Part: AC82B43 SLGL7

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Product Summary
BGA AC82B43 SLGL7
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: AC82B43 SLGL7.


Available from: Minki Technology (HK) Limited
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:DS78C20J/883, CU1216LS/AGIGH-3, TMA0512S, TMV0505S, LTST-S32F1KT, C4574G, 3224W-1-500E, MAX8511EXK29, 2SK3582TK-A, BU2520AF, BD82IBX QMGRES, HBC547-C, HD14174BP, HE8551S-D, 2SC2712GR, aa90

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: AC82B43 SLGL7":

Post DatePart NumberBrandD/CDescQtyCompany
Fri Dec 9 15:18:00 UTC 2011AC82B43 SLGL7 (from hkin.com)BGA09+INTEL222Minki Technology (HK) Limited
Fri Dec 9 15:18:00 UTC 2011AC82B43 SLGL7 (from standard server 2)BGA09+INTEL222Minki Technology (HK) Limited
Fri Dec 9 15:18:00 UTC 2011AC82B43 SLGL7 (from parts server 2)BGA09+INTEL222Minki Technology (HK) Limited
Fri Dec 9 15:18:00 UTC 2011AC82B43 SLGL7 (from hkin.com 2)BGA09+INTEL222Minki Technology (HK) Limited
Fri Dec 9 15:18:00 UTC 2011AC82B43 SLGL7 (from hkin.com 2)BGA09+INTEL222Minki Technology (HK) Limited

Last record aa90:

Post DatePart NumberBrandD/CDescQtyCompany
Wed Dec 21 07:53:00 UTC 2011aa90 (from hkin.com)412Hong Kong Inventory Limited

Last record 2SC2712GR:

Post DatePart NumberBrandD/CDescQtyCompany
Fri Dec 2 05:38:00 UTC 20112SC2712GR(TE85L,F) (from hkin.com)500000Green Components Limited
Fri Dec 2 05:38:00 UTC 20112SC2712GR(TE85L,F) (from hkin.com)5000000Green Components Limited

Last record HE8551S-D:

Post DatePart NumberBrandD/CDescQtyCompany
Mon Dec 26 03:59:00 UTC 2011HE8551S-D (from hkin.com)HUAXINTO92100HK CHISHING ELECTRONICS CO,

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any passive component and active component such as:Diode, Many products include Internet connectivity using technologies such as Wi-Fi, Bluetooth or Ethernet. Digital circuits are the most common physical representation of Boolean algebra and are the basis of all digital computers. With the ability to put large numbers of transistors on one chip, it becomes feaible to integrate memory on the same die as the processor. Structural changes are often made in power devices to accommodate the higher current density, higher power dissipation and/or higher reverse breakdown voltage. For example driver circuit
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