan 4 08:46:00 UTC 2012PIC12F510-I/P (from hkin.com)MICROCHIP18800Bostar Electronics (H.K.) Co.
Wed Jan 4 08:46:00 UTC 2012PIC12F510-I/SN (from hkin.com)MICROCHIP18800Bostar Electronics (H.K.) Co.

If you want to find more about PIC16C712-20I/P, please visit us on HKin


vid:offerengine20120117

PIC16C712-20I/P,PIC16C712-20I/P,Comments from user about PIC16C712-20I/P: Integrated circuits were made possible by experimental discoveries showing that semiconductor devices could perform the functions of vacuum tubes and by mid-20th-century technology advancements in semiconductor device fabrication. Actually, all power semiconductors rely on a PIN diode structure to sustain voltage. The trade-off between voltage, current and frequency ratings also exists for the switches. The key advantage of VHDL, when used for systems design, is that it allows the behavior of the required system to be described (modeled) and verified (simulated) before synthesis tools translate the design into real hardware (gates and wires). With the transition to the LGA1366 and LGA1156 socket and the Intel i7 and i5 chips, quad core is now considered mainstream, but with the release of the i7-980x, six core processors are now well within reach. A capacitor is a passive electronic component consisting of a pair of conductors separated by a dielectric (insulator).VHDL is frequently used for two different goals: simulation of electronic designs and synthesis of such designs. They are also called power devices or when used in integrated circuits, called power ICs. Anything related to :PIC16C712-20I/P, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: PIC16C712-20I/P, search hkinventory: PIC16C712-20I/P, Produced at Fairchild Semiconductor, it was made of silicon, whereas Kilby's chip was made of germanium. Because the cores are physically very close to each other, they can communicate with each other much faster than separate processors in a multiprocessor system, which improves overall system performance. The MOSFET is particularly suited to this configuration because its positive thermal coefficient of resistance tends to balance current between individual devices. Its basic function is to detect a fault condition and, by interrupting continuity, to immediately discontinue electrical flow. Datasheet Dir, DataSheet Archive
A conventional solid-state diode will not allow significant current if it is reverse-biased below its reverse breakdown voltage. Generally, in datasheets, turn-off energy is mentioned as a measured parameter and one has to multiply that number with the switching frequency of the intended application to estimate the turn-off loss. For example, most constructs that explicitly deal with timing such as wait for 10 ns; are not synthesizable despite being valid for simulation. Band-pass filters ?attenuation of frequencies both above and below those they allow to pass. The field may be applied by a reverse-biased p-n junction, forming a junction field effect transistor, or JFET; or by an electrode isolated from the bulk material by an oxide layer, forming a metal-oxide-semiconductor field effect transistor, or MOSFET. Existing integer registers are extended as are all related data pathways, but, as was the case with IA-32, both floating point and vector units had been operating at or above 64 bits for several years. MOSFET is an IC which is semiconductor device. MOSFET is an IC which is semiconductor device.
any passive component and active component such as:Diode, Because the cores are physically very close to each other, they can communicate with each other much faster than separate processors in a multiprocessor system, which improves overall system performance. By paralleling several devices, it is possible to increase the current rating of a switch. MOSFET is an IC which is semiconductor device. Flip-flops and latches are used as data storage elements. For example driver circuit
PIC16C712-20I/P,PIC16C712-20I/P,Comments from user about PIC16C712-20I/P: For example, an engine control system in an automobile can adjust ignition timing based on engine speed, load on the engine, ambient temperature, and any observed tendency for knocking - allowing an automobile to operate on a range of fuel grades. A simulation program is used to test the logic design using simulation models to represent the logic circuits that interface to the design. Although several companies each produce over a billion individually packaged (known as discrete) transistors every year, the vast majority of transistors now produced are in integrated circuits (often shortened to IC, microchips or simply chips), along with diodes, resistors, capacitors and other electronic components, to produce complete electronic circuits. With the ability to put large numbers of transistors on one chip, it becomes feaible to integrate memory on the same die as the processor. Common emitters are also commonly used as low-noise amplifiers. Floating-point arithmetic, for example, was often not available on 8-bit microprocessors, but had to be carried out in software. Structural changes are often made in power devices to accommodate the higher current density, higher power dissipation and/or higher reverse breakdown voltage. VHDL has constructs to handle the parallelism inherent in hardware designs, but these constructs (processes) differ in syntax from the parallel constructs in Ada (tasks). Anything related to :PIC16C712-20I/P, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: PIC16C712-20I/PSee also: