Part: PIC18F1320-I/SO

Index Files

Offer Index 12

MAX,
NS,
AD,
ON,
ATMEL,
IR,
XILINX,
TOS,
CY,
ALTERA,
NXP,
FSC,
VISHAY,
MURATA,
NEC,
ROHM,
POWER,
LINEAR,
SAMSUNG,
FREESCALE,
MOT,
DALLAS,
MICROCHIP,
MIT,
BB,
PHI,
INTEL,
PANASONIC,
ALLEGRO,
IXYS,
WJ,
FUJI,
RENESAS,
INTERSIL,
AMD,
YAGEO,
MPS,
AVAGO,
SIEMENS,
SHARP

 
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Product Summary
MICROCHIP PIC18F1320-I/SO
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: PIC18F1320-I/SO.


Available from: Ao Yue (HK) Electronics Trading Co.
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:OP496GSZ, OPA2604U, OPA3682E/2K5, OPA452FAKTWT, OV7630, P120NF10, P82C306, P89LPC907FD, PA50S48-12, PC410, PC87200VUL, PC923L0NSZ0F, PCA9545APW-T, pdiusbd12, PEB3264-0HV1.4, PEX8114-BC13BI

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: PIC18F1320-I/SO":

Post DatePart NumberBrandD/CDescQtyCompany
Mon Jan 16 06:09:00 UTC 2012PIC18F1320-I/SO (from hkin.com)MICROCHIP2010+ROHS & PB-FREE32000Ao Yue (HK) Electronics Trading Co.
Mon Jan 16 06:09:00 UTC 2012PIC18F1320-I/SO (from standard server 2)MICROCHIP2010+ROHS & PB-FREE32000Ao Yue (HK) Electronics Trading Co.
Mon Jan 16 06:09:00 UTC 2012PIC18F1320-I/SO (from parts server 2)MICROCHIP2010+ROHS & PB-FREE32000Ao Yue (HK) Electronics Trading Co.
Mon Jan 16 06:09:00 UTC 2012PIC18F1320-I/SO (from hkin.com 2)MICROCHIP2010+ROHS & PB-FREE32000Ao Yue (HK) Electronics Trading Co.
Mon Jan 16 06:09:00 UTC 2012PIC18F1320-I/SO (from hkin.com 2)MICROCHIP2010+ROHS & PB-FREE32000Ao Yue (HK) Electronics Trading Co.
Fri Jan 13 06:04:00 UTC 2012PIC18F1320-I/SO (from hkin.com)MICROCHIP10+SOP18475E-Future International Trading Co., Limited
Fri Jan 13 06:04:00 UTC 2012PIC18F1320-I/SO (from standard server 2)MICROCHIP10+SOP18475E-Future International Trading Co., Limited
Fri Jan 13 06:04:00 UTC 2012PIC18F1320-I/SO (from parts server 2)MICROCHIP10+SOP18475E-Future International Trading Co., Limited
Fri Jan 13 06:04:00 UTC 2012PIC18F1320-I/SO (from hkin.com 2)MICROCHIP10+SOP18475E-Future International Trading Co., Limited
Fri Jan 13 06:04:00 UTC 2012PIC18F1320-I/SO (from hkin.com 2)MICROCHIP10+SOP18475E-Future International Trading Co., Limited

Last record PEX8114-BC13BI:

Post DatePart NumberBrandD/CDescQtyCompany
Tue Jan 17 00:39:00 UTC 2012PEX8114-BC13BI (from hkin.com)PLX746BGA325Wide Key International Limited

Last record PEB3264-0HV1.4:

Post DatePart NumberBrandD/CDescQtyCompany
Fri Jan 13 08:54:00 UTC 2012PEB3264-0HV1.4 (from hkin.com)Infineon09+MQFP6411800Kingrole Industry (Hongkong) Limited

Last record pdiusbd12:

Post DatePart NumberBrandD/CDescQtyCompany
Tue Jan 3 03:38:00 UTC 2012PDIUSBD12PW (from hkin.com)ST10+TSSOP9000Faishing Electronic Technology (HK) Limited
Tue Jan 3 03:38:00 UTC 2012PDIUSBD12PW (from hkin.com)NXP原PHI10+TSSOP-2810000Faishing Electronic Technology (HK) Limited
Mon Jan 9 02:22:00 UTC 2012PDIUSBD12PWTM (from hkin.com)2011+original new part12500Yilufa Electronics Inc
Mon Jan 16 08:17:00 UTC 2012PDIUSBD12PW (from hkin.com)PHILIPS1006TSOP15000HK Jiaweiyi Technology Limited
Thu Jan 5 06:20:00 UTC 2012PDIUSBD12PW (from hkin.com)PHILIPS1006new&original9500HK Jiaweiyi Technology Limited
Tue Jan 3 04:10:00 UTC 2012PDIUSBD12PW (from hkin.com)ST10+TSSOP9000Caymat Electronics Limited
Tue Jan 3 04:10:00 UTC 2012PDIUSBD12PW (from hkin.com)NXP原PHI10+TSSOP-2810000Caymat Electronics Limited
Sat Jan 14 02:37:00 UTC 2012PDIUSBD12PW (from hkin.com)NXP1125+TSSOP284500Konde Technology (HK) Company Limited
Thu Jan 12 02:32:00 UTC 2012PDIUSBD12D (from hkin.com)NXP10+SOP5000Hekeda Electronic Technology Co., Limited
Thu Jan 12 02:32:00 UTC 2012PDIUSBD12PW (from hkin.com)NXP10+TSSOP5000Hekeda Electronic Technology Co., Limited

If you want to find more about PIC18F1320-I/SO, please visit us on HKin


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PIC18F1320-I/SO,PIC18F1320-I/SO,Comments from user about PIC18F1320-I/SO: The MOSFET is particularly suited to this configuration because its positive thermal coefficient of resistance tends to balance current between individual devices. Competing projects would result in the IBM POWER and Sun SPARC architectures. These days analog circuitry may use digital or even microprocessor techniques to improve performance. Analog circuits use a continuous range of voltage as opposed to discrete levels as in digital circuits. The pipeline includes several different stages which are fundamental in microarchitecture designs. Digital circuits are the most common physical representation of Boolean algebra and are the basis of all digital computers. Used without qualifier, the term passive is ambiguous. There is an ever increasing need to keep product information updated and comparable, for the consumer to make an informed choice. Anything related to :PIC18F1320-I/SO, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: PIC18F1320-I/SO, search hkinventory: PIC18F1320-I/SO, In practice the dielectric between the plates passes a small amount of leakage current and also has an electric field strength limit, resulting in a breakdown voltage, while the conductors and leads introduce an undesired inductance and resistance. The MOSFET is the most used semiconductor device today. Semiconductor devices are manufactured both as single discrete devices and as integrated circuits (ICs), which consist of a numberfrom a few (as low as two) to billionsof devices manufactured and interconnected on a single semiconductor substrate. As of 2007, two 64-bit RISC architectures are still produced in volume for non-embedded applications: SPARC and Power ISA. Datasheet Dir, DataSheet Archive
These components overcame some limitations of the thyristors because they can be turned on or off with an applied signal. Affordable 8-bit microprocessors with 16-bit addressing also led to the first general-purpose microcomputers from the mid-1970s on. Circuit designers will sometimes refer to this class of components as dissipative, or thermodynamically passive. While different synthesis tools have different capabilities, there exists a common synthesizable subset of VHDL that defines what language constructs and idioms map into common hardware for many synthesis tools. With operating systems Windows XP x64, Windows Vista x64, Windows 7 x64, Linux, BSD and Mac OS X that run 64-bit native, the software is also geared to fully utilize the capabilities of such processors. The integrated circuit processor was produced in large numbers by highly automated processes, so unit cost was low. However, remember that the internal output impedance of operational amplifiers, if used, may rise markedly at high frequencies and reduce the attenuation from that expected. As microprocessor designs get faster, the cost of manufacturing a chip (with smaller components built on a semiconductor chip the same size) generally stays the same.
any passive component and active component such as:Diode, A problem not solved by this edition, however, was "multi-valued logic", where a signal's drive strength (none, weak or strong) and unknown values are also considered. The integrated circuit's mass production capability, reliability, and building-block approach to circuit design ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. Some common power devices are the power diode, thyristor, power MOSFET and IGBT. In electronics, a common-emitter amplifier is one of three basic single-stage bipolar-junction-transistor (BJT) amplifier topologies, typically used as a voltage amplifier. For example driver circuit
PIC18F1320-I/SO,PIC18F1320-I/SO,Comments from user about PIC18F1320-I/SO: These techniques use convection, conduction, & radiation of heat energy. The pipeline includes several different stages which are fundamental in microarchitecture designs. The complexity of an integrated circuit is bounded by physical limitations of the number of transistors that can be put onto one chip, the number of package terminations that can connect the processor to other parts of the system, the number of interconnections it is possible to make on the chip, and the heat that the chip can dissipate. Similarly, an overdriven transistor amplifier can take on the characteristics of a controlled switch having essentially two levels of output. Additional features were added to the processor architecture; more on-chip registers speeded up programs, and complex instructions could be used to make more compact programs. Different features can be implemented in different models of a product line at negligible production cost. This is the ratio of the electric charge on each conductor to the potential difference between them. Instead of processing all of a long word on one integrated circuit, multiple circuits in parallel processed subsets of each data word. Anything related to :PIC18F1320-I/SO, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: PIC18F1320-I/SOSee also: