Part: REG102NA-3.3/250

Index Files Offer Index 11 DALLAS, RENESAS, YAGEO, SHARP, INTERSIL, HIT, AVAGO, HARVATEK, KEMET, COOPER, MICREL, MOLEX, ISD/NUVOTON, TDK, JRC, ISSI, HYNIX, ATI, IDT, FUJITSU, COILCRAFT, BOURNS, LITTELFUSE, SEIKO, EUPEC, TE, ELPIDA, SONY, TRACO, MPS, POWER, EPCOS, SST, RECOM, ASTEC, CREE, SILICON, IC, EVERLIGHT, CIRRUS, ABB, QFN, BB, CJ(CHINA), EPSON, SIPEX, NXP/PHI, DIODES, ALLEGRO, AOS, IXYS, TI , FTDI, SPANSION, VICOR, JAE, JST, MXIC, CONEXANT, TI, AD, AUO, JAE, BB/TI, BOSCH, MINI, EUPEC, LGIT, ON SEMI SCG LTD, ZARLINK, BEL, ST, ALTERA, XILINX, NS, MAX, ATMEL, NXP, SAMSUNG, MICROCHIP, INTEL, CY, MURATA, FSC, PANASONIC, TOS, ON, INFINEON, AVX, IR, FUJI, MICRON, LINEAR, LATTICE, SEMIKRON, VISHAY, BRIGHT, 模块, FREESCALE, MIT, NVIDIA, MOT, SANYO, NEC, AMD, BROADCOM, ROHM, STMICROELECTRONICS, PHI, DALLAS, RENESAS, YAGEO, SHARP, QUALCOMM, HIT, HARVATEK, KEMET, AVAGO, COOPER, INTERSIL, MOLEX, MICREL, ISD/NUVOTON, TDK, ISSI, AGILENT, ATI, HYNIX, COILCRAFT, BOURNS, LITTELFUSE, FUJITSU, IDT, SEIKO, EUPEC, TE, ELPIDA, TRACO, CIRRUS, SONY, MPS, EPCOS, RECOM, SST, ASTEC, CREE, AUO, IC, SILICON, ABB, QFN, EVERLIGHT, CJ(CHINA), SIPEX, EPSON, NXP/PHI, DIODES, BB, AOS, POWER, ALLEGRO, IXYS, TI , FTDI, VICOR, JAE, JRC, JST, MXIC, TI, AD, ST, ALTERA, NS, XILINX, MAX, ATMEL, SAMSUNG, NXP, INTEL, MICROCHIP, CY, FSC, MURATA, TOS, PANASONIC, ON, INFINEON, IR, AVX, LINEAR, MICRON, NVIDIA, FUJI, LATTICE, VISHAY, SEMIKRON, FREESCALE, MOT, BRIGHT, AMD, 模块, NEC, PHI, BROADCOM, ROHM, SANYO, STMICROELECTRONICS, DALLAS, RENESAS, MIT, SHARP, YAGEO, QUALCOMM, HIT, HARVATEK, AVAGO, KEMET, INTERSIL, COOPER, MOLEX, MICREL, ATI, ISD/NUVOTON, TDK, FUJITSU, AGILENT, HYNIX, ISSI, IDT, COILCRAFT, EUPEC, BOURNS, LITTELFUSE, SEIKO, TE, ELPIDA, CIRRUS, TRACO, SONY, EPCOS, MPS, SST, RECOM, LAMBDA, BB, CREE, AUO, IC, SILICON, EVERLIGHT, QFN, CJ(CHINA), EPSON, SIPEX, DIODES, IXYS, NXP/PHI, BB/TI, ASTEC, ALLEGRO, SPANSION, AOS, POWER, CONEXANT, TI , FTDI, MXIC, VICOR, TI, AD, ST, ALTERA, XILINX, NS, ATMEL, MAX, NXP, INTEL, SAMSUNG, MICROCHIP, CY, FSC, MURATA, PANASONIC, TOS, ON, AVX, IR, INFINEON, VISHAY, LINEAR, NVIDIA, FUJI, LATTICE, MICRON, BRIGHT, AMD, FREESCALE, MOT, 模块, PHI, BROADCOM, NEC, SEMIKRON, ROHM, SANYO, STMICROELECTRONICS, DALLAS, RENESAS, SHARP, YAGEO, QUALCOMM, HIT, MIT, HARVATEK, KEMET, AVAGO, COOPER, MOLEX, INTERSIL, MICREL, ATI, ISD/NUVOTON, TDK, AGILENT, ISSI, BOURNS, HYNIX, COILCRAFT, IDT, LITTELFUSE, FUJITSU, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, TRACO, CIRRUS, MPS, SONY, EPCOS, RECOM, SST, LAMBDA, EPSON, AUO, CREE, IC, BB, SILICON, EVERLIGHT, QFN, CJ(CHINA), NXP/PHI, DIODES, SIPEX, STACKPOLE TECHNOLOGY, INC., ASTEC, BB/TI, MXIC, POWER, AOS, SPANSION, TI , ALLEGRO, FTDI, IXYS, REALTEK, VICOR, TI, AD, ST, ALTERA, ATMEL, XILINX, NS, MAX, NXP, INTEL, SAMSUNG, MICROCHIP, CY, FSC, TOS, MURATA, ON, PANASONIC, IR, AVX, VISHAY, INFINEON, LINEAR, FREESCALE, NVIDIA, FUJI, MICRON, LATTICE, AMD, BRIGHT, MOT, PHI, NEC, BROADCOM, SANYO, ROHM, SEMIKRON, STMICROELECTRONICS, RENESAS, DALLAS, SHARP, YAGEO, INTERSIL, QUALCOMM, HIT, MIT, HARVATEK, KEMET, AVAGO, MOLEX, MICREL, COOPER, ATI, ISD/NUVOTON, TDK, ISSI, AGILENT, HYNIX, IDT, BOURNS, COILCRAFT, FUJITSU, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, CIRRUS, TRACO, MPS, POWER, AOS, SST, EPCOS, SONY, DIP, EPSON, SIPEX, RECOM, 模块, LAMBDA, EUPEC, AUO, IC, BB, CREE, QFN, SILICON, EVERLIGHT, SPANSION, CJ(CHINA), DIODES, NXP/PHI, STACKPOLE TECHNOLOGY, INC., MXIC, ASTEC, BB/TI, WINBOND, ALLEGRO, TI , FTDI, TI, ST, AD, ALTERA, ATMEL, XILINX, NS, MAX, NXP, INTEL, SAMSUNG, MICROCHIP, CY, FSC, TOS, MURATA, ON, PANASONIC, VISHAY, INFINEON, AVX, FUJI, IR, MICRON, LINEAR, FREESCALE, NVIDIA, LATTICE, SEMIKRON, MOT, BRIGHT, AMD, NEC, PHI, SANYO, ROHM, BROADCOM, STMICROELECTRONICS, RENESAS, SHARP, DALLAS, YAGEO, INTERSIL, HIT, QUALCOMM, MIT, AVAGO, HARVATEK, KEMET, MOLEX, COOPER, MICREL, ATI, ISD/NUVOTON, ISSI, TDK, AGILENT, HYNIX, IDT, BOURNS, COILCRAFT, FUJITSU, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, CIRRUS, TRACO, MPS, AOS, EPCOS, POWER, DIP, LAMBDA, SIPEX, RECOM, 模块, EUPEC, BB/TI, SST, AUO, CREE, IC, EVERLIGHT, QFN, SILICON, ABB, RECTRON, EPSON, CJ(CHINA), DIODES, SONY, NXP/PHI, STACKPOLE TECHNOLOGY, INC., SPANSION, ASTEC, WINBOND, ALLEGRO, TI , CONEXANT, TI, ST, AD, ALTERA, ATMEL, XILINX, NS, MAX, NXP, INTEL, SAMSUNG, MICROCHIP, FSC, CY, TOS, MURATA, ON, PANASONIC, INFINEON, VISHAY, AVX, IR, FUJI, MICRON, LINEAR, FREESCALE, NVIDIA, SEMIKRON, LATTICE, MOT, NEC, AMD, BRIGHT, PHI, SANYO, ROHM, BROADCOM, RENESAS, STMICROELECTRONICS, DALLAS, SHARP, YAGEO, INTERSIL, HIT, QUALCOMM, MIT, AVAGO, KEMET, HARVATEK, MOLEX, COOPER, MICREL, ATI, ISD/NUVOTON, TDK, FUJITSU, ISSI, AGILENT, HYNIX, IDT, BOURNS, COILCRAFT, LITTELFUSE, SEIKO, KOA KAOHSIUNG CORPORATION, ELPIDA, EPCOS, TRACO, CIRRUS, MPS, POWER, LAMBDA, DIP, RECOM, 模块, EUPEC, SST, AUO, BB/TI, CREE, IC, SILICON, EVERLIGHT, QFN, ABB, SONY, EPSON, RECTRON, SIPEX, DIODES, CJ(CHINA), SPANSION, AOS, ALLEGRO, NXP/PHI, STACKPOLE TECHNOLOGY, INC., WINBOND, CONEXANT, ASTEC, MXIC, TI, ST, AD, ALTERA, ATMEL, NS, MAX, XILINX, NXP, INTEL, MICROCHIP, CY, SAMSUNG, FSC, TOS, MURATA, ON, PANASONIC, INFINEON, VISHAY, AVX, FUJI, IR, LINEAR, FREESCALE, NVIDIA, SEMIKRON, LATTICE, MICRON, MOT, NEC, AMD, BRIGHT, PHI, BROADCOM, ROHM, SANYO, STMICROELECTRONICS, DALLAS, RENESAS, SHARP, YAGEO, INTERSIL, HIT, QUALCOMM, AVAGO, MIT, KEMET, HARVATEK, MOLEX, COOPER, MICREL, ATI, ISD/NUVOTON, TDK, ISSI, AGILENT, FUJITSU, HYNIX, IDT, BOURNS, COILCRAFT, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, TRACO, CIRRUS, EPCOS, MPS, POWER, LAMBDA, DIP, RECOM, 模块, EUPEC, SST, AUO, BB/TI, CREE, IC, SILICON, EVERLIGHT, ABB, QFN, SONY, EPSON, RECTRON, SIPEX, CJ(CHINA), AOS, ALLEGRO, NXP/PHI, SPANSION, STACKPOLE TECHNOLOGY, INC., WINBOND, CONEXANT, ASTEC, REALTEK, TI , TI, ST, AD, ALTERA, ATMEL, NS, MAX, XILINX, NXP, INTEL, MICROCHIP, CY, SAMSUNG, FSC, TOS, MURATA, ON, PANASONIC, INFINEON, VISHAY, AVX, FUJI, IR, LINEAR, FREESCALE, NVIDIA, SEMIKRON, LATTICE, MICRON, MOT, NEC, AMD, BRIGHT, PHI, BROADCOM, ROHM, SANYO, STMICROELECTRONICS, DALLAS, RENESAS, SHARP, YAGEO, INTERSIL, HIT, QUALCOMM, AVAGO, MIT, KEMET, HARVATEK, ISSI, MOLEX, COOPER, MICREL, NUVOTON, ATI, ISD/NUVOTON, TDK, AGILENT, FUJITSU, HYNIX, IDT, BOURNS, COILCRAFT, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, TRACO, CIRRUS, EPCOS, MPS, POWER, LAMBDA, DIP, RECOM, 模块, EUPEC, WINBOND, SST, AUO, BB/TI, CREE, IC, SILICON, BCD, EVERLIGHT, ABB, QFN, SONY, EPSON, RECTRON, SIPEX, CJ(CHINA), AOS, ALLEGRO, NXP/PHI, SPANSION, STACKPOLE TECHNOLOGY, INC., CONEXANT, ASTEC, TI, ST, AD, ALTERA, ATMEL, NS, MAX, XILINX, NXP, INTEL, MICROCHIP, CY, SAMSUNG, FSC, MURATA, TOS, PANASONIC, ON, INFINEON, VISHAY, AVX, FUJI, IR, FREESCALE, LINEAR, NVIDIA, SEMIKRON, LATTICE, MICRON, MOT, AMD, BRIGHT, NEC, PHI, BROADCOM, ROHM, STMICROELECTRONICS, SANYO, DALLAS, SHARP, RENESAS, YAGEO, INTERSIL, HIT, QUALCOMM, MIT, KEMET, AVAGO, HARVATEK, ISSI, MOLEX, COOPER, MICREL, NUVOTON, ATI, ISD/NUVOTON, TDK, AGILENT, FUJITSU, IDT, HYNIX, BOURNS, COILCRAFT, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SEIKO, ELPIDA, TRACO, CIRRUS, EPCOS, MPS, LAMBDA, DIP, RECOM, 模块, EUPEC, WINBOND, SST, AUO, BB/TI, CREE, IC, SILICON, BCD, EVERLIGHT, ABB, QFN, EPSON, RECTRON, POWER, SONY, CJ(CHINA), AOS, NXP/PHI, SIPEX, SPANSION, STACKPOLE TECHNOLOGY, INC., ASTEC, ALLEGRO, TI , TI, AD, ST, ALTERA, ATMEL, NS, MAX, XILINX, NXP, INTEL, SAMSUNG, MICROCHIP, CY, FSC, MURATA, TOS, ON, PANASONIC, INFINEON, VISHAY, AVX, FUJI, IR, FREESCALE, LINEAR, NVIDIA, SEMIKRON, MICRON, LATTICE, AMD, MOT, BRIGHT, NEC, PHI, BROADCOM, ROHM, DALLAS, STMICROELECTRONICS, SANYO, ALLEGRO, SHARP, RENESAS, YAGEO, INTERSIL, HIT, QUALCOMM, MIT, KEMET, AVAGO, ISSI, HARVATEK, MOLEX, MICREL, COOPER, NUVOTON, ATI, ISD/NUVOTON, TDK, AGILENT, FUJITSU, HYNIX, IDT, BOURNS, COILCRAFT, LITTELFUSE, KOA KAOHSIUNG CORPORATION, INNOLUX, SEIKO, ELPIDA, TRACO, CIRRUS, EPCOS, MPS, SST, LAMBDA, DIP, RECOM, 模块, EUPEC, WINBOND, AUO, BB/TI, SILICON, CREE, IC, BB, BCD, EVERLIGHT, ABB, POWER, QFN, EPSON, RECTRON, SPANSION, SONY, CJ(CHINA), AOS, NXP/PHI, SIPEX, STACKPOLE TECHNOLOGY, INC., TI, AD, ST, MAX, ALTERA, ATMEL, NXP, NS, XILINX, INTEL, MICROCHIP, SAMSUNG, CY, FSC, ON, MURATA, TOS, PANASONIC, INFINEON, VISHAY, IR, AVX, FREESCALE, LINEAR, NVIDIA, LATTICE, MICRON, MOT, SEMIKRON, AMD, NEC, PHI, BROADCOM, ALLEGRO, ROHM, SANYO, DALLAS, FUJI, SHARP, STMICROELECTRONICS, COILCRAFT, RENESAS, YAGEO, INTERSIL, AVAGO, QUALCOMM, HIT, MIT, KEMET, ISSI, HARVATEK, SUMIDA, MOLEX, COOPER, MICREL, TDK, NUVOTON, ATI, ISD/NUVOTON, FUJITSU, HYNIX, AGILENT, IDT, BOURNS, LITTELFUSE, KOA KAOHSIUNG CORPORATION, TRACO, SEIKO, INNOLUX, BB, ELPIDA, CIRRUS, EPCOS, MPS, SST, SILICON, DIP, EUPEC, RECOM, 模块, POWER, WINBOND, AUO, BB/TI, CREE, IC, EVERLIGHT, BCD, SPANSION, EPSON, SONY, RECTRON, AOS, CJ(CHINA), QFN, SIPEX, NXP/PHI, STACKPOLE TECHNOLOGY, INC., COSEL, MXIC, TI, AD, ST, MAX, ALTERA, ATMEL, NXP, NS, XILINX, INTEL, MICROCHIP, CY, SAMSUNG, ON, FSC, MURATA, TOS, INFINEON, PANASONIC, VISHAY, IR, AVX, FREESCALE, LINEAR, NVIDIA, LATTICE, MICRON, MOT, AMD, SEMIKRON, NEC, PHI, BROADCOM, ALLEGRO, ROHM, SANYO, DALLAS, FUJI, SHARP, STMICROELECTRONICS, COILCRAFT, RENESAS, YAGEO, INTERSIL, AVAGO, HIT, QUALCOMM, MIT, ISSI, KEMET, HARVATEK, SUMIDA, MOLEX, COOPER, MICREL, TDK, NUVOTON, ATI, ISD/NUVOTON, FUJITSU, AGILENT, IDT, BOURNS, LITTELFUSE, HYNIX, KOA KAOHSIUNG CORPORATION, TRACO, BB, SEIKO, INNOLUX, CIRRUS, EPCOS, MPS, SST, SILICON, DIP, EUPEC, RECOM, 模块, POWER, WINBOND, TE CONNECTIVITY , AUO, BB/TI, CREE, IC, EVERLIGHT, BCD, SPANSION, SONY, EPSON, RECTRON, DIODES, AOS, CJ(CHINA), QFN, SIPEX, NXP/PHI, STACKPOLE TECHNOLOGY, INC., COSEL, TI, AD, MAX, ALTERA, ST, ATMEL, NXP, NS, MICROCHIP, XILINX, TOS, CY, ON, INFINEON, FSC, INTEL, MURATA, PANASONIC, IR, VISHAY, MICRON, SAMSUNG, AVX, FREESCALE, LINEAR, LATTICE, MOT, SEMIKRON, MIT, NEC, PHI, BROADCOM, ALLEGRO, DALLAS, COILCRAFT, AMD, ROHM, RENESAS, SHARP, FUJI, NVIDIA, STMICROELECTRONICS, YAGEO, AVAGO, INTERSIL, HIT, QUALCOMM, KEMET, HARVATEK, ISSI, SUMIDA, MOLEX, COOPER, MICREL, TDK, NUVOTON, SANYO, ISD/NUVOTON, AGILENT, FUJITSU, VICOR, IDT, BOURNS, LITTELFUSE, KOA KAOHSIUNG CORPORATION, TRACO, BB, SEIKO, INNOLUX, SONY, CIRRUS, EPCOS, MPS, SILICON, DIP, SST, 模块, POWER, TE CONNECTIVITY , BB/TI, AUO, WINBOND, IC, CREE, EVERLIGHT, ATI, EUPEC, BCD, SPANSION, EPSON, DIODES, AOS, CJ(CHINA), QFN, NXP/PHI, SIPEX, STACKPOLE TECHNOLOGY, INC., MIC, JST, MXIC, TI, AD, MAX, ST, ALTERA, NS, ATMEL, NXP, MICROCHIP, XILINX, TOS, CY, ON, INFINEON, INTEL, FSC, MURATA, PANASONIC, IR, VISHAY, MICRON, SAMSUNG, FREESCALE, AVX, LINEAR, LATTICE, MOT, SEMIKRON, PHI, NEC, RENESAS, MIT, BROADCOM, ALLEGRO, DALLAS, NVIDIA, ROHM, COILCRAFT, AMD, SHARP, FUJI, STMICROELECTRONICS, YAGEO, HIT, INTERSIL, AVAGO, QUALCOMM, ISSI, KEMET, HARVATEK, SUMIDA, MOLEX, MICREL, COOPER, SANYO, TDK, NUVOTON, BB, ISD/NUVOTON, FUJITSU, AGILENT, VICOR, IDT, BOURNS, LITTELFUSE, KOA KAOHSIUNG CORPORATION, SONY, TRACO, SEIKO, INNOLUX, CIRRUS, MPS, EPCOS, SST, SILICON, DIP, 模块, POWER, TE CONNECTIVITY , BB/TI, WINBOND, AUO, IC, CREE, EVERLIGHT, ATI, EUPEC, BCD, SPANSION, MIC, EPSON, DIODES, AOS, CJ(CHINA), QFN, SIPEX, NXP/PHI, STACKPOLE TECHNOLOGY, INC., HYNIX, MXIC, TI, AD, ST, MAX, NS, NXP, ALTERA, TOS, ATMEL, ON, MICROCHIP, INTEL, XILINX, INFINEON, VISHAY, CY, FSC, MURATA, PANASONIC, MICRON, SAMSUNG, IR, AVX, LINEAR, FREESCALE, LATTICE, MOT, AMD, PHI, SEMIKRON, NEC, NVIDIA, RENESAS, BROADCOM, ALLEGRO, ROHM, COILCRAFT, DALLAS, SHARP, AVAGO, YAGEO, HIT, INTERSIL, KEMET, HARVATEK, ISSI, MIT, SANYO, SUMIDA, MOLEX, COOPER, MICREL, QUALCOMM, NUVOTON, BB, ATI, ISD/NUVOTON, TDK, FUJI, FUJITSU, AGILENT, VICOR, BOURNS, EUPEC, LITTELFUSE, KOA KAOHSIUNG CORPORATION, MCP, TRACO, IDT, SEIKO, SONY, INNOLUX, EPCOS, MPS, CIRRUS, SST, SILICON, DIP, RECOM, 模块, POWER, TE CONNECTIVITY , BB/TI, AUO, IC, EVERLIGHT, SPANSION, WINBOND, CREE, MIC, BCD, DIODES, AOS, CJ(CHINA), QFN, NXP/PHI, AT, EPSON, STACKPOLE TECHNOLOGY, INC., MXIC, TI, AD, ST, MAX, NS, NXP, ALTERA, TOS, ATMEL, FSC, ON, MICROCHIP, INTEL, XILINX, INFINEON, VISHAY, CY, MURATA, PANASONIC, MICRON, SAMSUNG, IR, AVX, FREESCALE, LINEAR, AMD, LATTICE, MOT, PHI, SEMIKRON, NEC, NVIDIA, RENESAS, BROADCOM, ALLEGRO, ROHM, COILCRAFT, DALLAS, SHARP, AVAGO, YAGEO, FUJI, HIT, HARVATEK, ISSI, KEMET, MIT, SANYO, INTERSIL, MOLEX, SUMIDA, COOPER, MICREL, QUALCOMM, NUVOTON, BB, ATI, ISD/NUVOTON, TDK, FUJITSU, AGILENT, VICOR, BOURNS, EUPEC, LITTELFUSE, KOA KAOHSIUNG CORPORATION, MCP, SONY, TRACO, IDT, SEIKO, INNOLUX, EPCOS, MPS, CIRRUS, SST, SPANSION, DIP, SILICON, RECOM, 模块, TE CONNECTIVITY , WINBOND, BB/TI, AUO, IC, EVERLIGHT, BCD, CREE, MIC, POWER, DIODES, AOS, HYNIX, CJ(CHINA), QFN, NXP/PHI, AT, EPSON, STACKPOLE TECHNOLOGY, INC., TI, AD, ST, MAX, NS, NXP, ALTERA, ATMEL, FSC, MICROCHIP, ON, TOS, INTEL, XILINX, INFINEON, CY, VISHAY, MURATA, PANASONIC, MICRON, SAMSUNG, IR, AVX, FREESCALE, LINEAR, MOT, LATTICE, AMD, SEMIKRON, PHI, NEC, IXYS, BROADCOM, ALLEGRO, ROHM, RENESAS, COILCRAFT, AVAGO, DALLAS, SHARP, NVIDIA, YAGEO, FUJI, HIT, 模块, SANYO, HARVATEK, ISSI, KEMET, MIT, INTERSIL, MOLEX, SUMIDA, ATI, COOPER, QUALCOMM, MICREL, NUVOTON, POWER, TDK, BB, ISD/NUVOTON, VICOR, EUPEC, IDT, BOURNS, LITTELFUSE, FUJITSU, SONY, TRACO, KOA KAOHSIUNG CORPORATION, MCP, SEIKO, EPCOS, MPS, SST, SPANSION, SILICON, RECOM, MURATA PS, WINBOND, TE CONNECTIVITY , INNOLUX, BB/TI, EVERLIGHT, IC, BCD, CREE, MIC, CIRRUS, DIODES, AT, QFN, AOS, NXP/PHI, EPSON, STACKPOLE TECHNOLOGY, INC., JST, REALTEK, MXIC, TI, AD, ST, MAX, NS, NXP, ALTERA, ATMEL, FSC, MICROCHIP, ON, TOS, INTEL, XILINX, INFINEON, CY, VISHAY, MURATA, PANASONIC, MICRON, SAMSUNG, IR, AVX, FREESCALE, LINEAR, MOT, SEMIKRON, LATTICE, AMD, PHI, NEC, IXYS, BROADCOM, ALLEGRO, ROHM, RENESAS, AVAGO, COILCRAFT, DALLAS, SHARP, NVIDIA, YAGEO, FUJI, HIT, 模块, MIT, SANYO, HARVATEK, ISSI, KEMET, INTERSIL, MOLEX, SUMIDA, ATI, COOPER, QUALCOMM, MICREL, NUVOTON, POWER, TDK, BB, ISD/NUVOTON, VICOR, EUPEC, IDT, BOURNS, FUJITSU, LITTELFUSE, SONY, TRACO, KOA KAOHSIUNG CORPORATION, MCP, SEIKO, EPCOS, MPS, SST, SPANSION, SILICON, RECOM, MURATA PS, WINBOND, TE CONNECTIVITY , INNOLUX, BB/TI, EVERLIGHT, IC, BCD, CREE, MIC, CIRRUS, DIODES, AT, QFN, AOS, NXP/PHI, EPSON, STACKPOLE TECHNOLOGY, INC., JST, REALTEK, MXIC, TI, AD, ST, MAX, NS, NXP, FSC, MICROCHIP, ATMEL, ALTERA, ON, XILINX, TOS, INFINEON, CY, INTEL, VISHAY, MURATA, MICRON, PANASONIC, SAMSUNG, AVX, IR, FREESCALE, LINEAR, MOT, NEC, SEMIKRON, LATTICE, AMD, ALLEGRO, PHI, BROADCOM, HIT, ROHM, RENESAS, AVAGO, DALLAS, SHARP, YAGEO, FUJI, IXYS, SUMIDA, 模块, MIT, HARVATEK, SANYO, KEMET, MOLEX, COOPER, QUALCOMM, MICREL, NUVOTON, BB, ISD/NUVOTON, TDK, NVIDIA, VICOR, INTERSIL, EUPEC, COILCRAFT, BOURNS, FUJITSU, LITTELFUSE, SONY, TRACO, MCP, SEIKO, IDT, POWER, EPCOS, ATI, ISSI, MPS, SILICON, RECOM, SPANSION, TE CONNECTIVITY , VISHAY DALE, WINBOND, INNOLUX, BB/TI, EVERLIGHT, IC, SST, CREE, BCD, MIC, DIODES, CIRRUS, AT, QFN, AOS, EPSON, JST, AUO, HYNIX, TI , JAE, WCH, TI, AD, ST, MAX, NS, NXP, FSC, MICROCHIP, ATMEL, ALTERA, ON, XILINX, TOS, INFINEON, CY, INTEL, VISHAY, MURATA, MICRON, PANASONIC, SAMSUNG, AVX, IR, FREESCALE, MOT, LINEAR, NEC, SEMIKRON, LATTICE, AMD, ALLEGRO, PHI, BROADCOM, HIT, ROHM, RENESAS, AVAGO, DALLAS, RECOM, SHARP, YAGEO, FUJI, IXYS, SUMIDA, 模块, MIT, HARVATEK, SANYO, KEMET, MOLEX, COOPER, QUALCOMM, MICREL, NUVOTON, BB, ISD/NUVOTON, TDK, NVIDIA, TRACO, VICOR, INTERSIL, EUPEC, COILCRAFT, BOURNS, FUJITSU, LITTELFUSE, SONY, MCP, SEIKO, IDT, POWER, EPCOS, ATI, ISSI, MPS, SILICON, SPANSION, TE CONNECTIVITY , VISHAY DALE, WINBOND, INNOLUX, BB/TI, EVERLIGHT, IC, SST, CREE, BCD, MIC, DIODES, CIRRUS, AT, QFN, AOS, EPSON, JST, AUO, HYNIX, TI , JAE, WCH, TI, AD, ST, MAX, NS, NXP, MICROCHIP, FSC, ATMEL, ALTERA, ON, XILINX, TOS, CY, INTEL, INFINEON, VISHAY, MURATA, MICRON, PANASONIC, SAMSUNG, AVX, FREESCALE, IR, LINEAR, MOT, LATTICE, NEC, AMD, ALLEGRO, PHI, SEMIKRON, HIT, BROADCOM, ROHM, RENESAS, DALLAS, RECOM, AVAGO, SHARP, 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VISHAY DALE, BB/TI, SPANSION, SST, AT, IC, CREE, REALTEK, STMICROELECTRONICS, EUPEC, POWER, SONY, CIRRUS, QFN, NXP/PHI, AOS, DIODES, BOSCH, HYNIX, EPSON, TI , WCH, ASTEC, TI, AD, ST, MAX, NXP, NS, XILINX, ALTERA, TOS, ATMEL, IR, ON, FSC, MICROCHIP, INFINEON, MURATA, CY, INTEL, MICRON, SAMSUNG, VISHAY, SEMIKRON, AVX, PANASONIC, MIT, LINEAR, MOT, SHARP, NEC, LATTICE, PHI, ROHM, FREESCALE, BROADCOM, AVAGO, FUJI, DALLAS, HIT, RECOM, YAGEO, RENESAS, WURTH, AMD, IXYS, SUMIDA, 模块, HARVATEK, KEMET, NVIDIA, MICREL, SANYO, IDT, COOPER, INTERSIL, QUALCOMM, TDK, ISD/NUVOTON, TRACO, ISSI, BOURNS, COILCRAFT, FUJITSU, LITTELFUSE, SEIKO, SILICON, JRC, MIC, ATI, MPS, EVERLIGHT, MOLEX, EPCOS, VICOR, ALLEGRO, AUO, VISHAY DALE, BB/TI, IC, SST, CREE, POWER, REALTEK, SPANSION, STMICROELECTRONICS, EUPEC, SONY, QFN, CIRRUS, NXP/PHI, AOS, DIODES, BOSCH, HYNIX, TI , EPSON, WCH, ASTEC, JAE, BB, EXAR(SIPEX), TI, AD, ST, XILINX, MAX, NXP, NS, ALTERA, ATMEL, TOS, ON, IR, FSC, MICROCHIP, INFINEON, MURATA, INTEL, CY, MICRON, SAMSUNG, VISHAY, SEMIKRON, AVX, PANASONIC, MIT, LINEAR, NEC, MOT, SHARP, LATTICE, PHI, ROHM, FREESCALE, ALLEGRO, BROADCOM, AVAGO, FUJI, HIT, DALLAS, RECOM, RENESAS, YAGEO, WURTH, AMD, IXYS, SUMIDA, 模块, HARVATEK, KEMET, NVIDIA, IDT, MICREL, SANYO, INTERSIL, COOPER, TDK, QUALCOMM, ISD/NUVOTON, TRACO, ISSI, BOURNS, COILCRAFT, FUJITSU, LITTELFUSE, SEIKO, MIC, SILICON, JRC, ATI, MPS, EVERLIGHT, EPCOS, MOLEX, VICOR, AUO, SPANSION, VISHAY DALE, BB/TI, REALTEK, SST, IC, CREE, EUPEC, HYNIX, POWER, SONY, STMICROELECTRONICS, CIRRUS, QFN, DIODES, NXP/PHI, AOS, BOSCH, EPSON, TI , WCH, ASTEC, WINBOND, JAE, BB, TI

Google Search Product Summary TI/BB REG102NA-3.3/250 This is an offer provided by HKin.com member. In stock! Order now! Category: Electronic Components. Product #: REG102NA-3.3/250. Available from: Hongkong Truly Electronics Tech Co.,Ltd Condition: in excellent condition In stock! Order now! Part Numbers Previous Parts:7MBR50NF-060, KPT-1608QWF-D-5MAV-1NV, RC0100FR-0715K8L, RC0100JR-07560RL, MC1404, TOP222, TAJD477K010RNJ, 1432, AD8367ARUZ, RB521S-40, 2N70, MC33092ADW, MT48LC2M32B2P-6, LMS1587CS-1.5, TS5A23157, PT2258-S (+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: REG102NA-3.3/250": Post Date Part Number Brand D/C Desc Qty Company Tue Apr 16 03:28:00 UTC 2013 REG102NA-3.3/250G4 (from standard server 2) TI/BB 09+ SOT-153 4213 Hongkong Truly Electronics Tech Co.,Ltd Tue Apr 16 03:28:00 UTC 2013 REG102NA-3.3/250G4 (from parts server 2) TI/BB 09+ SOT-153 4213 Hongkong Truly Electronics Tech Co.,Ltd Tue Apr 16 03:28:00 UTC 2013 REG102NA-3.3/250G4 (from hkin.com 2) TI/BB 09+ SOT-153 4213 Hongkong Truly Electronics Tech Co.,Ltd Tue Apr 16 03:28:00 UTC 2013 REG102NA-3.3/250G4 (from hkin.com 2) TI/BB 09+ SOT-153 4213 Hongkong Truly Electronics Tech Co.,Ltd Last record PT2258-S: Post Date Part Number Brand D/C Desc Qty Company Last record TS5A23157: Post Date Part Number Brand D/C Desc Qty Company Last record LMS1587CS-1.5: Post Date Part Number Brand D/C Desc Qty Company If you want to find more about REG102NA-3.3/250, please visit us on HKin vid:offerengine20130517 Part Number Prefix REG102NA-3.3/250,REG102NA-3.3/250,Comments from user about REG102NA-3.3/250: For example, GPUs through the 1990s were mostly non-programmable and have only recently gained limited facilities like programmable vertex shaders. Another benefit is that VHDL allows the description of a concurrent system. Key changes include incorporation of child standards (1164, 1076.2, 1076.3) into the main 1076 standard, an extended set of operators, more flexible syntax of case and generate statements, incorporation of VHPI (interface to C/C++ languages) and a subset of PSL (Property Specification Language). An electronic circuit consisting entirely of passive components is called a passive circuit (and has the same properties as a passive component). IEEE standard 1076. The complexity of an integrated circuit is bounded by physical limitations of the number of transistors that can be put onto one chip, the number of package terminations that can connect the processor to other parts of the system, the number of interconnections it is possible to make on the chip, and the heat that the chip can dissipate. Common-emitter amplifiers are also used in radio frequency circuits, for example to amplify faint signals received by an antenna. Such data storage can be used for storage of state, and such a circuit is described as sequential logic. Anything related to :REG102NA-3.3/250, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: REG102NA-3.3/250, search hkinventory: REG102NA-3.3/250, In electronics, a common-emitter amplifier is one of three basic single-stage bipolar-junction-transistor (BJT) amplifier topologies, typically used as a voltage amplifier. Semiconductor conductivity can be controlled by introduction of an electric or magnetic field, by exposure to light or heat, or by mechanical deformation of a doped monocrystalline grid; thus, semiconductors can make excellent sensors. Unlike a fuse, which operates once and then has to be replaced, a circuit breaker can be reset (either manually or automatically) to resume normal operation. The IGBT is a recent component, so its performance improves regularly as technology evolves. Datasheet Dir, DataSheet Archive With this structure, one of the connections of the device is located on the bottom of the semiconductor die. A single operation code might affect many individual data paths, registers, and other elements of the processor. Digital Signal Processors are another example. IEEE standard 1076. Computers, cellular phones, and other digital appliances are now inextricable parts of the structure of modern societies, made possible by the low cost of production of integrated circuits. An LED is often small in area (less than 1 mm2), and integrated optical components may be used to shape its radiation pattern. Execution units are also essential to microarchitecture. Additional features were added to the processor architecture; more on-chip registers speeded up programs, and complex instructions could be used to make more compact programs. any passive component and active component such as:1N4148, or 6502 With AMD's introduction of a 64-bit architecture backwards-compatible with x86, x86-64 (also called AMD64), in September 2003, followed by Intel's near fully compatible 64-bit extensions (first called IA-32e or EM64T, later renamed Intel 64), the 64-bit desktop era began. The logic section retrieves instruction operation codes from memory, and iniates whatever sequence of operations of the ALU required to carry out the instruction. The gate electrode is charged to produce an electric field that controls the conductivity of a "channel" between two terminals, called the source and drain. Input and output impedance requirements. For example driver circuit REG102NA-3.3/250,REG102NA-3.3/250,Comments from user about REG102NA-3.3/250: Most analog electronic appliances, such as radio receivers, are constructed from combinations of a few types of basic circuits. Performance is high because the components switch quickly and consume little power (compared to their discrete counterparts) as a result of the small size and close proximity of the components.Solid-state electronics are those circuits or devices built entirely from solid materials and in which the electrons, or other charge carriers, are confined entirely within the solid material. This effectively multiplies the processor's potential performance by the number of cores (as long as the operating system and software is designed to take advantage of more than one processor core). The transistor's low cost, flexibility, and reliability have made it a ubiquitous device. In principle, a single microarchitecture could execute several different ISAs with only minor changes to the microcode. In the case of narrow-band bandpass filters, the Q determines the -3dB bandwidth but also the degree of rejection of frequencies far removed from the center frequency; if these two requirements are in conflict then a staggered-tuning bandpass filter may be needed. This collection of simulation models is commonly called a testbench. Anything related to :REG102NA-3.3/250, or electronic components and electronic component distributors such as:fairchild,avx capacitor, or electronics part index in: REG102NA-3.3/250See also: Capacitor Transistor Diode