Part: OKY-T/3-D12N-C

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Product Summary
MURATA PS OKY-T/3-D12N-C
This is an offer provided by HKin.com member.
In stock! Order now!
Category: Electronic Components.
Product #: OKY-T/3-D12N-C.


Available from: BCT TECHNOLOGY (HK) CO., LTD
Condition: in excellent condition
In stock! Order now!

Part Numbers

Previous Parts:MX8318MC, N80960SB16, N87C196CB, NE5511279-T1-AZ, NH82801ER, NH82801IR, NJM2591V-TE1, NL2432HC22-25E, NL6448BC33, NM9835CV, NML0505SC, NT5TU32M16BG-3C, NT7261B/C, NUC100LD1AN, OB2203CP, OB2268CCPA

(+HKin.com) :) The followings are offers provided by our member in Electronic Components Offer site about the following parts: OKY-T/3-D12N-C":

Post DatePart NumberBrandD/CDescQtyCompany
Sun Jan 15 02:51:00 UTC 2012OKY-T/3-D12N-C (from hkin.com)MURATA PSDC/DC CONVERTER1357BCT TECHNOLOGY (HK) CO., LTD
Sun Jan 15 02:51:00 UTC 2012OKY-T/3-D12N-C (from standard server 2)MURATA PSDC/DC CONVERTER1357BCT TECHNOLOGY (HK) CO., LTD
Sun Jan 15 02:51:00 UTC 2012OKY-T/3-D12N-C (from parts server 2)MURATA PSDC/DC CONVERTER1357BCT TECHNOLOGY (HK) CO., LTD
Sun Jan 15 02:51:00 UTC 2012OKY-T/3-D12N-C (from hkin.com 2)MURATA PSDC/DC CONVERTER1357BCT TECHNOLOGY (HK) CO., LTD
Sun Jan 15 02:51:00 UTC 2012OKY-T/3-D12N-C (from hkin.com 2)MURATA PSDC/DC CONVERTER1357BCT TECHNOLOGY (HK) CO., LTD

Last record OB2268CCPA:

Post DatePart NumberBrandD/CDescQtyCompany
Wed Jan 11 04:25:00 UTC 2012OB2268CCPA (from hkin.com)10+SOP-8On-Bright2500Sun Cyber Hong Kong Company Limited

Last record OB2203CP:

Post DatePart NumberBrandD/CDescQtyCompany
Wed Jan 11 04:25:00 UTC 2012OB2203CP (from hkin.com)10+SOP-8On-Bright2500Sun Cyber Hong Kong Company Limited

Last record NUC100LD1AN:

Post DatePart NumberBrandD/CDescQtyCompany
Sun Jan 15 03:26:00 UTC 2012NUC100LD1AN (from hkin.com)NUVOTON2011LQFP10Hengsen Technology (HK) Company Limited

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OKY-T/3-D12N-C,OKY-T/3-D12N-C,Comments from user about OKY-T/3-D12N-C: The integration of large numbers of tiny transistors into a small chip was an enormous improvement over the manual assembly of circuits using electronic components. The junctions which form where n-type and p-type semiconductors join together are called p-n junctions. Key changes include incorporation of child standards (1164, 1076.2, 1076.3) into the main 1076 standard, an extended set of operators, more flexible syntax of case and generate statements, incorporation of VHPI (interface to C/C++ languages) and a subset of PSL (Property Specification Language). These diagrams generally separate the datapath (where data is placed) and the control path (which can be said to steer the data). Basically, an IGBT is a bipolar transistor driven by a power MOSFET: it has the advantages of being a minority carrier device (good performance in on-state, even for high voltage devices), with the high input impedance of a MOSFET (it can be driven on or off with a very low amount of power). The VHDL standard IEEE 1076-2008 was published in January 2009. High-pass filters ?attenuation of frequencies below their cut-off points.0 of VHDL-2006. Anything related to :OKY-T/3-D12N-C, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: OKY-T/3-D12N-C, search hkinventory: OKY-T/3-D12N-C, Machines with different microarchitectures may have the same instruction set architecture, and thus be capable of executing the same programs. The size, latency, throughput and connectivity of memories within the system are also microarchitectural decisions. The vast majority of the discrete (i.e non integrated) power devices are built using a vertical structure, whereas small-signal devices employ a lateral structure. Bipolar junction transistors are formed from two p-n junctions, in either n-p-n or p-n-p configuration. Datasheet Dir, DataSheet Archive
For example, most constructs that explicitly deal with timing such as wait for 10 ns; are not synthesizable despite being valid for simulation. The microarchitecture of a machine is usually represented as (more or less detailed) diagrams that describe the interconnections of the various microarchitectural elements of the machine, which may be everything from single gates and registers, to complete arithmetic logic units (ALU)s and even larger elements. These techniques use convection, conduction, & radiation of heat energy. With this structure, one of the connections of the device is located on the bottom of the semiconductor die. The choice of the number of execution units, their latency and throughput is a central microarchitectural design task. The large number of discrete logic gates used more electrical powerXand therefore, produced more heatXthan a more integrated design with fewer ICs., followed soon after. The MOSFET is the most used semiconductor device today.
any passive component and active component such as:Diode, This collection of simulation models is commonly called a testbench. The integrated circuit's mass production capability, reliability, and building-block approach to circuit design ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. In practice the dielectric between the plates passes a small amount of leakage current and also has an electric field strength limit, resulting in a breakdown voltage, while the conductors and leads introduce an undesired inductance and resistance. One barrier to achieving higher performance through instruction-level parallelism stems from pipeline stalls and flushes due to branches. For example driver circuit
OKY-T/3-D12N-C,OKY-T/3-D12N-C,Comments from user about OKY-T/3-D12N-C: A digital signal processor (DSP) is specialized for signal processing. The trade-off between voltage, current and frequency ratings also exists for the switches. Techniques such as branch prediction and speculative execution are used to lessen these branch penalties. The choice of the number of execution units, their latency and throughput is a central microarchitectural design task. Increasingly stringent pollution control standards effectively require automobile manufacturers to use microprocessor engine management systems, to allow optimal control of emissions over widely-varying operating conditions of an automobile. Microprocessor control of a system can provide control strategies that would be impractical to implement using electromechanical controls or purpose-built electronic controls. Most power semiconductor devices are only used in commutation mode (i.e they are either on or off), and are therefore optimized for this. Computers, electronic clocks, and programmable logic controllers (used to control industrial processes) are constructed of digital circuits. Anything related to :OKY-T/3-D12N-C, or electronic components and electronic component distributors such as:fairchild,avx capacitor,6502, or electronics part index in: OKY-T/3-D12N-CSee also: